Patents by Inventor Olga L. Renovales

Olga L. Renovales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7818855
    Abstract: Methods of making thin film capacitors formed on foil by forming onto a thin film dielectric in a single deposition event an integrally complete top electrode having a minimum thickness of at least 1 micron.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: October 26, 2010
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: William Borland, Cengiz Ahmet Palanduz, Olga L. Renovales
  • Patent number: 7688569
    Abstract: Dielectric powder and thick-film paste compositions are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. Conductive powder and paste compositions are formed having desirable electrical and physical properties. The dielectric powder and thick-film paste compositions can be used in combination with the conductive powder and paste compositions to form capacitors and other fired-on-foil passive circuit components.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: March 30, 2010
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: William J. Borland, Alton Bruce Jones, III, Olga L. Renovales, Kenneth Warren Hang
  • Publication number: 20080112110
    Abstract: Methods of making thin film capacitors formed on foil by forming onto a thin film dielectric in a single deposition event an integrally complete top electrode having a minimum thickness of at least 1 micron.
    Type: Application
    Filed: October 8, 2007
    Publication date: May 15, 2008
    Applicant: E.I. DUPONT DE NEMOURS AND COMPANY
    Inventors: William Borland, Cengiz Ahmet Palanduz, Olga L. Renovales