Patents by Inventor Oliver BREITWIESER
Oliver BREITWIESER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10436817Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.Type: GrantFiled: February 10, 2017Date of Patent: October 8, 2019Assignee: TDK-Micronas GmbHInventors: Timo Kaufmann, Klaus Heberle, Joerg Franke, Oliver Breitwieser
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Patent number: 10165686Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.Type: GrantFiled: July 29, 2015Date of Patent: December 25, 2018Assignee: TDK-Micronas GmbHInventors: Joerg Franke, Klaus Heberle, Oliver Breitwieser, Timo Kaufmann
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Publication number: 20170227578Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.Type: ApplicationFiled: February 10, 2017Publication date: August 10, 2017Applicant: TDK-Micronas GmbHInventors: Timo KAUFMANN, Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER
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Patent number: 9718224Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.Type: GrantFiled: August 26, 2015Date of Patent: August 1, 2017Assignee: TDK-Micronas GmbHInventors: Joerg Franke, Timo Kaufmann, Oliver Breitwieser, Klaus Heberle
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Patent number: 9645203Abstract: A magnetic field measuring device includes a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having two magnetic field sensors, spaced a distance apart on the surface, and the magnetic field sensors each measuring one z component of a magnetic field. A first magnet has a planar main extension surface formed in a second x-y plane, the direction of magnetization changing from a north pole to a south pole along the main extension surface on a symmetry surface of the magnet. One of the two magnetic field sensors being disposed in the vicinity of the north pole and the other of the two magnetic field sensors being situated in the vicinity of the south pole, so that signals having opposite polarities with respect to each other are formed in a z component of the magnetic field.Type: GrantFiled: August 3, 2015Date of Patent: May 9, 2017Assignee: Micronas GmbHInventors: Timo Kaufmann, Klaus Heberle, Joerg Franke, Oliver Breitwieser
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Patent number: 9513343Abstract: A measuring system having a magnetic device for generating a magnetic field and having a magnetic field sensor for detecting a flux density of the magnetic field at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device has at least two main poles for generating a main magnetic field and at least two secondary poles for generating a secondary magnetic field. The magnetic field in the magnetic field sensor is formed by superposition of the main magnetic field and the secondary magnetic field. The magnetic field sensor is designed to measure the flux density of the superposition in the first spatial direction, and, in the magnetic field sensor, the secondary magnetic field compensates at least partially the main magnetic field in the first spatial direction.Type: GrantFiled: May 8, 2014Date of Patent: December 6, 2016Assignee: Micronas GmbHInventors: Klaus Heberle, Joerg Franke, Oliver Breitwieser, Timo Kaufmann
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Patent number: 9442169Abstract: A measuring system, having a magnetic device for generating a magnetic field and having a magnetic field sensor with a sensor surface for detecting a flux density of the magnetic field penetrating the sensor surface at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device can have at least one permanent magnet and a flux concentrator made of a ferromagnetic material. The permanent magnet has at least two pole surfaces and an outer surface. The flux concentrator can have a smaller dimensions than the outer surface of the permanent magnet. The flux concentrator can be positioned within the outer surface of the permanent magnet and the flux concentrator and the permanent magnet can have a magnetic force closure.Type: GrantFiled: May 8, 2014Date of Patent: September 13, 2016Assignee: Micronas GmbHInventors: Klaus Heberle, Joerg Franke, Oliver Breitwieser, Timo Kaufmann
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Publication number: 20160061634Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.Type: ApplicationFiled: August 26, 2015Publication date: March 3, 2016Applicant: MICRONAS GMBHInventors: Joerg FRANKE, Timo KAUFMANN, Oliver BREITWIESER, Klaus HEBERLE
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Publication number: 20160037641Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.Type: ApplicationFiled: July 29, 2015Publication date: February 4, 2016Applicant: MICRONAS GMBHInventors: Joerg FRANKE, Klaus HEBERLE, Oliver BREITWIESER, Timo KAUFMANN
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Publication number: 20160033587Abstract: A magnetic field measuring device includes a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having two magnetic field sensors, spaced a distance apart on the surface, and the magnetic field sensors each measuring one z component of a magnetic field. A first magnet has a planar main extension surface formed in a second x-y plane, the direction of magnetization changing from a north pole to a south pole along the main extension surface on a symmetry surface of the magnet. One of the two magnetic field sensors being disposed in the vicinity of the north pole and the other of the two magnetic field sensors being situated in the vicinity of the south pole, so that signals having opposite polarities with respect to each other are formed in a z component of the magnetic field.Type: ApplicationFiled: August 3, 2015Publication date: February 4, 2016Applicant: MICRONAS GMBHInventors: Timo KAUFMANN, Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER
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Publication number: 20140333299Abstract: A measuring system, having a magnetic device for generating a magnetic field and having a magnetic field sensor with a sensor surface for detecting a flux density of the magnetic field penetrating the sensor surface at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device can have at least one permanent magnet and a flux concentrator made of a ferromagnetic material. The permanent magnet has at least two pole surfaces and an outer surface. The flux concentrator can have a smaller dimensions than the outer surface of the permanent magnet. The flux concentrator can be positioned within the outer surface of the permanent magnet and the flux concentrator and the permanent magnet can have a magnetic force closure.Type: ApplicationFiled: May 8, 2014Publication date: November 13, 2014Applicant: Micronas GmbHInventors: Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER, Timo KAUFMANN
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Publication number: 20140333298Abstract: A measuring system having a magnetic device for generating a magnetic field and having a magnetic field sensor for detecting a flux density of the magnetic field at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device has at least two main poles for generating a main magnetic field and at least two secondary poles for generating a secondary magnetic field. The magnetic field in the magnetic field sensor is formed by superposition of the main magnetic field and the secondary magnetic field. The magnetic field sensor is designed to measure the flux density of the superposition in the first spatial direction, and, in the magnetic field sensor, the secondary magnetic field compensates at least partially the main magnetic field in the first spatial direction.Type: ApplicationFiled: May 8, 2014Publication date: November 13, 2014Applicant: Micronas GmbHInventors: Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER, Timo KAUFMANN