Abstract: A measurement module for measuring particularly the surface of wafers is described, which comprises a measuring device and a measuring table that has a wafer table equipped with a rotary drive. The design of this measurement module should be as compact as possible. To this end, the wafer table (10) is cup-shaped with at least one support edge (13, 14) for a wafer (4, 4a, 4b), which is provided with an adhesive material. A wafer aligning device (30) is arranged in the interior of the wafer table (10). A displaceable measuring head (7) in which a measuring device and a notch detector are integrated is disposed above the wafer table.

Abstract: Normally, repeated calibration measurements are necessary for the adjustment of the sample and ellipsometer. To achieve an automatic relative adjustment, a sample position detection system that can be adjusted in relation to the ellipsometer and locked in is assigned to the ellipsometer, and where the detection system is connected to an adjusting system that affects the sample table and/or the entire system detection system/ellipsometer. The method for automatic relative adjustment is provided for, that by initially using one sample, the system sample/ellipsometer is adjusted via the symmetry of the detector signal of the ellipsometer, and that the sample position detection system is adjusted and subsequently locked in with the ellipsometer. With all subsequent samples, a relative adjustment of sample and ellipsometer detection system is performed using the signals of the detection system.