Patents by Inventor Oliver Hassa

Oliver Hassa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding two wafers
    Patent number: 6127243
    Abstract: The invention relates to a method for bonding two wafers, in which the wafers are placed over one another in such a way that a first surface of one wafer lies over a first surface of the other wafer. Trenches are introduced into at least one of the first surfaces. The trenches run in the plane of the surfaces. The wafers lying one on top of the other are then subjected to a heat treatment in an oxidizing atmosphere.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: October 3, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Werner, Jenoe Tihanyi, Oliver Hassa