Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.

Abstract: A modular smart packaging case comprising reversibly attachable electronics and detection modules is disclosed. The detection module includes a sensor array for monitoring the state of a blister pack containing a plurality of product units. The electronics module contains the high-value electronics required to read the sensors of the array, process the sensor output, and enable communications to and from the case. The electronics module and detection module are operatively coupled via a universal interface that enables the same electronics module to operate with a plurality of detection modules of different configurations. In some embodiments, the electronics module operatively couples with multiple detection modules.