Patents by Inventor Oliver Kierse

Oliver Kierse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210183790
    Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.
    Type: Application
    Filed: November 18, 2020
    Publication date: June 17, 2021
    Inventors: Ramji Sitaraman Lakshmanan, Bernard Stenson, Padraig Liam Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn, Laurence Brendan O'Sullivan
  • Patent number: 8766186
    Abstract: A control aperture for an IR sensor includes a die; an IR sensor disposed on the die and an IR opaque aperture layer on the die having an IR transmissive aperture aligned with the IR sensor for controlling the field of view and focus of the IR sensor.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: July 1, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Oliver Kierse, Eamon Hynes
  • Patent number: 8476591
    Abstract: A radiation sensor device including an integrated circuit chip including a radiation sensor on a surface of the integrated chip, one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame, a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed, a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, and an air gap between said primary lens and said secondary lens.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: July 2, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Oliver Kierse, Eamon Hynes
  • Patent number: 8193620
    Abstract: An integrated circuit package system having a body with a top surface, a bottom surface, and a plurality of side surfaces has a leadframe and encapsulating material that encapsulates at least a portion of the leadframe. The leadframe and encapsulating material are part of the body. The leadframe has a die paddle for supporting a die, and a plurality of leads spaced from the die paddle. The encapsulating material thus also separates the die paddle from the plurality of leads. At least a first portion of the die paddle is exposed to the top surface, while at least a second portion of the die paddle is exposed to the bottom surface.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: June 5, 2012
    Assignee: Analog Devices, Inc.
    Inventors: John Alberghini, Oliver Kierse
  • Publication number: 20110198741
    Abstract: An integrated circuit package system having a body with a top surface, a bottom surface, and a plurality of side surfaces has a leadframe and encapsulating material that encapsulates at least a portion of the leadframe. The leadframe and encapsulating material are part of the body. The leadframe has a die paddle for supporting a die, and a plurality of leads spaced from the die paddle. The encapsulating material thus also separates the die paddle from the plurality of leads. At least a first portion of the die paddle is exposed to the top surface, while at least a second portion of the die paddle is exposed to the bottom surface.
    Type: Application
    Filed: February 17, 2010
    Publication date: August 18, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: John Alberghini, Oliver Kierse
  • Patent number: 7939916
    Abstract: An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: May 10, 2011
    Assignee: Analog Devices, Inc.
    Inventors: Alan O'Donnell, Oliver Kierse, Thomas M. Goida
  • Patent number: 7938014
    Abstract: A sealed capacitive sensor includes a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap and a sealing medium connecting together the substrate and fixed plate in an integrated structure and hermetically sealing the gap.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: May 10, 2011
    Assignee: Analog Devices, Inc.
    Inventors: Peter G. Meehan, William Hunt, Eamon Hynes, John O'Dowd, Oliver Kierse
  • Patent number: 7897920
    Abstract: An improved radiation sensor device includes a cap attached to an integrated circuit chip which has a radiation sensor on a surface with a cap spaced from and covering the radiation sensor; the cap and integrated circuit chip with radiation sensor are encapsulated in an encapsulant with a transparent portion of at least one of the cap and integrated circuit chip proximate the radiation sensor being exposed at the boundary of the encapsulant.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: March 1, 2011
    Assignee: Analog Devices, Inc.
    Inventors: Oliver Kierse, Eamon Hynes
  • Patent number: 7880244
    Abstract: An electronics package has a wafer level chip scale package (WLCSP) die substrate containing electronic circuits. Through-silicon vias through the die substrate electrically connect the electronic circuits to the bottom surface of the die substrate. A package sensor is coupled to the die substrate for sensing an environmental parameter. A protective encapsulant layer covers the top surface of the die substrate. A sensor aperture over the package sensor provides access for the package sensor to the environmental parameter.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: February 1, 2011
    Assignee: Analog Devices, Inc.
    Inventor: Oliver Kierse
  • Patent number: 7667323
    Abstract: A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: February 23, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Oliver Kierse, John O'Dowd, John Wynne, William Hunt, Eamon Hynes, Peter Meehan
  • Publication number: 20090256216
    Abstract: An electronics package has a wafer level chip scale package (WLCSP) die substrate containing electronic circuits. Through-silicon vias through the die substrate electrically connect the electronic circuits to the bottom surface of the die substrate. A package sensor is coupled to the die substrate for sensing an environmental parameter. A protective encapsulant layer covers the top surface of the die substrate. A sensor aperture over the package sensor provides access for the package sensor to the environmental parameter.
    Type: Application
    Filed: April 14, 2009
    Publication date: October 15, 2009
    Applicant: ANALOG DEVICES, INC.
    Inventor: Oliver Kierse
  • Publication number: 20090218492
    Abstract: A radiation sensor device including an integrated circuit chip including a radiation sensor on a surface of the integrated chip, one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame, a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed, a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, and an air gap between said primary lens and said secondary lens.
    Type: Application
    Filed: December 4, 2008
    Publication date: September 3, 2009
    Inventors: Oliver Kierse, Eamon Hynes
  • Publication number: 20080210013
    Abstract: A sealed capacitive sensor includes a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap and a sealing medium connecting together the substrate and fixed plate in an integrated structure and hermetically sealing the gap.
    Type: Application
    Filed: February 21, 2008
    Publication date: September 4, 2008
    Inventors: Peter G. Meehan, William Hunt, Eamon Hynes, John O'Dowd, Oliver Kierse
  • Publication number: 20080179730
    Abstract: An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.
    Type: Application
    Filed: January 25, 2007
    Publication date: July 31, 2008
    Applicant: Analog Devices, Inc.
    Inventors: Alan O'Donnell, Oliver Kierse, Thomas M. Goida
  • Patent number: 7401523
    Abstract: A capacitive sensor and a method of making it with a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap; a plurality of conductor elements interconnecting the substrate and fixed plate; and an edge lock supporting the fixed plate and the substrate relative to each other for maintaining the dimension of the defined gap independent of the conductor elements.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: July 22, 2008
    Assignee: Analog Devices, Inc.
    Inventors: Peter G. Meehan, Oliver Kierse
  • Publication number: 20080164415
    Abstract: A control aperture for an IR sensor includes a die; an IR sensor disposed on the die and an IR opaque aperture layer on the die having an IR transmissive aperture aligned with the IR sensor for controlling the field of view and focus of the IR sensor.
    Type: Application
    Filed: December 21, 2007
    Publication date: July 10, 2008
    Inventors: Oliver Kierse, Eamon Hynes
  • Publication number: 20070063145
    Abstract: An improved radiation sensor device includes a cap attached to an integrated circuit chip which has a radiation sensor on a surface with a cap spaced from and covering the radiation sensor; the cap and integrated circuit chip with radiation sensor are encapsulated in an encapsulant with a transparent portion of at least one of the cap and integrated circuit chip proximate the radiation sensor being exposed at the boundary of the encapsulant.
    Type: Application
    Filed: May 18, 2006
    Publication date: March 22, 2007
    Inventors: Oliver Kierse, Eamon Hynes
  • Publication number: 20060191351
    Abstract: A sealed capacitive sensor includes a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap and a sealing medium connecting together the substrate and fixed plate in an integrated structure and hermetically sealing the gap.
    Type: Application
    Filed: February 14, 2006
    Publication date: August 31, 2006
    Inventors: Peter Meehan, William Hunt, Eamon Hynes, John O'Dowd, Oliver Kierse
  • Publication number: 20060191350
    Abstract: A capacitive sensor and a method of making it with a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap; a plurality of conductor elements interconnecting the substrate and fixed plate; and an edge lock supporting the fixed plate and the substrate relative to each other for maintaining the dimension of the defined gap independent of the conductor elements.
    Type: Application
    Filed: February 14, 2006
    Publication date: August 31, 2006
    Inventors: Peter Meehan, Oliver Kierse
  • Publication number: 20060163726
    Abstract: A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
    Type: Application
    Filed: November 10, 2005
    Publication date: July 27, 2006
    Inventors: Oliver Kierse, John O'Dowd, John Wynne, William Hunt, Eamon Hynes, Peter Meehan