Abstract: Semiconductor device packages may include a die-attach pad and a semiconductor die supported above the die-attach pad. A spacer comprising an electrically conductive material may be supported above the semiconductor die or between the semiconductor die and the die-attach pad. A wire bond may extend from a bond pad on an active surface of the semiconductor die to the spacer. Another wire bond may extend from the spacer to a lead finger or the die-attach pad. An encapsulant material may encapsulate the semiconductor die, the spacer, the wire bond, the other wire bond, the die-attach pad, and a portion of any lead fingers.

Abstract: Semiconductor device packages may include a die-attach pad and a semiconductor die supported above the die-attach pad. A spacer comprising an electrically conductive material may be supported above the semiconductor die or between the semiconductor die and the die-attach pad. A wire bond may extend from a bond pad on an active surface of the semiconductor die to the spacer. Another wire bond may extend from the spacer to a lead finger or the die-attach pad. An encapsulant material may encapsulate the semiconductor die, the spacer, the wire bond, the other wire bond, the die-attach pad, and a portion of any lead fingers.

Abstract: A method for manufacturing an integrated circuit device is disclosed. A leadframe is provided having a die support area configured to receive an integrated circuit die and a plurality of leadframe fingers adjacent the die support area, each leadframe finger including a finger tip area at one end of the leadframe finger. The leadframe is masked such that one or more areas of the leadframe are covered and one or more areas of the leadframe are exposed, wherein for each leadframe finger, a first region of the respective finger tip area is covered by the masking and a second region of the respective finger tip area is exposed. The one or more exposed areas of the leadframe are silver plated such for each leadframe finger, the second region of the respective finger tip area is sliver plated and the first region of the respective finger tip area is not sliver plated.