Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.

Abstract: Various embodiments include a microelectromechanical switching element. The element may include: a substrate with a carrier layer, an electrically insulating layer, and a semiconductor layer; a deflectable bending element formed by a freed subregion of the semiconductor layer; and a cover substrate connected to the carrier substrate. The carrier layer defines a first cutout in the region of the bending element. The cover substrate comprises a second cutout and/or an encircling spacer layer in the region of the bending element. The first cutout and the second cutout define a superordinate hollow space in which the bending element is arranged so as to be deflectable. The superordinate hollow space is delimited by the carrier layer and by the cover substrate to provide a hermetically encapsulation from the external environment.

Abstract: Various embodiments of the teachings herein include an electronic module. The module may include: an electrical circuit; a first MEMS switch having a first control contact with a first switching threshold voltage; and a second MEMS switch having a second control contact with a second switching threshold voltage different than the first. The first control contact and the second MEMS switch are linked to the electrical circuit.

Abstract: Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.

Abstract: The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.

Abstract: A method for fabricating a conductor track, the method comprising: applying a first metallic and electrically conductive material to form the conductor track; and spraying a second metallic material on the conductor track; wherein the second metallic material has a lower melting point than the first material.

Abstract: The invention relates to an arrangement for a power converter (12) comprising at least one power module (1) comprising power semiconductor components (5) and a cooler (10), wherein the cooler (10) has a curved surface and the power module (1) is arranged on the surface and is connected in a positive fit to the cooler (10). The invention also relates to an associated manufacturing method as well as to a power converter with said type of arrangement and to a vehicle with a power converter.

Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.