Abstract: An image sensor using quantum dots is formed that improves collection of photogenerated carrier using a conductive matrix, a semiconductive matrix, a matrix comprising conductive particles and quantum dots in a transparent non-conductive material, conductive structures, and/or porous conductive structures. Hybrid bonding of the image sensor to an image processor device is performed without use of an intervening adhesive to connect the image sensor to the image processor device.

Abstract: A method of forming a stacked image sensor comprises providing a first substrate and a second substrate. The first substrate comprises a first matrix comprising first quantum dots, a first dielectric layer adjacent to the first matrix, and first bond pads disposed in the first dielectric layer. The second substrate comprises a second matrix comprising second quantum dots, a second dielectric layer adjacent to the second matrix, and second bond pads disposed in the second dielectric layer. The method includes hybrid bonding the first substrate to the second substrate without use of an intervening adhesive to form the stacked image sensor, where the hybrid bonding connects the first bond pads to the second bond pads.

Abstract: A semiconductor element is provided with a micro-structured metal oxide layer over a conductive feature at a hybrid bonding surface. The micro-structured metal oxide layer comprises fine metal oxide grains, such as nanograins. The grains can be formed over the conductive feature by oxidizing a metal comprised in the conductive feature, or by providing a metal oxide over the conductive feature. When directly bonded to another element, the micro-structured metal oxide layer can form strong bonds at the bonding interface at substantially reduced annealing temperature.

Abstract: A semiconductor element is provided with a micro-structured metal layer over conductive features of a hybrid bonding surface. The micro-structured metal layer comprises fine metal grain microstructure, such as nanograins. The micro-structured metal layer can be formed over the conductive features by providing a metal oxide and reducing the metal oxide to metal. The micro-structured metal layer can be formed selectively if the metal oxide is formed by oxidation. When directly bonded to another element, the micro-structured metal layer forming strong bonds at the bonding interface can substantially reduce annealing temperature.

Abstract: A semiconductor element having an interconnect bonding layer with a contact pad and a plasma damage-free low-k dielectric material is disclosed. The contact pad connects an underlying conductive feature through an intervening via. A thin dielectric layer is disposed on and covering the entire sidewalls of the contact pad, the intervening via and the underlying conductive feature, and making an approximately right angle turn to extend along an interface between the low-k dielectric material and a first dielectric layer that at least partially bury the underlying contact feature.

Abstract: A tandem OLED device is formed by patterning a first side of a substrate to form a first OLED opening, forming a first material layer stack in the first OLED opening, the first material layer stack comprising a first charge generation layer (CGL) and a second CGL disposed on the first CGL. After forming the first CGL and the second CGL, a second side of the substrate, opposite the first side, is patterned to form a second OLED opening in registration with the first OLED opening. A second material layer stack is formed in the second OLED opening.

Abstract: An element, bonded structure that includes the element, and methods forming the same are disclosed. A bonded structure can include a first element having a first nonconductive field region and a first conductive feature, and a second element having a second nonconductive field region and a second conductive feature. The second element is directly hybrid bonded to the first element such that the first and second nonconductive field regions are directly bonded to one another along a bond interface and the first and second conductive features are directly bonded to one another. The first conductive feature can include a perforated oxide layer. 1 at. % to 20 at. % of the first aluminum feature can be aluminum oxide.

Abstract: The disclosed technology relates to methods for forming and/or validating bonding surfaces of integrated device dies mounted on a dicing tape, and dicing tapes used thereof. In some embodiments, such a method for forming and validating a microelectronic assembly may include mounting a substrate to a dicing tape; singulating the substrate while the substrate is mounted to the dicing tape to form a plurality of dies; and validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the dicing tape. In some embodiments, such a dicing tape may include an anti-static adhesive layer arranged on an anti-static base film.

Abstract: An element, a bonded structure including the element, and a method forming the element and the bonded structure are disclosed. The element can include a non-conductive region having a cavity. The element can include a conductive feature formed in the cavity. The conductive feature includes a center portion and an edge portion having first and second coefficients of thermal expansion respectively. The center and edge portions are recessed relative to a contact surface of the non-conductive region by a first depth and a second depth respectively. The first coefficient of thermal expansion can be at least 5% greater than the second coefficient of thermal expansion. The bonded structure can include the element and a second element having a second non-conductive region and a second conductive feature. A conductive interface between the first and second conductive features has a center region and an edge region.

Abstract: Techniques for facilitating the identification of candidate genes from a plurality of DNA sequences. According to an embodiment of the present invention, techniques are provided for extracting and integrating information from various information sources and results of various analyses, and storing the integrated information in a form which is conducive to identification of candidate genes. The stored information may include results of a homology search for the plurality of DNA sequences, annotative information for the plurality of DNA sequences indicating the biochemical functions and physiological roles of the plurality of DNA sequences, gene expression profile data for the plurality of DNA sequences describing behavioral patterns of the plurality of DNA sequences, results from clustering the plurality of DNA sequences based on time course data as described by the gene expression profile data, and other information.

Abstract: Techniques for facilitating the identification of candidate genes from a plurality of DNA sequences. According to an embodiment of the present invention, techniques are provided for extracting and integrating information from various information sources and results of various analyses, and storing the integrated information in a form which is conducive to identification of candidate genes. The stored information may include results of a homology search for the plurality of DNA sequences, annotative information for the plurality of DNA sequences indicating the biochemical functions and physiological roles of the plurality of DNA sequences, gene expression profile data for the plurality of DNA sequences describing behavioral patterns of the plurality of DNA sequences, results from clustering the plurality of DNA sequences based on time course data as described by the gene expression profile data, and other information.