Abstract: Augmented reality (AR) systems, devices, media, and methods are described for creating a handcrafted AR experience. The handcrafted AR experiences are created by capturing images of a scene, identifying an object receiving surface and corresponding surface coordinates, identifying a customizable AR primary object associated with at least one set of primary object coordinates, generating AR overlays including the customizable AR primary object for positioning adjacent the object receiving surface, presenting the AR overlays, receiving customization commands, generating handcrafted AR overlays including customizations associated with the customizable AR primary object responsive to the customization commands, presenting the handcrafted AR overlays, recording the handcrafted AR overlays, creating a handcrafted AR file including the recorded overlays, and transmitting the handcrafted AR file.

Abstract: Augmented reality (AR) systems, devices, media, and methods are described for sending and receiving AR objects (e.g., customized AR objects) based on/responsive to interactions with the physical world. AR virtual delivery route overlays are generated responsive to selected virtual delivery routes and include the AR object and a delivery mode (air, tunnel, etc.) corresponding to the virtual delivery route. Physical world actions associated with the delivery mode (blowing adjacent an AR device or scratching a surface) result in sending a communication corresponding to the AR object for delivery to a receiver and generating AR sending overlays including the AR object moving in accordance with the delivery mode.

Abstract: A vascular access system which may be configured for blood draw may include a housing, which may include a distal end, a proximal end, and a slot disposed between the distal end and the proximal end. The slot may include a notch. The vascular access system may include a cannula hub, which may be disposed within the housing and movable with respect to the slot. The cannula hub may include a tab extending through the slot. The vascular access system may include a cannula extending distally from the cannula hub. In response to the tab being disposed within the notch, a distal tip of the cannula may be disposed within the housing. In response to advancing the tab along the slot to a distal end of the slot, the distal tip of the cannula is disposed distal to the distal end of the housing.

Abstract: A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Abstract: A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Abstract: A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Abstract: A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.