Abstract: A method of manufacturing a card (3) of small format (8) and small thickness (5), detachable from a plate (1) of large thickness (6), includes the following steps: providing in the plate (1) of large thickness (6) at least one hole (4) opposite with a cumulative depth (7) equal to the difference between the large thickness (6) and the small thickness (5), pre-cutting of the card (3) of small format (8) in the at least one hole (4). The product obtained by such a method is also described.

Abstract: In an assembly including an adapter and a smart card, the outer dimensions of the adapter are compliant with the 3FF microcircuit card format, the format further defining the positioning and minimum dimensions of contact areas; the smart card includes a plurality of contact surfaces, the dimensions of which are greater than those defined by the 3FF format for the contact areas, the outer dimensions of the card being smaller than those of the 3FF format; and the adapter includes a recess, the outline of which is defined by a plurality of arms that surround the recess, the recess being shaped so as to receive the smart card so the contact areas of the adapter fit inside the contact surfaces of the smart card, each of the contact areas being off-center relative to each of the contact surfaces, so each arm has a width of 700 micrometers, ensuring mechanical stability.

Abstract: A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.

Abstract: A microcircuit module for a smart card includes a generally rectangular carrier film (101) provided with eight contact pads on a first face thereof and with an electronic component on a second face, the electronic component being equipped with connection terminals to which the contact pads are connected via the carrier film. The eight contact pads are disposed in two parallel series of three contact pads (C1, C2, C3, C5, C6, C7), with two other contact pads (C?4, C?8) being disposed therebetween and each being positioned close to the contact pads from the ends of each of the series. The contact pads each measure at least 1.7 mm×2 mm. The contact pads of the two parallel series comply with ISO standard 7816 and the eight contact pads border each of the sides of the carrier film.

Abstract: A support that includes a detachable element which has one border, of which at least a portion is attached to the support, with the border portions attached to the support all being so attached by weakened attachment seams, where the support also includes at least two lines of weakness that allow the support to be separated into at least two portions connected by a weakened attachment seam to the detachable element, with each of the lines of weakness being such that, when the support is bent along this line of weakness until it breaks, none of the weakened attachment seams breaks totally. Also disclosed is a method for the detachment of such a detachable element as well as a method for the manufacture of such a support.

Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Abstract: A microcircuit card (2) and held within a carrier card (3) is generally shown as 1 in FIG. 1. The microcircuit card (2) is bounded on all edges except one edge (10a) which is free. The free edge (10a) is substantially in alignment with an edge (7) of a carrier card (3). The microcircuit card and carrier card are held together by connections (12), which can be broken to release the microcircuit card (20) so it can be used independently of the carrier card. The position of the microcircuit card allows it to be easily and cleanly removed from the carrier card.

Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Abstract: A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.

Abstract: A support that includes a detachable element which has one border, of which at least a portion is attached to the support, with the border portions attached to the support all being so attached by weakened attachment seams, where the support also includes at least two lines of weakness that allow the support to be separated into at least two portions connected by a weakened attachment seam to the detachable element, with each of the lines of weakness being such that, when the support is bent along this line of weakness until it breaks, none of the weakened attachment seams breaks totally. Also disclosed is a method for the detachment of such a detachable element as well as a method for the manufacture of such a support.

Abstract: The device (10) includes a near-field communication antenna (12) delimiting a useful magnetic field receiving area (S), a microcircuit (14) connected to the antenna (12) and a magnetic shielding layer (16) arranged so as to extend at least partially under the area (S). It also includes a support (18) built into a microcircuit card body (20) including an open cavity (30) in one of its faces (F2) extending at least partially under the antenna area (S) and sized so as to completely accommodate the shielding layer (16). More specifically, the body (20) includes a detachable plate (22) within which are arranged the antenna (12) and the microcircuit (14) and within which the layer (16) extends at least partially.