Abstract: The invention relates to an insert for a passport booklet data sheet, formed by a multilayer complex having at least a first layer and a second layer having a hinge that has a folding zone where the insert is intended to be sewn or stapled into a passport booklet, said second layer having, in combination, at least one layer of plastics material and at least one metal reinforcing layer that together form an extension which extends a certain distance beyond said folding zone of the hinge, so as to reinforce the resistance of said data sheet to being ripped out and torn with respect to the passport booklet, characterized in that said layer of plastics material and said metal reinforcing layer extend over the entire surface area of the insert.

Abstract: The invention relates to an insert for a passport booklet data sheet, formed by a multilayer complex having at least a first layer and a second layer having a hinge that has a folding zone where the insert is intended to be sewn or stapled into a passport booklet, said second layer having, in combination, at least one layer of plastics material and at least one metal reinforcing layer that together form an extension which extends a certain distance beyond said folding zone of the hinge, so as to reinforce the resistance of said data sheet to being ripped out and torn with respect to the passport booklet, characterized in that said layer of plastics material and said metal reinforcing layer extend over the entire surface area of the insert.

Abstract: The invention concerns an electronic module (11) with double communication interface, in particular for a chip card, the said module comprising firstly a substrate (27) provided with an electrical contact terminal block (17) allowing functioning by contact with the contacts of a reader, and secondly comprising an antenna comprising at least one turn (13) and whose terminals are connected to the terminals of a microelectronic chip situated on one face of the module (11). This module (11) is characterised in that the antenna turns (13) are situated substantially outside the area covered by the electrical contacts (17), so that the electrical contacts of the terminal block do not constitute electromagnetic shielding for the signals intended for the antenna. The invention applies in particular to the production of chip cards with double communication interface with contact and without contact.

Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.

Abstract: A secure document, in particular an electronic passport, includes a support equipped, on the one hand, with active security devices having a microcircuit connected to an antenna that can produce an electromagnetic response when it passes through the electromagnetic field of a contactless reader designed to query the identity document. The support is equipped, on the other hand, with passive security devices selected so as to have electrical characteristics, in particular inductive, capacitive and resistive, that are suitable for amplifying the electromagnetic response of the active security devices to make it go beyond a threshold that allows the secure document to be identified when it is placed in the electromagnetic field of a contactless reader. The invention has a useful application in national programs to issue passports with increased security.

Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.

Abstract: The invention concerns an electronic module (11) with double communication interface, in particular for a chip card, the said module comprising firstly a substrate (27) provided with an electrical contact terminal block (17) allowing functioning by contact with the contacts of a reader, and secondly comprising an antenna comprising at least one turn (13) and whose terminals are connected to the terminals of a microelectronic chip situated on one face of the module (11). This module (11) is characterised in that the antenna turns (13) are situated substantially outside the area covered by the electrical contacts (17), so that the electrical contacts of the terminal block do not constitute electromagnetic shielding for the signals intended for the antenna. The invention applies in particular to the production of chip cards with double communication interface with contact and without contact.

Abstract: An adapter for a portable integrated circuit device of the chip card variety has a reduced format in comparison with the standard mini-card format. The device with a reduced format includes a body on which a microcircuit defining contact pads is disposed. A support which has a standard mini-card format is provided with a cavity having the dimensions of the device with a reduced format. The device is detachably fixed in the cavity. The cavity is located in the support in such a way that the location of the contact pads of the microcircuit of the device with a reduced format coincides with the standardization location of the contact pads of a microcircuit having a standard format mini-card.

Abstract: The disclosed invention relates to a method of manufacturing an electronic device having a chip and/or an antenna, such as a contactless or hybrid or label chip card. The electronic device includes at least one decorative sheet having a visible outer face, and at least one interface comprising an antenna. The method includes a step in which the antenna is formed on that face of the decorative sheet which is opposite its visible outer face by screen-printing using a conductive ink. The invention also relates to the resulting electronic device.

Abstract: A portable integrated circuit device has a supporting body and a detachable mini-card bearing an integrated circuit. The mini-card is disposed on one end of the supporting body which has an elongated shape. The invention can be used for SIM cards in new generation mobile telephones.

Abstract: The invention relates to a method of protecting a document information carrier body such as an identity card and/or a smart card, characterised in that it includes the following steps:

Abstract: A contactless smart card includes a card body, an antenna and an integrated circuit chip connected to the antenna's connecting terminals. The connecting terminals of the antenna are further connected to conductive via holes emerging at the card surface. A junction based on an electrically conductive substance is flush with the card surface and connects the conductive via holes. The electrically conductive substance is designed to be removed by scraping, and prevents the card from being used until it is removed.

Abstract: The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

Abstract: The invention relates to a chip card (10) including an electronic module, which module is fitted with an interface for electrical and/or electromagnetic communications formed by electrical contacts (12) and/or an antenna (22). It is characterised in that it includes at least one guarantee label (14) which is bonded to one of its surfaces and which can be unbonded by breaking the adhesion, said label being suitable for preventing said interface (12, 22) from communicating with the outside world.