Abstract: A method for assembling components includes assembling a first component including solder bumps with a second component including connectors. The assembly of the components is preceded by pre-treating the first and second components wherein the solder bumps are contacted with a pre-treatment liquid configured to at least partially remove an oxide layer initially present on the solder. The pre-treatment liquid is an aqueous solution containing carboxylic acids or polycarboxylic acids. The assembly of the components is carried out after the pre-treatment in the absence of liquid or gas flux.

Abstract: An integrated optical component, including a transparent pad arranged on the upper face of the basic optical component, the transparent pad including a plane mirror at its upper face, and the basic optical component including a convergent mirror at its upper face, the plane and convergent mirrors being arranged such that the light beam is propagated between the internal light gate and the external light gate by passing through the transparent pad by reflection on the plane mirror and by reflection on the convergent mirror.

Abstract: A method for assembling components implementing includes a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering. A first component carrying solder bumps is assembled with a second component carrying connectors. Beforehand, a pre-treatment of the components carrying solder bumps is carried out by contacting them with a pre-treatment liquid which makes their subsequent fluxless and residue-free soldering possible.

Abstract: A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover (600) to the front face, the bonding being undertaken such that the cover (600) forms a closed cavity (650) with the region, advantageously hermetically sealed; Formation of an encapsulation coating (700), of thickness E1, covering the front face and the cover (600); A thinning step for the encapsulation coating (700), the thinning step including removal of a removal thickness E2, less than the thickness E1, of the encapsulation coating (700), the removal thickness E2 being adjusted such that an opening is formed in the cover (600).

Abstract: A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover (600) to the front face, the bonding being undertaken such that the cover (600) forms a closed cavity (650) with the region, advantageously hermetically sealed ; Formation of an encapsulation coating (700), of thickness E1, covering the front face and the cover (600); A thinning step for the encapsulation coating (700), the thinning step including removal of a removal thickness E2, less than the thickness E1, of the encapsulation coating (700), the removal thickness E2 being adjusted such that an opening is formed in the cover (600).

Abstract: An optical shuttering device is provided, which includes an optical cell with a liquid crystal material between first and second transparent substrates and controlled by an electronic switching circuit. The switching circuit includes a power supply module, providing a control voltage, and a switching element mounted in series between the power supply module and the cell, making it possible to switch the cell between an on state and an off state. The electronic switching circuit furthermore includes a current source mounted in series between the power supply module and the switching element. The substrates preferably have different thickness and material.

Abstract: An optical shuttering device is provided, which includes an optical cell with a liquid crystal material between first and second transparent substrates and controlled by an electronic switching circuit. The switching circuit includes a power supply module, providing a control voltage, and a switching element mounted in series between the power supply module and the cell, making it possible to switch the cell between an on state and an off state. The electronic switching circuit furthermore includes a current source mounted in series between the power supply module and the switching element. The substrates preferably have different thickness and material.