Patents by Inventor Olivier Franza
Olivier Franza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11656662Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: GrantFiled: February 11, 2021Date of Patent: May 23, 2023Assignee: Intel CorporationInventors: Simon C. Steely, Jr., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20220366034Abstract: Examples relate to an apparatus, a device, a method, and a computer program for monitoring one or more software containers being hosted by a computer system, to an apparatus, a device, a method, and a computer program for generating information on an expected behavior of software components of software containers, and to corresponding computer systems. The apparatus for monitoring the one or more software containers comprises processing circuitry configured to determine information on an expected behavior of the one or more software containers based on respective software components being executed or used within the one or more software containers. The processing circuitry is configured to determine information on a monitored behavior of the one or more software containers. The processing circuitry is configured to determine a fault condition of a software container based on a deviation between the expected behavior of the software container and the monitored behavior of the software container.Type: ApplicationFiled: February 28, 2022Publication date: November 17, 2022Inventors: Olivier FRANZA, David LOMBARD, Farah FARGO
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Publication number: 20210255674Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: ApplicationFiled: February 11, 2021Publication date: August 19, 2021Inventors: Simon C. Steely, JR., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20210191490Abstract: Methods and apparatus for balancing power between discrete components, such as processing units (e.g., CPUs) and accelerators in a compute node or platform. Power consumption of the compute platform is monitored to detect for conditions under which a threshold (e.g., power supply capacity threshold) is exceeded. In response, the operating frequencies of a processing unit and/or other platform components such as accelerators, are adjusted to reduce the power consumption of the platform to return below the threshold. Power limit biasing hints (scaling weights) are provided to platform components, along with a power violation index, which are used to adjust the operating frequencies of the platform components. Optionally, a processing unit can calculate the power violation index and the scaling weights and directly control the frequencies of itself and platform components. Embodiments of multi-socket platforms are also provided.Type: ApplicationFiled: March 3, 2021Publication date: June 24, 2021Inventors: Phani Kumar KANDULA, Eric J. DEHAEMER, Dorit SHAPIRA, Ramkumar NAGAPPAN, Vivek GARG, Fuat KECELI, Mani PRAKASH, David C. HOLCOMB, Horthense D. TAMDEM, Olivier FRANZA, Vjekoslav SVILAN
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Patent number: 10963022Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: GrantFiled: April 29, 2020Date of Patent: March 30, 2021Assignee: Intel CorporationInventors: Simon C. Steely, Jr., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20200371566Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: ApplicationFiled: April 29, 2020Publication date: November 26, 2020Inventors: Simon C. Steely, JR., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20200322285Abstract: Methods and apparatus for optimizing fault tolerance on HPC (high-performance computing) systems including systems employing exascale architectures. The method and apparatus implement one or more management/service nodes in a management/service node layer and a plurality of sub-management nodes in a sub-management node layer. The sub-management nodes implement redundant cross-connected software components in different sub-layers to provide redundant channels. The redundant software components in a lowest sub-layer are connected to switches in racks containing multiple service nodes. The sub-management nodes are configured to employ the multiple redundant channels to collect telemetry data and other data from the service nodes such that the system continues to collect the data in the event of a failure in a software component or hardware failure.Type: ApplicationFiled: June 8, 2020Publication date: October 8, 2020Inventors: Olivier Franza, Farah Fargo, David Lisandro Romero Antequera
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Patent number: 10691182Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: GrantFiled: May 20, 2019Date of Patent: June 23, 2020Assignee: Intel CorporationInventors: Simon C. Steely, Jr., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20190354146Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.Type: ApplicationFiled: May 20, 2019Publication date: November 21, 2019Inventors: Simon C. Steely, JR., Richard Dischler, David Bach, Olivier Franza, William J. Butera, Christian Karl, Benjamin Keen, Brian Leung
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Publication number: 20190243953Abstract: A computing node can execute a controller in a secure and trusted environment. The controller can cause a task to be executed on different nodes with differing computing platform software and an executable derived from a different coding language. The controller can detect anomalies in results from performance of the task using the different nodes. Any node with an anomalous result can be excluded from use and considered compromised by intrusion. The controller can also at some time interval or a pseudo-random time interval, change computing software settings and/or coding language used for applications on the node.Type: ApplicationFiled: February 8, 2019Publication date: August 8, 2019Inventors: Farah E. FARGO, Olivier FRANZA, Amit KUMAR
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Publication number: 20110248755Abstract: According to various embodiments, a cross-feedback phase-locked loop (XF-PLL) may include a secondary phase/frequency detector to detect the phase/frequency differences between two adjacent domains and feed the phase/frequency differences back into the main feedback loop of the XF-PLL, thereby reducing accumulated jitter and inter-domain clock skew in a distributed clocking system. Other embodiments may be described and claimed.Type: ApplicationFiled: April 8, 2010Publication date: October 13, 2011Inventors: William C. Hasenplaugh, Olivier Franza, Kambiz R. Munshi
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Publication number: 20090085552Abstract: In some embodiments of the invention, a processor with a power management scheme using dynamically switchable embedded power gates.Type: ApplicationFiled: September 29, 2007Publication date: April 2, 2009Inventors: Olivier Franza, Mondira Pant, Stefan Rusu, Michael Zelikson