Abstract: A method for charging a battery is provided, wherein current pulses are supplied to the battery, wherein each pulse is followed by a rest period during which no current is supplied to the battery, and wherein the state of charge of the battery is determined during the rest period.

Abstract: An insertion method for introducing at least one stamping foil 410 into a foil drive system 440 of a stamping machine 1, wherein the drive system advances each foil 410 in a determined feed path. The method includes the steps of unwinding an end portion of each foil 410 over a given length, turning each end portion back on itself to constitute the free strand 413 of an open loop 414, unwinding each free strand 413 along the feed path by pulling the corresponding foil 410 from the inside of its loop 414, while partially restraining each free strand 413 as it deploys along the feed path.

Abstract: The disclosure relates to a method for controlling an object configured to be handheld and including vibratory actuators. The method including mechanically coupling a first group of at least one vibratory actuator to a first part of the object, mechanically coupling a second group of at least one vibratory actuator to a second part of the object, the first and the second parts being configured to be able to vibrate independently of each other, and to come into contact with different areas of the hand of the user holding the object, and transmitting to each group of actuators, an electrical signal having a frequency adapted to the resonance frequency of the part to which it is mechanically coupled.

Abstract: The disclosure relates to a method of manufacturing vibratory elements, comprising forming on a substrate a multilayer structure by an integrated circuit manufacturing method, the multilayer structure comprising an element susceptible of vibrating when it is subjected to an electrical signal, and electrodes for transmitting an electrical signal to the vibratory element, the vibratory element comprising a mechanical coupling face that is able to transmit to control element vibrations perceptible by a user.

Abstract: A device for densely loading a divided solid into a chamber, intended to interact with a divided-solid supply device arranged to release the divided solid above an access to the chamber. The loading device contains a shaft rotated about an axis X1 at an adjustable rotational speed, a plurality of deflecting elements rigidly connected in rotation with the shaft, the deflecting elements having an angle, relative to the shaft, which is separately adjustable from the rotational speed of the latter. According to a preferred embodiment, the shaft is hollow in order to define a passage for the divided solid, at least some of the deflecting element having an end arranged at a distance from the axis X1 that is smaller than the distance separating the axis X1 from the hollow shaft.

Abstract: A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.

Abstract: A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.

Abstract: A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.

Abstract: A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.

Abstract: Electrical connection between two faces of a substrate and manufacturing process. The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself. Application to the manufacture of circuits, components, sensors, etc.

Abstract: Electrical connection between two faces of a substrate and manufacturing process.