Abstract: An interconnection structure includes a substrate formed by a first electrically insulating and optically transparent material, the substrate including a first face and an opposite second face, the first face defining a plane of the substrate, and a plurality of transparent electrodes, wherein the transparent electrodes pass through the substrate from the first face to the second face of the substrate in parallel to each other, and are electrically insulated from each other by the first electrically insulating and optically transparent material.

Abstract: A photodetector is provided, including an active layer configured to generate charge carriers of a first type and of a second type by absorption of electromagnetic radiation; a first electrode configured to collect the charge carriers of the first type; and a second electrode configured to collect the charge carriers of the second type, the first electrode including a layer configured to collect the charge carriers of the first type, the layer including self-assembled monolayers, and nanowires comprising metal and functionalized by the self-assembled monolayers, the self-assembled monolayers of the layer are configured to functionalize the nanowires and to modify a work function of a material forming the nanowires. A method for manufacturing a photodetector and an electrode for a photodetector are also provided.

Abstract: Method for producing a connection structure passing through a flexible substrate, in particular a plastic substrate, comprising: producing a hole passing through the thickness of the substrate, depositing in the hole a first conductive ink having a first viscosity, so as to form a conductive layer on at least one wall of the hole, depositing in the hole a second conductive ink having a second viscosity greater than the first viscosity, so as to fill the hole.

Abstract: An electronic circuit, including a substrate made of a first polymer having a first glass transition temperature lower than 200° C., the substrate having first and second opposite surfaces; a first layer or first tracks of a second polymer on the first surface; a second layer or second tracks of the second polymer or of a third polymer on the second surface, the second and third polymers being different from the first polymer and having a second glass transition temperature higher than 200° C.; and third electrically-conductive tracks on the first layer or the first tracks.

Abstract: A photodetector is provided, including an active layer configured to generate charge carriers of a first type and of a second type by absorption of electromagnetic radiation; a first electrode configured to collect the charge carriers of the first type; and a second electrode configured to collect the charge carriers of the second type, the first electrode including a layer configured to collect the charge carriers of the first type, the layer including self-assembled monolayers, and nanowires comprising metal and functionalized by the self-assembled monolayers, the self-assembled monolayers of the layer are configured to functionalize the nanowires and to modify a work function of a material forming the nanowires. A method for manufacturing a photodetector and an electrode for a photodetector are also provided.

Abstract: This touch-sensitive sensor includes a layer of piezoelectric material interposed between, on the one hand, first and second electrically-conductive elements and, on the other hand, at least one third conductive element including a surface opposite at least one of the first and second conductors.

Abstract: An electronic circuit, including a substrate made of a first polymer having a first glass transition temperature lower than 200° C., the substrate having first and second opposite surfaces; a first layer or first tracks of a second polymer on the first surface; a second layer or second tracks of the second polymer or of a third polymer on the second surface, the second and third polymers being different from the first polymer and having a second glass transition temperature higher than 200° C.; and third electrically-conductive tracks on the first layer or the first tracks.

Abstract: Method for producing a connection structure passing through a flexible substrate, in particular a plastic substrate, comprising: producing a hole passing through the thickness of the substrate, depositing in the hole a first conductive ink having a first viscosity, so as to form a conductive layer on at least one wall of the hole, depositing in the hole a second conductive ink having a second viscosity greater than the first viscosity, so as to fill the hole.

Abstract: This touch-sensitive sensor includes a layer of piezoelectric material interposed between, on the one hand, first and second electrically-conductive elements and, on the other hand, at least one third conductive element including a surface opposite at least one of the first and second conductors.