Patents by Inventor Olivier J. Blachier

Olivier J. Blachier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Object plating method and system
    Publication number: 20030205478
    Abstract: A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the plating and/or the reduction in the amount of at least one plating component. Based on this monitored aspect, an adjustment is made to the flow rate of substances added to a plating cell and/or the flow rate of used plating substances drained from the plating cell. The used plating substances are purified to remove at least some of the byproduct and then the purified plating substances are combined with at least one component before passing back into the plating cell to reuse at least some of the plating substances. The method and system could be used during the plating of semiconductor wafers with copper.
    Type: Application
    Filed: April 21, 2003
    Publication date: November 6, 2003
    Applicant: The BOC Group, Inc.
    Inventors: Olivier J. Blachier, Frank Jansen, Colin John Dickinson, Peter M. Pozniak
  • Object plating method and system
    Patent number: 6569307
    Abstract: A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the plating and/or the reduction in the amount of at least one plating component. Based on this monitored aspect, an adjustment is made to the flow rate of substances added to a plating cell and/or the flow rate of used plating substances drained from the plating cell. The used plating substances are purified to remove at least some of the byproduct and then the purified plating substances are combined with at least one component before passing back into the plating cell to reuse at least some of the plating substances. The method and system could be used during the plating of semiconductor wafers with copper.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: May 27, 2003
    Assignee: The BOC Group, Inc.
    Inventors: Olivier J. Blachier, Frank Jansen, Colin John Dickinson, Peter M. Pozniak
  • Object plating method and system
    Publication number: 20020112952
    Abstract: A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the plating and/or the reduction in the amount of at least one plating component. Based on this monitored aspect, an adjustment is made to the flow rate of substances added to a plating cell and/or the flow rate of used plating substances drained from the plating cell. The used plating substances are purified to remove at least some of the byproduct and then the purified plating substances are combined with at least one component before passing back into the plating cell to reuse at least some of the plating substances. The method and system could be used during the plating of semiconductor wafers with copper.
    Type: Application
    Filed: December 22, 2000
    Publication date: August 22, 2002
    Inventors: Olivier J. Blachier, Frank Jansen, Colin John Dickinson, Peter M. Pozniak