Abstract: An optoelectronic device having a set of pixels wherein each pixel has a sub-pixel capable of emitting a primary light beam, a set of pixels each pixel being adjacent to a pixel wherein each secondary pixel has at least one secondary sub-pixel capable of emitting a secondary light beam, a set of optical systems arranged so as to be able to cover an entire pixel belonging to one of the sets and at least part of the sub-pixels of at least one of the adjacent pixels belonging to the other set, the number of pixels being greater than twice the number of optical systems. At least one movement mechanism applies a relative movement between the set and the sets according to a predetermined sequence.

Abstract: The manufacture of an optoelectronic device includes the formation of light-emitting diodes where each one has a wire form, the formation of spacing walls made of a first dielectric material transparent to the light radiation originating from the diodes. The lateral sidewalls of each diode are surrounded by spacing walls. Light confinement walls are made of a second material adapted to block the light radiation originating from the diodes. The light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the wherein. A thin layer of the second material is deposited so as to directly cover the lateral sidewalls of the spacing walls by being in contact with the wherein and cover the upper border of the light-emitting diodes. The empty spaces delimited between the spacing walls at the level of the areas between the light-emitting diodes are also filled by the thin layer.

Abstract: A method for treating a region of an optoelectronic device (Pix) further including a substrate adjacent to the region to be treated. The optoelectronic device includes, in the region to be treated, programmable elements configured to be modified when they are exposed to a laser beam. The method includes the exposure of at least one of the programmable elements to the laser beam focused through the substrate.

Abstract: The manufacture of an optoelectronic device includes the formation of wire-like shaped light-emitting diodes and the formation of spacing walls transparent to the light radiation originating from the diodes. The lateral sidewalls of each diode are surrounded by at least one of the spacing walls. Light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the latter. The radiation originating from each diode and directed in the direction of the adjacent diodes is blocked by the confinement wall. The upper borders of the diodes are covered by the light confinement material so as to ensure a light extraction by the rear face of the optoelectronic device. An optoelectronic device is also described as such.

Abstract: A display screen intended to display a multiple-resolution image and including a plurality of pixels distributed on a support, the screen including a first zone of a face of the support having a first density of pixels, enabling to display a first part of the image at a first resolution, and a second zone of the face of the support having a second density of pixels, strictly greater than said first density, enabling to display a second part of the image at a second resolution. The disclosure also relates to a display system including such a screen and a method for producing the screen.

Abstract: A device configured for a laser treatment including a substrate transparent for the laser and objects, each object being bonded to the substrate via a photonic crystal.

Abstract: A device configured for a treatment with a laser, including a support transparent for the laser and at least one optoelectronic circuit including at least one optoelectronic component having a three-dimensional semiconductor element covered with an active layer, the three-dimensional semiconductor element including a base bonded to the support, the device including a region absorbing for the laser resting on the support and surrounding the base.

Abstract: optoelectronic circuit intended to receive a variable voltage containing an alternation of rising and falling phases. The optoelectronic circuit includes light-emitting diodes and a switching device capable of allowing or of interrupting the flowing of a current through each light-emitting diode. Each light-emitting diode is covered with a photoluminescent layer. The photoluminescent layer covering at least one of the light-emitting diodes includes at least one first luminophore having a first decay constant and at least one second luminophore having a second decay constant different from the first decay constant.

Abstract: There is described an optoelectronic device where each light-emitting diode has a wire-like shape. Spacing walls are formed so that the lateral sidewalls of each light-emitting diode are surrounded by at least one of the spacing walls. Light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the latter. The spacing walls have a convex-shaped outer face. At least one of the spacing walls has, over a lower portion, a thickness that increases when getting away from the substrate. They have, over an upper portion, a thickness that decreases at the level of the upper border of the light-emitting diode when getting away from the substrate. The light confinement walls have an inner face having a concave shape matching with the convex shape and directed towards the light-emitting diode for which it confines the light radiation thereof.

Abstract: A system for the treatment of a region of an object adjacent to a substrate. The system includes a source of an incident laser beam delivering a focused laser beam. The wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of this wavelength. The system includes an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device. The processing being performed on the region through the substrate, and including the physical, chemical, or physico-chemical modification or the ablation of said region.

Abstract: An optoelectronic device having a set of pixels wherein each pixel has a sub-pixel capable of emitting a primary light beam, a set of pixels each pixel being adjacent to a pixel wherein each secondary pixel has at least one secondary sub-pixel capable of emitting a secondary light beam, a set of optical systems arranged so as to be able to cover an entire pixel belonging to one of the sets and at least part of the sub-pixels of at least one of the adjacent pixels belonging to the other set, the number of pixels being greater than twice the number of optical systems. At least one movement mechanism applies a relative movement between the set and the sets according to a predetermined sequence.

Abstract: An optoelectronic device includes at least one light-emitting diode having a three-dimensional shape having a height along a longitudinal axis and having a first longitudinal dimension measured along the longitudinal axis and at least a second transverse dimension corresponding to a dimension of the three-dimensional shape measured perpendicular to the longitudinal axis. The first longitudinal dimension and the second transverse dimension are each less than or equal to substantially 20 ?m. The optoelectronic device has at least one optical lens capable of transforming the light rays emitted by the light-emitting diode which pass through the optical lens.

Abstract: An optoelectronic device includes a number of pixels, with each pixel including a lighting mechanism having at least one light-emitting diode capable of emitting an initial light beam, a light-conversion module having a plurality of conversion pads including at least one primary conversion pad and at least one secondary conversion pad. Each pixel includes a light-adjustment system configured to control at least one element chosen from a relative position between the lighting mechanism and the light-conversion module and the initial light beam. The action of the light-adjustment system is adapted so that the primary conversion pad and the secondary conversion pad emit a first light beam and a second light beam respectively, from the initial light beam, simultaneously or alternately in a predetermined sequence.

Abstract: An optoelectronic multiscopic image display and/or capture device, including a support, an array of optoelectronic circuits resting on the support, and lenses covering the optoelectronic circuits. Each optoelectronic circuit includes a number N of photosensors capable of capturing a pixel or pixels of an image of a scene according to different viewpoints and/or number N of display circuits capable of displaying a pixel or pixels of an image of a scene according to the different viewpoints, N being a natural number greater than or equal to 3.

Abstract: The manufacture of an optoelectronic device includes the formation of wire-like shaped light-emitting diodes and the formation of spacing walls transparent to the light radiation originating from the diodes. The lateral sidewalls of each diode are surrounded by at least one of the spacing walls. Light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the latter. The radiation originating from each diode and directed in the direction of the adjacent diodes is blocked by the confinement wall. The upper borders of the diodes are covered by the light confinement material so as to ensure a light extraction by the rear face of the optoelectronic device. An optoelectronic device is also described as such.

Abstract: There is described an optoelectronic device where each light-emitting diode has a wire-like shape. Spacing walls are formed so that the lateral sidewalls of each light-emitting diode are surrounded by at least one of the spacing walls. Light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the latter. The spacing walls have a convex-shaped outer face. At least one of the spacing walls has, over a lower portion, a thickness that increases when getting away from the substrate. They have, over an upper portion, a thickness that decreases at the level of the upper border of the light-emitting diode when getting away from the substrate. The light confinement walls have an inner face having a concave shape matching with the convex shape and directed towards the light-emitting diode for which it confines the light radiation thereof.

Abstract: The manufacture of an optoelectronic device includes the formation of light-emitting diodes where each one has a wire form, the formation of spacing walls made of a first dielectric material transparent to the light radiation originating from the diodes. The lateral sidewalls of each diode are surrounded by spacing walls. Light confinement walls are made of a second material adapted to block the light radiation originating from the diodes. The light confinement walls directly cover the lateral sidewalls of the spacing walls by being in contact with the wherein. A thin layer of the second material is deposited so as to directly cover the lateral sidewalls of the spacing walls by being in contact with the wherein and cover the upper border of the light-emitting diodes. The empty spaces delimited between the spacing walls at the level of the areas between the light-emitting diodes are also filled by the thin layer.

Abstract: optoelectronic circuit intended to receive a variable voltage containing an alternation of rising and falling phases. The optoelectronic circuit includes light-emitting diodes and a switching device capable of allowing or of interrupting the flowing of a current through each light-emitting diode. Each light-emitting diode is covered with a photoluminescent layer. The photoluminescent layer covering at least one of the light-emitting diodes includes at least one first luminophore having a first decay constant and at least one second luminophore having a second decay constant different from the first decay constant.

Abstract: An AC/DC converter including: an H bridge; an inductance in series with an input of the bridge; an inductance in series with an output of the bridge; and a circuit capable of controlling the bridge alternately to a first configuration where first and second diagonals of the bridge are respectively conductive and non-conductive, and to a second complementary configuration, the circuit being capable, during a phase of transition between the first and second configurations, of: turning on a first switch of the second diagonal; turning off a first switch of the first diagonal when the current flowing through this switch takes a zero value; turning on the second switch of the second diagonal; and turning off the second switch of the first diagonal when the current flowing through this switch takes a zero value.

Abstract: An AC/DC conversion circuit, including: four bidirectional switches forming an H bridge; a capacitor connected between input nodes of the bridge; a capacitor connected between output nodes of the bridge; and a control circuit capable of controlling the bridge alternately to a first configuration where first and second diagonals of the bridge are respectively conductive and non-conductive, and to a second configuration where the first and second diagonals are respectively non-conductive and conductive, the control circuit being capable, during a phase of transition between the first and second configurations, of: turning off the switches of the first diagonal; and for each switch of the second diagonal, turning on the switch only when the voltage thereacross takes a zero value.