Patents by Inventor Olivier MANN
Olivier MANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230315082Abstract: The present invention relates to a method for predictive maintenance of a component (11) of a road vehicle (10) and a predictive maintenance device configured to implement said method. The method is implemented by at least one calculator (12) connected to the component (11) and comprises the following steps: a. collecting a data set of the vehicle (S200) comprising: i. first data relating to the use of first predetermined combinations of usage parameters of said component (CP1(1), . . . , CP1(N)), ii. second data relating to the use of second predetermined combinations of usage parameters of said vehicle (CP2(1), . . . , CP2(M)), iii. third data for establishing the course of at least one control parameter of the component representative of wear of the component (P3) as a function of the number of kilometers traveled by the vehicle, b. as a function of the first and second data of the vehicle, selecting (S300), from a plurality of pre-established classes of vehicles (C1,1, . . .Type: ApplicationFiled: June 16, 2021Publication date: October 5, 2023Inventors: Dominique-Jean MARTINEAU, Olivier MANNS, Nicolas TERRAL
-
Patent number: 11512405Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.Type: GrantFiled: December 14, 2018Date of Patent: November 29, 2022Assignee: Atotech Deutschland GmbHInventors: Angela Llavona-Serrano, Timo Bangerter, Olivier Mann, Pamela Cebulla, Stefanie Ackermann, Heiko Brunner, Kinga Haubner, Bernd Froese
-
Publication number: 20220092885Abstract: Disclosed are methods and devices for predictive maintenance of at least one component of a road vehicle. The general principle is based on the combination of the ranges of values of parameters that represent the wear of a road vehicle component. The method includes observing the duration of use of combinations of ranges of values in order to deduce therefrom a wear profile which is compared with a predetermined wear profile. This mechanism makes it possible to reduce the amount of information to be stored.Type: ApplicationFiled: January 30, 2020Publication date: March 24, 2022Inventors: Dominique MARTINEAU, Jean-Pierre AROCENA, Olivier MANNS, Nicolas TERRAL
-
Publication number: 20210262105Abstract: The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
-
Patent number: 11066553Abstract: The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.Type: GrantFiled: August 19, 2016Date of Patent: July 20, 2021Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Lars Kohlmann, Agnieszka Witczak, Olivier Mann
-
Patent number: 11035051Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: GrantFiled: August 10, 2017Date of Patent: June 15, 2021Assignee: Atotech Deutschland GmbHInventors: Kun Si, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten, Dirk Rohde, Himendra Jha, Jens Palm, Olivier Mann, Angela Llavona-Serrano
-
Publication number: 20200340132Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.Type: ApplicationFiled: December 14, 2018Publication date: October 29, 2020Inventors: Angela LLAVONA-SERRANO, Timo BANGERTER, Olivier MANN, Pamela CEBULLA, Stefanie ACKERMANN, Heiko BRUNNER, Kinga HAUBNER, Bernd FROESE
-
Patent number: 10767275Abstract: The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: GrantFiled: August 30, 2016Date of Patent: September 8, 2020Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Lars Kohlmann, Agnieszka Witczak, Olivier Mann
-
Publication number: 20190203369Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: ApplicationFiled: August 10, 2017Publication date: July 4, 2019Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
-
Publication number: 20190144667Abstract: The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.Type: ApplicationFiled: August 19, 2016Publication date: May 16, 2019Inventors: Heiko BRUNNER, Lars KOHLMANN, Agnieszka WITCZAK, Olivier MANN
-
Publication number: 20180223442Abstract: The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: ApplicationFiled: August 30, 2016Publication date: August 9, 2018Inventors: Heiko BRUNNER, Lars KOHLMANN, Agnieszka WITCZAK, Olivier MANN
-
Patent number: 9963797Abstract: The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath containing a leveler additive which forms copper trenches having a cross-sectional round shape under direct current plating conditions, and at least one reverse current pulse cycle consisting of one forward current pulse and one reverse current pulse wherein the fraction of the reverse charge to the forward charge applied to the substrate in said at least one current pulse cycle ranges between 0.1 to 5%. The method is particularly suitable for simultaneously filling blind micro vias and plating trenches with a rectangular cross-sectional shape.Type: GrantFiled: October 9, 2014Date of Patent: May 8, 2018Assignee: Atotech Deutschland GmbHInventors: Andreas Macioβek, Olivier Mann, Pamela Cebulla
-
Patent number: 9551080Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: GrantFiled: November 12, 2013Date of Patent: January 24, 2017Assignee: Atotech Deutschland GmbHInventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
-
Publication number: 20160258077Abstract: The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath containing a leveler additive which forms copper trenches having a cross-sectional round shape under direct current plating conditions, and at least one reverse current pulse cycle consisting of one forward current pulse and one reverse current pulse wherein the fraction of the reverse charge to the forward charge applied to the substrate in said at least one current pulse cycle ranges between 0.1 to 5%. The method is particularly suitable for simultaneously filling blind micro vias and plating trenches with a rectangular cross-sectional shape.Type: ApplicationFiled: October 9, 2014Publication date: September 8, 2016Inventors: Andreas MACIOßEK, Olivier MANN, Pamela CEBULLA
-
Publication number: 20150299883Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.Type: ApplicationFiled: November 12, 2013Publication date: October 22, 2015Inventors: Heiko BRUNNER, Bernd ROELFS, Agnieszka WITCZAK, Lars KOHLMANN, Olivier MANN, Christian OHDE, Timo BANGERTER, Angelo FERRO, Andreas KIRBS, Andre SCHMÖKEL, Dirk ROHDE, Stefanie ACKERMANN
-
Patent number: 8730791Abstract: An aircraft communication system includes primary and secondary networks. The system also includes an interconnection gateway with a filtered interface connected to only one of the primary and secondary networks, and an unfiltered interface connected to the other network. The filtered interface includes first incoming and outgoing buffers, a memory, and a selector. The unfiltered interface includes second incoming and outgoing buffers. The second incoming buffer sends all frames received from the other network to the first outgoing buffer for distribution through the only one network. The selector selects common data frames corresponding to virtual link identifiers in a stored list and copies only the selected common data frames from the first incoming buffer to the second outgoing buffer of the unfiltered interface for distribution through the other one of the networks.Type: GrantFiled: October 29, 2010Date of Patent: May 20, 2014Assignee: AIRBUS Operations S.A.S.Inventors: Olivier Mann, Juan Lopez, Benoit Berthe
-
Publication number: 20110103268Abstract: The present invention concerns an aircraft communication system (100) comprising a primary network (300) of AFDX type intended to connect a plurality of primary equipment items (310, 311, 320, 321, 330, 340, 360). This communication system comprises: a secondary network (500) dissimilar to said first network (300) whilst having the same protocol at frame level, said secondary network (500) being intended to connect a plurality of secondary equipment items (510, 520, 530, 540, 560), and an interconnection gateway (700; 700a; 700b; 700c) between said primary (300) and secondary (500) networks, intended to copy common data frames bit-by-bit originating from one of said primary and secondary networks (300, 500) for distribution thereof through the other of said primary and secondary networks (300, 500), to have this common data shared by the two networks (300, 500).Type: ApplicationFiled: October 29, 2010Publication date: May 5, 2011Applicant: SOCIETE PAR ACTIONS SIMPLIFIEEInventors: Olivier MANN, Juan Lopez, Benoit Berthe