Abstract: A carrier substrate (1) for electrical components, in particular metal-ceramic substrate (1) for electrical components, comprising an insulation layer (10), the insulation layer (10) preferably having a material comprising a ceramic or a composite comprising at least one ceramic layer, a component metallization (20) which is formed on a component side (BS) and has a first primary structuring (21), and a cooling part metallization (30) which is formed on a cooling side (KS) opposite the component side (BS) and has a second primary structuring (31), wherein the insulation layer (10), the component metallization (20) and the cooling part metallization (30) are arranged one above the other along a stacking direction (S), and wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions.

Abstract: Printed circuit board (100) for electrical components (5) and/or conducting paths (4), comprising a base body (2) extending along a main extension plane (HSE), and an insert (1) integrated in the base body (2), wherein the insert (1) comprises a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an encapsulation (10) enclosing at least the electrical and/or electronic component (5).

Abstract: A carrier substrate (1) for electrical components, in particular metal-ceramic substrate (1) for electrical components, comprising an insulation layer (10), the insulation layer (10) preferably having a material comprising a ceramic or a composite comprising at least one ceramic layer, a component metallization (20) which is formed on a component side (BS) and has a first primary structuring (21), and a cooling part metallization (30) which is formed on a cooling side (KS) opposite the component side (BS) and has a second primary structuring (31), wherein the insulation layer (10), the component metallization (20) and the cooling part metallization (30) are arranged one above the other along a stacking direction (S), and wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions.

Abstract: The present invention relates to a polyester-based thermoplastic composition which may be used for the manufacture of hollow bodies such as bottles, films and sheets, especially for packaging. It relates more particularly to a polyester-based thermoplastic composition and to films, hollow bodies or bottles obtained by forming this composition and having improved gas barrier and mechanical properties. The polyester composition comprises a mineral filler composed of a metal phosphate of a tetravalent metal, dispersed in the form of particles having a thickness of less than 40 nm. The compositions of the invention make it possible to obtain formed articles such as films or transparent preforms.

Abstract: The invention relates to materials comprising a thermoplastic matrix and at least particles based on phosphate of zirconium, titanium, cerium and/or silicon in the form of nanometric lamellar compounds having a shape factor of less than 100. The aforementioned materials can be used, for example, for the production of plastic parts, such as films, sheets, tubes, hollow or solid bodies, bottles, conduits or tanks.

Abstract: This invention relates to a process for the simultaneous co-production of ethyl acetate and n-butyl acetate. The process involves reacting a reaction mixture of ethanol, n-butanol and acetic acid in the liquid phase, in the presence of an acidic catalyst. The process is carried out in a series of reactor and distillation columns. The process is capable of using relatively impure reactants and provides for removing some of the aldehyde type impurities by the use of resin guard beds.