Abstract: A polyamide resin consisting of a main structural unit consisting of monomers selected from the group consisting of (I) at least one dimeric C10-30 carboxylic acid and (ii) at least one polyamine, preferably selected from the group consisting of diamines and triamines, and at least one polyorganosiloxane moiety covalently linked to the at least one main structural unit. Optionally at least one chain-terminating agent is covalently linked to the main structural unit. A process for preparing the polyamide resin, a release lacquer comprising the polyamide resin, and a film comprising the release lacquer on one surface and a layer of a pressure-sensitive adhesive on another surface are also disclosed.