Patents by Inventor Olivier Vendier

Olivier Vendier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200403288
    Abstract: An assembly includes a first waveguide and a second waveguide extending longitudinally along a first axis, each having an end, each comprising a first annular groove, the two ends being contiguous along the first axis, and an assembly device for assembling the first waveguide and the second waveguide, wherein the assembly device comprises a sleeve surrounding the ends of the first and second waveguides and having an inner wall comprising two first annular grooves facing the first annular grooves of the first and second waveguides, two reversibly deformable waveguides, each being positioned in a first annular groove of the sleeve and positioned in a first annular groove of the first and second waveguides, so as to block the first and second waveguides in terms of translation along the first axis.
    Type: Application
    Filed: June 17, 2020
    Publication date: December 24, 2020
    Inventors: Olivier VENDIER, Bertrand BREVART, Gilbert FOUCTIERE, Stéphane FORESTIER, Didier DUPUY, Brandon GRANT
  • Patent number: 10340567
    Abstract: A microwave switching device comprises: a switching matrix with M inputs and N outputs comprising at least one surface-mount microwave switch with ohmic contacts with at least one input and at least one output position; a control bus for the one or more microwave switches of the switching matrix; a telemetry bus for the M inputs; a telemetry bus for the N outputs; a bias tee positioned on each input of the switching matrix; and a bias tee positioned on each output of the switching matrix.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 2, 2019
    Assignee: THALES
    Inventors: Olivier Vendier, Raoul Rodriguez, Pierre-Yves Chabaud, Dominique Potuaud, Jérôme Battut, Johann Bornet, Thierry Adam, Jean-François Villemazet, François Grojean
  • Publication number: 20180269552
    Abstract: A microwave switching device comprises: a switching matrix with M inputs and N outputs comprising at least one surface-mount microwave switch with ohmic contacts with at least one input and at least one output position; a control bus for the one or more microwave switches of the switching matrix; a telemetry bus for the M inputs; a telemetry bus for the N outputs; a bias tee positioned on each input of the switching matrix; and a bias tee positioned on each output of the switching matrix.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 20, 2018
    Inventors: Olivier VENDIER, Raoul RODRIGUEZ, Pierre-Yves CHABAUD, Dominique POTUAUD, Jérôme BATTUT, Johann BORNET, Thierry ADAM, Jean-François VILLEMAZET, François GROJEAN
  • Patent number: 9232631
    Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: January 5, 2016
    Assignees: Thales, Centre National D'Etudes Spatiales
    Inventors: Olivier Vendier, David Nevo, Antoine Renel, Beatrice Espana
  • Patent number: 9108277
    Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 18, 2015
    Assignees: THALES, UNIVERSITE PAUL SEBATIER TOULOUSE III, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Olivier Vendier, Lidwine Raynaud, Valérie Baco, Michel Gougeon, Hoa Le Trong, Philippe Tailhades
  • Publication number: 20150181694
    Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 25, 2015
    Inventors: Olivier VENDIER, David NEVO, Antoine RENEL, Beatrice ESPANA
  • Patent number: 8850698
    Abstract: A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: October 7, 2014
    Assignee: Thales
    Inventors: Claude Drevon, Olivier Vendier, Walim Ben Naceur
  • Publication number: 20130001275
    Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicants: THALES, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE PAUL SABATIER TOULOUSE III
    Inventors: Olivier VENDIER, Lidwine RAYNAUD, Valérie BACO, Michel GOUGEON, Hoa LE TRONG, Philippe TAILHADES
  • Publication number: 20120266462
    Abstract: Method for the sealed assembly of an electronic housing containing one or more electronic components, the method including: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture including a paste and nanoparticles in suspension in said paste, the size of the nanoparticles ranging from 10 to 30 nm; and closing the housing in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.
    Type: Application
    Filed: November 10, 2010
    Publication date: October 25, 2012
    Applicant: THALES
    Inventors: Claude Drevon, Olivier Vendier, Walim Ben Naceur
  • Publication number: 20120152612
    Abstract: A signal transfer device which can be used to transfer a signal through a wall of a power package including a base, the wall bounding an internal part and an external part, said device including a first signal line portion outside the package; a second signal line portion inside the package; and a third signal line portion connecting the other two portions, wherein the first portion is shifted from the wall so as to respect a predefined safety distance; and the third portion is buried over its entire length.
    Type: Application
    Filed: September 2, 2010
    Publication date: June 21, 2012
    Applicant: THALES
    Inventors: Claude Drevon, Olivier Vendier, David Nevo
  • Publication number: 20110220850
    Abstract: A stable solution of molecular material includes a first type of organic or organometallic molecule and a second type of organic or organometallic molecule or of ion. The first type has groups allowing electron delocalization. The solution further includes a third type of molecule that may be a surfactant or a solvent, capable of combining with the first or the second type of molecule or of ion), to form an adduct in solution whose presence prevents the precipitation of a compound formed by reaction between the first and second types of molecules, and makes it possible to obtain solutions whose concentration of the compound is greater than that governed by the precipitation constant of the compound in the absence of molecules of the third type.
    Type: Application
    Filed: March 10, 2011
    Publication date: September 15, 2011
    Applicants: THALES, CENTRE NATIONAL D'ETUDES SPATIALES CNES, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Matthieu Souque, Olivier Vendier, Lydie Valade, Dominique De Caro, Jean-Michel Desmarres, Frédéric Courtade
  • Patent number: 6754405
    Abstract: An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: June 22, 2004
    Assignee: Alcatel
    Inventors: Olivier Vendier, Marc Huan, Sylvain Paineau
  • Patent number: 6730997
    Abstract: The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer. The method may be used to form a stack of dies (4, 14 . . . ) which are adhered together by cured polymeric layers (7, 17). Each die (4, 14 . . . ) may include a device layer and an ultra-thin substrate manufactured and assembled by the method described above.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: May 4, 2004
    Assignees: Imec VZW, Alcatel
    Inventors: Eric Beyne, Augustin Coello-Vera, Olivier Vendier
  • Patent number: 6683373
    Abstract: A method of obtaining a module (4), and the module obtained, from modular electronic components encapsulated in flat monoblock packages (1A) in which elements constituting the components are buried and from which project laterally conductive connecting leads (3A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: January 27, 2004
    Assignee: Alcatel
    Inventors: Olivier Vendier, Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan
  • Publication number: 20030060034
    Abstract: The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer.
    Type: Application
    Filed: July 25, 2002
    Publication date: March 27, 2003
    Applicant: IMEC vzw, a research center in the country of Belgium
    Inventors: Eric Beyne, Augustin Coello-Vera, Olivier Vendier
  • Publication number: 20010050430
    Abstract: An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 13, 2001
    Applicant: ALCATEL
    Inventors: Olivier Vendier, Marc Huan, Sylvain Paineau