Abstract: A system includes input or output channels linked to nominal and redundant equipment items, and at least one redundancy matrix for routing the signals of a channel from one equipment item to a redundant or nominal equipment item, represented by a connection grid having rows corresponding to the channels of the system and columns corresponding to the equipment items of the system, and connection points comprising: the points of intersection of a nominal path situated on a nominal diagonal of the connection grid, and the points of intersection of a redundant path of the connection grid situated between each row corresponding to a channel Ci and a column corresponding to a redundant element Rƒ(i) of index ƒ(i), f being surjective, the redundancy matrix being implemented in the form of a circuit comprising switches arranged according to the connection grid.

Abstract: A process for manufacturing a multi-material part by additive manufacturing, includes the following steps: a) a step of providing a pre-treated metal powder comprising grains and an oxidized and porous layer on a surface of the grains; b) a selective laser powder-bed fusion step comprising implementation of steps i) and ii) as follows: i) a step of forming a layer from the pre-treated metal powder; ii) a step of melting by laser the layer, the melting step being carried out under a reactive atmosphere and comprising changing parameters of application of the laser so that at least a first region of the layer is converted so as to lower the electrical conductivity thereof, thus forming a dielectric, and so that at least a second region of the layer is densified without converting it, the at least a first region being formed when the parameters of application of the laser allow a first energy density to be applied to the first region and/or the laser beam to be kept for a first dwell time on the first region, th

Abstract: An assembly includes a first waveguide and a second waveguide extending longitudinally along a first axis, each having an end, each comprising a first annular groove, the two ends being contiguous along the first axis, and an assembly device for assembling the first waveguide and the second waveguide, wherein the assembly device comprises a sleeve surrounding the ends of the first and second waveguides and having an inner wall comprising two first annular grooves facing the first annular grooves of the first and second waveguides, two reversibly deformable waveguides, each being positioned in a first annular groove of the sleeve and positioned in a first annular groove of the first and second waveguides, so as to block the first and second waveguides in terms of translation along the first axis.

Abstract: An assembly includes a first waveguide and a second waveguide extending longitudinally along a first axis, each having an end, each comprising a first annular groove, the two ends being contiguous along the first axis, and an assembly device for assembling the first waveguide and the second waveguide, wherein the assembly device comprises a sleeve surrounding the ends of the first and second waveguides and having an inner wall comprising two first annular grooves facing the first annular grooves of the first and second waveguides, two reversibly deformable waveguides, each being positioned in a first annular groove of the sleeve and positioned in a first annular groove of the first and second waveguides, so as to block the first and second waveguides in terms of translation along the first axis.

Abstract: A microwave switching device comprises: a switching matrix with M inputs and N outputs comprising at least one surface-mount microwave switch with ohmic contacts with at least one input and at least one output position; a control bus for the one or more microwave switches of the switching matrix; a telemetry bus for the M inputs; a telemetry bus for the N outputs; a bias tee positioned on each input of the switching matrix; and a bias tee positioned on each output of the switching matrix.

Abstract: A microwave switching device comprises: a switching matrix with M inputs and N outputs comprising at least one surface-mount microwave switch with ohmic contacts with at least one input and at least one output position; a control bus for the one or more microwave switches of the switching matrix; a telemetry bus for the M inputs; a telemetry bus for the N outputs; a bias tee positioned on each input of the switching matrix; and a bias tee positioned on each output of the switching matrix.

Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.

Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.

Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.

Abstract: A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.

Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.

Abstract: Method for the sealed assembly of an electronic housing containing one or more electronic components, the method including: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture including a paste and nanoparticles in suspension in said paste, the size of the nanoparticles ranging from 10 to 30 nm; and closing the housing in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.

Abstract: A signal transfer device which can be used to transfer a signal through a wall of a power package including a base, the wall bounding an internal part and an external part, said device including a first signal line portion outside the package; a second signal line portion inside the package; and a third signal line portion connecting the other two portions, wherein the first portion is shifted from the wall so as to respect a predefined safety distance; and the third portion is buried over its entire length.

Abstract: A stable solution of molecular material includes a first type of organic or organometallic molecule and a second type of organic or organometallic molecule or of ion. The first type has groups allowing electron delocalization. The solution further includes a third type of molecule that may be a surfactant or a solvent, capable of combining with the first or the second type of molecule or of ion), to form an adduct in solution whose presence prevents the precipitation of a compound formed by reaction between the first and second types of molecules, and makes it possible to obtain solutions whose concentration of the compound is greater than that governed by the precipitation constant of the compound in the absence of molecules of the third type.

Abstract: An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.

Abstract: The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer. The method may be used to form a stack of dies (4, 14 . . . ) which are adhered together by cured polymeric layers (7, 17). Each die (4, 14 . . . ) may include a device layer and an ultra-thin substrate manufactured and assembled by the method described above.

Abstract: A method of obtaining a module (4), and the module obtained, from modular electronic components encapsulated in flat monoblock packages (1A) in which elements constituting the components are buried and from which project laterally conductive connecting leads (3A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.

Abstract: The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer.

Abstract: An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.