Abstract: Embodiments of lift pin assemblies and substrate supports having such lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes a body with a first end including a flange and an opposing second end; a bore through the body from the first end to the second end; a profile on an outer surface proximate a second end; and a collar, wherein the profile is configured to removably lock the collar onto the second end.

Abstract: Embodiments of substrate supports and sealing rings for use in a substrate support are provided herein. In some embodiments, a substrate support structure includes an arcuate sealing piece having a first side including a generally planar support surface; a first arcuate portion; a second arcuate portion disposed radially inward of the first arcuate portion; a first end portion comprising a first arcuate extension extending from the first arcuate portion; and a second end portion comprising a second arcuate extension extending from the second arcuate portion.

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.

Abstract: In some embodiments, an apparatus for variable substrate temperature control may include a heater moveable along a central axis of a substrate support; a seal ring disposed about the heater, the seal ring configured to interface with a shadow ring disposed above the heater to form a seal; a plurality of spacer pins configured to support a substrate and disposed within a plurality of through holes formed in the heater, the plurality of spacer pins moveable parallel to the central axis, wherein the plurality of spacer pins control a first distance between the substrate and the heater and a second distance between the substrate and the shadow ring; and a resilient element disposed beneath the seal ring to bias the seal ring toward a backside surface of the heater.

Abstract: Substrate supports are provided herein, In some embodiments, a substrate support includes a first plate; a plurality of vacuum passages disposed through the first plate; a plurality of vertical passages formed partially into the first plate; a plurality of horizontal passages disposed in the first plate, each of the plurality of horizontal passages beginning proximate a perimeter of the first plate and terminating proximate one of the plurality of vertical passages such that the horizontal passages and the vertical passages are in fluid communication; a second plate coupled to the first plate at an interface; an elongate shaft having a vacuum line and an edge purge line internal to the shaft; a vacuum channel formed at the interface fluidly coupling the vacuum line to the plurality of vacuum passages; and an edge purge channel formed at the interface fluidly coupling the edge purge line to the plurality of vertical passages.

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of the plurality of first support elements.

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first aluminum plate for supporting a substrate, the first aluminum plate having a plurality of heating elements embedded therein to provide a plurality of heating zones; a second aluminum plate disposed beneath and supporting the first aluminum plate; a third aluminum plate disposed beneath and supporting the second aluminum plate; a non-metallic ring disposed atop the first aluminum plate; and a plurality of spacers having an upper portion disposed above a surface of the first aluminum plate, wherein the non-metallic ring and the plurality of spacers support the substrate above the first aluminum plate.

Abstract: Embodiments of substrate supports having a wire mesh plasma containment are provided herein. In some embodiments, a substrate support may include a plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the plate; at least one electrical connection between the wire mesh and the ground connector; and an elongate shaft comprising a first end and an opposite second end, wherein the plate second surface is mounted to the first end of the shaft.

Abstract: A bridge assembly includes an electrically insulating hollow tube or bridge having a pair of ends, the bridge being supported at one of the ends over the cylindrical side wall and being supported at the other of the ends over the electrode. The bridge assembly further includes a set of conductive rings surrounding the hollow tube and spaced from one another along the length of the bridge, and plural electrically resistive elements. Each of the resistive elements has a pair of flexible connectors, respective ones the resistive elements connected at their flexible connectors between respective pairs of the rings to form a series resistor assembly.

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.

Abstract: A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.

Abstract: Embodiments of lift pin assemblies and substrate supports having such lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes a body with a first end including a flange and an opposing second end; a bore through the body from the first end to the second end; a profile on an outer surface proximate a second end; and a collar, wherein the profile is configured to removably lock the collar onto the second end.

Abstract: Embodiments of heated substrate supports are provided herein, In some embodiments, a heated substrate support includes a support plate having a top surface and an opposite bottom surface; and a first heater disposed within the support plate, wherein the first heater is disposed beneath a mid-plane of the support plate, and wherein the first heater is disposed proximate a central zone of the support plate.

Abstract: Embodiments of substrate supports and sealing rings for use in a substrate support are provided herein. In some embodiments, a substrate support structure includes an arcuate sealing piece having a first side including a generally planar support surface; a first arcuate portion; a second arcuate portion disposed radially inward of the first arcuate portion; a first end portion comprising a first arcuate extension extending from the first arcuate portion; and a second end portion comprising a second arcuate extension extending from the second arcuate portion.

Abstract: Substrate supports are provided herein, In some embodiments, a substrate support includes a first plate; a plurality of vacuum passages disposed through the first plate; a plurality of vertical passages formed partially into the first plate; a plurality of horizontal passages disposed in the first plate, each of the plurality of horizontal passages beginning proximate a perimeter of the first plate and terminating proximate one of the plurality of vertical passages such that the horizontal passages and the vertical passages are in fluid communication; a second plate coupled to the first plate at an interface; an elongate shaft having a vacuum line and an edge purge line internal to the shaft; a vacuum channel formed at the interface fluidly coupling the vacuum line to the plurality of vacuum passages; and an edge purge channel formed at the interface fluidly coupling the edge purge line to the plurality of vertical passages.

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of plurality of first support elements.

Abstract: Provided are apparatus and methods for depositing materials by vapor deposition and plasma enhanced vapor deposition techniques, and more particularly a gas distribution assembly and vapor deposition chamber to deposit a material. The gas distribution assembly comprises a plurality of sections with each section containing a flow channel with passages extending from the flow channel to the processing region of a processing chamber.

Abstract: Embodiments of substrate supports having a wire mesh plasma containment are provided herein. In some embodiments, a substrate support may include a plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the plate; at least one electrical connection between the wire mesh and the ground connector; and an elongate shaft comprising a first end and an opposite second end, wherein the plate second surface is mounted to the first end of the shaft.

Abstract: In some embodiments, a modular chemical delivery system may include a plurality of gas delivery units directly and removably coupled to each other, wherein each gas delivery unit includes a body with a first volume, a plurality of gas sticks disposed in the first volume, wherein each of the plurality of gas sticks is configured to be coupled to at least one gas supply through one or more inlets in the body, a plurality of valves disposed in the first volume, each valve respectively disposed in line with a corresponding one of the at least one gas supply, at least one outlet conduit to deliver at least one process gas to one or more gas delivery zones in a process chamber, and an electrical controller disposed in the first volume and configured to control the plurality of gas sticks and the plurality of valves.

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first aluminum plate for supporting a substrate, the first aluminum plate having a plurality of heating elements embedded therein to provide a plurality of heating zones; a second aluminum plate disposed beneath and supporting the first aluminum plate; a third aluminum plate disposed beneath and supporting the second aluminum plate; a non-metallic ring disposed atop the first aluminum plate; and a plurality of spacers having an upper portion disposed above a surface of the first aluminum plate, wherein the non-metallic ring and the plurality of spacers support the substrate above the first aluminum plate.