Abstract: A power semiconductor module includes a first main electrode, a second main electrode and a control terminal. The power semiconductor module includes controllable power semiconductor components arranged between the first main electrode and the second main electrode. At least some of the controllable power semiconductor components are arranged in a ring arrangement, wherein the controllable power semiconductor components of the ring arrangement are arranged at least approximately along a first circular line of the ring arrangement, and a control conductor track of the ring arrangement is arranged on the first main electrode, wherein the control conductor track runs at least approximately along a second circular line of the ring arrangement, and the second circular line runs concentrically relative to the first circular line.

Abstract: A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.

Abstract: A remotely controllable grounding system including at least one movable rod element having at least one conductive and isolating sections and at least one conductor configured to be electrically connected to ground and the movable rod element. The grounding system including at least one pair of positive and negative grounding terminals arranged to be fixedly connected to electric equipment to be grounded. The grounding system includes a rod propulsion system arranged to be remotely controlled and configured to move the at least one movable rod element from an ungrounded position (U), in which the positive and negative grounding terminals are isolated from one another by the isolating section, into a grounded position (G), in which the positive and negative grounding terminals are galvanically connected with one another by the conductive section and in which grounded position the conductive section is connected to ground via the at least one conductor.

Abstract: A remotely controllable grounding system including at least one movable rod element having at least one conductive and isolating sections and at least one conductor configured to be electrically connected to ground and the movable rod element. The grounding system including at least one pair of positive and negative grounding terminals arranged to be fixedly connected to electric equipment to be grounded. The grounding system includes a rod propulsion system arranged to be remotely controlled and configured to move the at least one movable rod element from an ungrounded position (U), in which the positive and negative grounding terminals are isolated from one another by the isolating section, into a grounded position (G), in which the positive and negative grounding terminals are galvanically connected with one another by the conductive section and in which grounded position the conductive section is connected to ground via the at least one conductor.

Abstract: A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.

Abstract: A power semiconductor module includes a first main electrode, a second main electrode and a control terminal. The power semiconductor module includes controllable power semiconductor components arranged between the first main electrode and the second main electrode. At least some of the controllable power semiconductor components are arranged in a ring arrangement, wherein the controllable power semiconductor components of the ring arrangement are arranged at least approximately along a first circular line of the ring arrangement, and a control conductor track of the ring arrangement is arranged on the first main electrode, wherein the control conductor track runs at least approximately along a second circular line of the ring arrangement, and the second circular line runs concentrically relative to the first circular line.

Abstract: A high-power resistor comprises a plurality of resistor elements (1), made of sheets of an electrically conductive resistance material, with a first (13) and a second (14) terminal. The resistor elements are mutually separated by disc-shaped insulating first shims (2). Said first and second terminals are connected to adjacently located resistor elements so that the respective first terminals are connected to a first terminal and that the respective second terminals are connected to a second terminal. Two adjacent resistor elements form a current path, whereby, viewed in a direction perpendicular to the plane of the sheets, said first and second terminals, respectively, are so mutually positioned that, for a current supplied thereto, the current path in one resistor element substantially overlaps the current path in an adjacent resistor element and hence carries current in mutually opposite directions in the two adjacent resistor elements.

Abstract: A high-power resistor comprises a plurality of resistor elements (1), made of sheets of an electrically conductive resistance material, with a first (13) and a second (14) terminal. The resistor elements are mutually separated by disc-shaped insulating first shims (2). Said first and second terminals are connected to adjacently located resistor elements so that the respective first terminals are connected to a first terminal and that the respective second terminals are connected to a second terminal. Two adjacent resistor elements form a current path, whereby, viewed in a direction perpendicular to the plane of the sheets, said first and second terminals, respectively, are so mutually positioned that, for a current supplied thereto, the current path in one resistor element substantially overlaps the current path in an adjacent resistor element and hence carries current in mutually opposite directions in the two adjacent resistor elements.

Abstract: In a VSC-converter for converting direct voltage to alternating voltage and conversely at least one phase leg (2) is arranged according to a NPC-connection. At least two of the four current valves (3-6) and the clamping rectifying members (10, 11) thereof are arranged close to each other and so that commutation currents generated on commutation of the converter therein will flow in substantially opposite directions.

Abstract: A tubular core (6) for a controllable inductor with a main winding (1) surrounding the core and a control winding (7) passing substantially axially through the core. The core (6) is capable of receiving a magnetic flux from the main winding (1) running substantially axially therethrough and having a plurality of core rings (8) stacked co-axially on top of each other and connected to a rigid unit. The core rings (8) are connected to each other forming a walled construction. The core (6) also has an inner envelope (18) with an outer cross-section that is substantially equal to the inner cross-section of the core ring walled construction. The walled construction has joints (16) between the core rings (8) in an axial direction which are overlapped by a part of the envelope (18).

Abstract: A gas-insulated semiconductor valve for high voltage power has an elongated valve stack with a plurality of semiconductor elements. The valve stack is provided with electrostatic shields for reducing the stresses on the insulating medium. The shields comprise a plurality of annular shields distributed along the longitudinal axis of the valve stack. The shields are arranged in planes which are substantially perpendicular to the longitudinal axis of the stack and surround the valve stack. The curved part of each shield has a substantially constant radius of curvature.

Abstract: An apparatus for interconnection in a voltage-stiff converter is provided. The converter has at least one phase leg with at least two current valves. The apparatus connects a current valve with a respective pole conductor. A cable extends between an end of the phase leg and a capacitor which defines a direct voltage. The cables attached to different poles are arranged close beside each other and are made of an insulation layer of polymer base which surrounds a conductor.

Abstract: A VSC converter has each current valve of a phase leg formed by a plurality of units of semiconductor elements and rectifying members, located on top of each other forming at least one stack. The phase leg is constructed according to the flat cable principle with the phase leg formed by such stacks arranged side by side in pairs at small distances (d) running back and forth. A cooling plate of electrically conducting material is arranged between each unit in the stacks.

Abstract: The invention relates to a new arrangement of at least one valve stack (2) for high voltage direct current in a valve hall (1). Said valve stack (2) has a voltage to ground which, in operation, increases along the stack (2). The invention comprises arranging the stack (2) in a substantially lying position at such a distance from the floor and roof (9), respectively, of the valve hall (1) that the smallest electrical flashover distance between live parts on the stack (2) and said floor and roof (9), respectively, is at least contained. Further, the electrical connection is arranged via bushings through the roof (9) of the valve hall (1).