Abstract: In a method in the fabrication of an organic thin-film semiconducting device comprising an electrode arrangement with electrodes contacting a semiconducting organic material, an anode in the electrode arrangement is made as a two-layer structure, where the first layer is a conducting or semiconducting material or a combination thereof deposited on a substrate and a second layer is a conducting polymer with a work function higher than that of the material in the first layer. A third layer consisting of semiconducting organic material and forming the active material of the device is deposited on the top of the anode, and the cathode made of a fourth layer of a metal deposited on a third layer. In a preferred embodiment a low work function metal is used in the first layer, a doped conjugated polymer such as PEDOT-PSS in the second layer, while the cathode may be formed of the same metal as used in the first layer.

Abstract: Microactuator comprising a volume changing layer (1) and a carrier substrate layer (2) carrying the volume changing layer (1), the microactuator also comprising a reinforcing structure (3) having an unevenly distributed bending stiffness and that the reinforcing structure (3) is spread over any of the layers (1), (2) to control the movement of the microactuator.

Abstract: Polymer microgel particles dispersed in an aqueous medium. PEDOT-PSS complex, with excess fixed negative charge and dispersed in aqueous media are crosslinked. Because of the network structure and due to the gel nature of the particles used as its building block, provides the prepared gel material with excellent access of the electrolyte solution to the polymer chains. The electrical connectivity of the polymer chains is further improved by eletropolymerization of another conducting polymer, such as polypyrrole (PPy), polyaniline (PAni), using the polymer gel as the template.

Abstract: The invention relates to a method for manufacturing a micromachined structure to be at least partly released from a substrate surface. A surface contact area, over which structure and the said substrate surface are in surface contact with each other during the manufacturing step, is divided into at least a first and a second contact zone, the adhesiveness between the structure and the substrate being greater in the first contact zone than in the second contact zone. As a manufacturing step, or as a step subsequent to the manufacturing, the structure can be released from the substrate surface at least over said second contact zone. The completed structure may also be completely loose from the substrate. The invention is also directed to a micromachined structure manufactured according to the method.

Abstract: The invention relates to a method for the preparation of electronic and electro-optical components and circuits based on conducting polymers. One or more boundary surfaces in the component between a conducting polymer and another material are formed by melting of the conducting polymer.