Abstract: A strengthened structural module (2) and a method for fabricating a strengthened structural module (2). The module comprises an essentially planar glass substrate (1), an essentially planar second substrate (3), and at least one spacer element (5) in between the glass substrate (1) and the second substrate (3). The at least one spacer element (5) keeps the glass substrate (1) and the second substrate (3) separated from each other from the edges of the two substrates and defines a space (7) in between the two substrates in the inside of the module. The module comprises a coating (9) surrounding the module around the outside of the module. The coating (9) is arranged conformally on the surfaces facing the outside of the module, for increasing the strength of the module.

Abstract: A strengthened structural module (2) and a method for fabricating a strengthened structural module(2). The module comprises an essentially planar glass substrate (1), an essentially planar second substrate (3), and at least one spacer element (5) in between the glass substrate (1) and the second substrate (3). The at least one spacer element (5) keeps the glass substrate (1) and the second substrate (3) separated from each other from the edges of the two substrates and defines a space (7) in between the two substrates in the inside of the module. The module comprises a coating (9) surrounding the module around the outside of the module. The coating (9) is arranged conformally on the surfaces facing the outside of the module, for increasing the strength of the module.

Abstract: A multilayer coating and a method for fabricating a multilayer coating on a substrate (3). The coating is arranged to minimize diffusion of atoms through the coating, the method comprising the steps of introducing a substrate (3) to a reaction space, depositing a layer of first material (1) on the substrate (3), and depositing a layer of second material (2) on the layer of first material (1). Depositing the layer of first material (1) and the layer of second material (2) comprises alternately introducing precursors into the reaction space and subsequently purging the reaction space after each introduction of a precursor. The first material being selected from the group of titanium oxide and aluminum oxide, the second material being the other from the group of titanium oxide and aluminum oxide. An interfacial region is formed in between titanium oxide and aluminum oxide.a.

Abstract: In accordance with one aspect of the present invention, a method is provided for transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer chamber and the process chamber. The method comprises vacuum pumping the transfer chamber to achieve a first pressure in the transfer chamber and vacuum pumping the process chamber to achieve a second pressure in the process chamber. An inert gas is flowed into the transfer chamber and shut off in the process chamber. The transfer chamber is isolated from pumping, but pumping continues from the process chamber. The gate valve is opened after isolating the transfer chamber from pumping. The workpiece is then transferred between the transfer chamber and the process chamber. A definitive flow direction from transfer chamber to process chamber is thereby achieved, minimizing risk of back-diffusion.

Abstract: In accordance with one aspect of the present invention, a method is provided for transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer chamber and the process chamber. The method comprises vacuum pumping the transfer chamber to achieve a first pressure in the transfer chamber and vacuum pumping the process chamber to achieve a second pressure in the process chamber. An inert gas is flowed into the transfer chamber and shut off in the process chamber. The transfer chamber is isolated from pumping, but pumping continues from the process chamber. The gate valve is opened after isolating the transfer chamber from pumping. The workpiece is then transferred between the transfer chamber and the process chamber. A definitive flow direction from transfer chamber to process chamber is thereby achieved, minimizing risk of back-diffusion.