Patents by Inventor Omar A. Janducayan

Omar A. Janducayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090166826
    Abstract: Disclosed are die paddle structures for leadframes and methods of attaching die to the die paddles. An exemplary die paddle comprises a sloped wall disposed around an attachment area for a die, where the sloped wall has an obtuse angle of inclination with respect to the attachment area. In one exemplary die-attachment process, solder material is disposed on the attachment area and/or the metalized back surface of a die, the die is placed over the attachment area and substantially within the opening defined by the sloped wall, and the solder is reflowed while the die is allowed to float over the reflowed solder free of external forces from a die-placement tool and to align itself to the sloped wall. Die paddles and attachment methods of the invention reduce the alignment tolerances needed to place the die.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Inventors: Omar A. Janducayan, Romolo Bactasa, Andrew Abarrientos