Abstract: Method for coating a substrate with a coating material is described, in particular with a coating or photoresist, wherein said substrate is provided in said method. Said coating material is applied to said upper side of said substrate. A gas flow is generated, said gas flow being directed from said underside of said substrate to said upper side of said substrate, wherein said gas flow prevents a bead of said coating material forming on said edge of said upper side of said substrate or a previously existing bead is removed by means of said gas flow. In addition, a coating system is described.

Abstract: A method for curing at least in part a photoresist applied to a substrate comprises the following steps: The substrate coated with the photoresist is arranged on a support. The photoresist is subjected to a suitable temperature for curing the photoresist for a first predetermined time period. After the first predetermined time period has passed, the substrate is lifted from the support, rotated, re-placed onto the support and subjected to a suitable temperature for curing the photoresist for a second predetermined time period. This method can be performed with a device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in the chamber and on which the substrate can be arranged, and a rotating device for rotating the substrate between a first and a second phase of the curing of the photoresist.

Abstract: Method for coating a substrate with a coating material is described, in particular with a coating or photoresist, wherein said substrate is provided in said method. Said coating material is applied to said upper side of said substrate. A gas flow is generated, said gas flow being directed from said underside of said substrate to said upper side of said substrate, wherein said gas flow prevents a bead of said coating material forming on said edge of said upper side of said substrate or a previously existing bead is removed by means of said gas flow. In addition, a coating system is described.

Abstract: A method for curing at least in part a photoresist applied to a substrate comprises the following steps: The substrate coated with the photoresist is arranged on a support. The photoresist is subjected to a suitable temperature for curing the photoresist for a first predetermined time period. After the first predetermined time period has passed, the substrate is lifted from the support, rotated, re-placed onto the support and subjected to a suitable temperature for curing the photoresist for a second predetermined time period. This method can be performed with a device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in the chamber and on which the substrate can be arranged, and a rotating device for rotating the substrate between a first and a second phase of the curing of the photoresist.

Abstract: A device for applying a coating to a substrate comprises a metering device by means of which a coating fluid can be applied to the substrate as a jet, and a solvent dispenser which is arranged eccentrically and to the side of the front end of the metering device in such a way that a predetermined amount of solvent can be administered to the front end of the metering device. This device can implement a method for applying a coating to a substrate wherein, before the coating fluid is applied, a predetermined amount of solvent is brought to the front end of the metering device in such a way that the solvent comes into contact with the coating fluid located there. After a waiting period, the coating fluid is subsequently applied to the substrate by means of the metering device.