Abstract: Methods of and devices for providing escaping routes for the flux and gases generated to move away from the solder joint in the process of solder joint formation.

Abstract: A method and system for a preheating step of a wave soldering process. A bottom side preheater is positioned underneath a PCB and a thermal carrier is positioned adjacent the PCB. A top side heater may also be used. The PCB includes one or more through holes, and an electronic component having one or more pins is mounted on the PCB so that each pin is positioned in a corresponding through hole. The bottom side preheater directs heat to the bottom surface of the PCB, thereby heating the bottom surface via heat convection. The thermal carrier directs heated air laterally across the top surface of the PCB to increase a heat transfer at the top surface without increasing the temperature of the electronic component, thereby reducing a temperature differential between the top and bottom surfaces.

Abstract: Methods of and devices for providing escaping routes for the flux and gases generated to move away from the solder joint in the process of solder joint formation.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.