Patents by Inventor Omar Mahmoud

Omar Mahmoud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12051313
    Abstract: The disclosure describes a system for monitoring and mitigating damage to electrical utility structures and the surrounding environment. In some embodiments, the system includes fire boxes, arc sensors, angle switches, and disconnect switches configured to generate alert signals when a hazard is detected. In some embodiments, the system includes cameras configured to detect a hazard such as a fire or moving object. In some embodiments, the system includes light transmitters and light receivers positioned at a predetermined location away from power lines to detect objects that interrupt a line of site. In some embodiments, the system can electrically isolate a power line before a detected hazard impacts a power line.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: July 30, 2024
    Assignee: PACIFIC GAS AND ELECTRIC COMPANY
    Inventors: Omar Mahmoud, Gavin Fong, Dave Chua, Richard Fields
  • Patent number: 11947972
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 2, 2024
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
  • Patent number: 11925199
    Abstract: An automatic sandwich machine is provided. The machine receives customer selections for a number of sandwiches and combinations of toppings and sauces, and allows the customer to make a payment for the sandwiches. The machine places a bread piece into a bread heater, and while the bread heater is heating the bread piece, sprays sauces according to the customer selection and prepares a pre-determined amount of toppings according to a customer selection, a pre-determined amount of sliced meat from a grilled sandwich cone, and a pre-determined amount of cheese. The machine places toppings, sliced meat, and cheese onto the bread piece. The machine then wraps the bread piece to obtain a sandwich. Thereafter, the machine roasts the sandwich and places it into a packet. Finally, the machine delivers the packet with the sandwich to the customer via an outlet.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: March 12, 2024
    Inventor: Omar Mahmoud Elmais
  • Patent number: 11797353
    Abstract: Techniques described herein relate to systems, methods, and non-transitory computer readable mediums for performing workloads on hardware configurations. The method includes determining compliant hardware configurations of the data cluster using workload features associated with the workload, hardware specification information associated with hardware of data nodes of a data cluster, and a first machine learning model; generating performance predictions associated with the compliant hardware configurations using the workload features, a portion of the hardware specification information associated with the compliant hardware configurations, and a second machine learning model; and generating a recommendation using the performance predictions, and the recommendation specifies a hardware configuration of the compliant hardware configurations. The workload is performed using the recommendation.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: October 24, 2023
    Assignee: EMC IP Holding Company LLC
    Inventors: Omar Mohammed Mohammed Abdulaal, Shary George Waheeb Beshara, Mohamed Shaaban, Ahmad Refaat Abdelfadeel Ahmad ElRouby, Omar Mahmoud Ahmed Kamal Ibrahim
  • Publication number: 20220406158
    Abstract: The disclosure describes a system for monitoring and mitigating damage to electrical utility structures and the surrounding environment. In some embodiments, the system includes fire boxes, arc sensors, angle switches, and disconnect switches configured to generate alert signals when a hazard is detected. In some embodiments, the system includes cameras configured to detect a hazard such as a fire or moving object. In some embodiments, the system includes light transmitters and light receivers positioned at a predetermined location away from power lines to detect objects that interrupt a line of site. In some embodiments, the system can electrically isolate a power line before a detected hazard impacts a power line.
    Type: Application
    Filed: July 1, 2022
    Publication date: December 22, 2022
    Inventors: Omar Mahmoud, Gavin Fong, Dave Chua, Richard Fields
  • Patent number: 11476182
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 18, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • Publication number: 20220329245
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • Publication number: 20220319967
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • Patent number: 11418196
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 16, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • Publication number: 20220138019
    Abstract: A method for performing workloads is performed by a recommendation engine.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Inventors: Omar Mohammed Mohammed Abdulaal, Shary George Waheeb Beshara, Mohamed Shaaban, Ahmad Refaat AbdelFadeel Ahmad ElRouby, Omar Mahmoud Ahmed Kamal Ibrahim
  • Publication number: 20210365273
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Application
    Filed: August 5, 2021
    Publication date: November 25, 2021
    Applicant: North Sea Investment Co. Ltd.
    Inventors: Meng YAN, Omar Mahmoud Afdal ALNAGGAR, Myron O. SHAK, Soheil GHARAHI, William KELSEY
  • Patent number: 11113076
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 7, 2021
    Assignee: North Sea Investment Co. Ltd.
    Inventors: Meng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
  • Publication number: 20210126641
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Application
    Filed: June 28, 2018
    Publication date: April 29, 2021
    Applicant: North Sea Investment Co. Ltd.
    Inventors: Meng YAN, Omar Mahmoud Adfal ALNAGGER, Myron O. SHAK, Soheil GHARAHI
  • Patent number: 10812341
    Abstract: An apparatus in one embodiment comprises at least one processing device having a processor coupled to a memory. The processing device is configured to receive results of intermediate percentile computations performed on respective ones of a plurality of datasets in respective ones of a plurality of distributed processing nodes configured to communicate over at least one network. The processing device is further configured to perform at least one global percentile computation based at least in part on the results of the intermediate percentile computations, and to utilize results of the intermediate and global percentile computations to populate an interactive user interface associated with at least a given one of the distributed processing nodes. The distributed processing nodes are illustratively associated with respective distinct data zones in which the respective datasets are locally accessible to the respective distributed processing nodes.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: October 20, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Fernanda M. Campello De Souza, Patricia Gomes Soares Florissi, Omar Mahmoud, Ahmed Nader, Ahmed Osama
  • Publication number: 20200279798
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Application
    Filed: October 8, 2018
    Publication date: September 3, 2020
    Applicant: zGlue Inc.
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • Publication number: 20190108043
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 11, 2019
    Applicant: zGlue, Inc.
    Inventors: Meng YAN, Omar Mahmoud Afdal ALNAGGAR, Myron O. SHAK, Soheil GHARAHI, William KELSEY
  • Patent number: 10037865
    Abstract: The present invention relates to a system and method for providing real-time visual feedback to automatically control actions of multiple autonomous nano-robots with manipulators in order to perform specific nano-manipulation or nano-assembly tasks. In the system and method of the present invention, the visual feedback is obtained for the nano-manipulators and the nano-components via an electronic microscopy system. The system of the present invention comprises essentially at least one slave Scanning Electron Microscope (SEM) with imaging system deployed with autonomous manipulators inside, and a master controller system with Graphical User Interface (GUI). In the system of the present invention, said slave SEM provides real-time vision feedback for the sensed environment for said master controller, and said master controller provides real-time feedback control command for the required task to said slave SEM.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: July 31, 2018
    Assignee: JORDAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Mohamed Ghazi Daifalla Al-Fandi, Mohammad Abdel Majeed Fandi Al Rousan, Mohammad Abdel Kareem Rasheed Jaradat, Fahed Hasan Fahed Awad, Inad AbedAlmohdi Rida Aljarrah, Omar Mahmoud Mohammad Al-Jarrah
  • Publication number: 20170076909
    Abstract: The present invention relates to a system and method for providing real-time visual feedback to automatically control actions of multiple autonomous nano-robots with manipulators in order to perform specific nano-manipulation or nano-assembly tasks. In the system and method of the present invention, the visual feedback is obtained for the nano-manipulators and the nano-components via an electronic microscopy system. The system of the present invention comprises essentially at least one slave Scanning Electron Microscope (SEM) with imaging system deployed with autonomous manipulators inside, and a master controller system with Graphical User Interface (GUI). In the system of the present invention, said slave SEM provides real-time vision feedback for the sensed environment for said master controller, and said master controller provides real-time feedback control command for the required task to said slave SEM.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 16, 2017
    Inventors: Mohamed Ghazi Daifalla AL-FANDI, Mohammad Abdel MajeedFandi AL ROUSAN, Mohammad Abdel Kareem Rasheed JARADAT, Fahed Hasan Fahed AWAD, Inad AbedAlmohdi Rida ALJARRAH, Omar Mahmoud Mohammad AL-JARRAH
  • Patent number: 5765041
    Abstract: Data is transferred from a host system to a subsystem connected to the host by a system bus in an efficient manner using one or more virtual first in first out (FIFO) registers in host memory and a corresponding set of virtual FIFOs located in the subsystem memory. A transmission controller controls the transfer of data from the host FIFOs to the subsystem FIFOs while the subsystem processor reads and processes data from the subsystem FIFO. By accumulating data in the host FIFOs before transfer to the subsystem, overhead associated with starting and stopping data transfers over the system bus is substantially reduced.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: June 9, 1998
    Assignee: International Business Machines Corporation
    Inventors: Cory Ansel Cherichetti, Paul David Dinicola, Charles Ray Johns, Omar Mahmoud Rahim, David Andrew Rice, Mark Ernest Van Nostrand