Abstract: The disclosure describes a system for monitoring and mitigating damage to electrical utility structures and the surrounding environment. In some embodiments, the system includes fire boxes, arc sensors, angle switches, and disconnect switches configured to generate alert signals when a hazard is detected. In some embodiments, the system includes cameras configured to detect a hazard such as a fire or moving object. In some embodiments, the system includes light transmitters and light receivers positioned at a predetermined location away from power lines to detect objects that interrupt a line of site. In some embodiments, the system can electrically isolate a power line before a detected hazard impacts a power line.

Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.

Abstract: An automatic sandwich machine is provided. The machine receives customer selections for a number of sandwiches and combinations of toppings and sauces, and allows the customer to make a payment for the sandwiches. The machine places a bread piece into a bread heater, and while the bread heater is heating the bread piece, sprays sauces according to the customer selection and prepares a pre-determined amount of toppings according to a customer selection, a pre-determined amount of sliced meat from a grilled sandwich cone, and a pre-determined amount of cheese. The machine places toppings, sliced meat, and cheese onto the bread piece. The machine then wraps the bread piece to obtain a sandwich. Thereafter, the machine roasts the sandwich and places it into a packet. Finally, the machine delivers the packet with the sandwich to the customer via an outlet.

Abstract: Techniques described herein relate to systems, methods, and non-transitory computer readable mediums for performing workloads on hardware configurations. The method includes determining compliant hardware configurations of the data cluster using workload features associated with the workload, hardware specification information associated with hardware of data nodes of a data cluster, and a first machine learning model; generating performance predictions associated with the compliant hardware configurations using the workload features, a portion of the hardware specification information associated with the compliant hardware configurations, and a second machine learning model; and generating a recommendation using the performance predictions, and the recommendation specifies a hardware configuration of the compliant hardware configurations. The workload is performed using the recommendation.

Abstract: The disclosure describes a system for monitoring and mitigating damage to electrical utility structures and the surrounding environment. In some embodiments, the system includes fire boxes, arc sensors, angle switches, and disconnect switches configured to generate alert signals when a hazard is detected. In some embodiments, the system includes cameras configured to detect a hazard such as a fire or moving object. In some embodiments, the system includes light transmitters and light receivers positioned at a predetermined location away from power lines to detect objects that interrupt a line of site. In some embodiments, the system can electrically isolate a power line before a detected hazard impacts a power line.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Abstract: A method for performing workloads is performed by a recommendation engine.

Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.

Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.

Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Abstract: An apparatus in one embodiment comprises at least one processing device having a processor coupled to a memory. The processing device is configured to receive results of intermediate percentile computations performed on respective ones of a plurality of datasets in respective ones of a plurality of distributed processing nodes configured to communicate over at least one network. The processing device is further configured to perform at least one global percentile computation based at least in part on the results of the intermediate percentile computations, and to utilize results of the intermediate and global percentile computations to populate an interactive user interface associated with at least a given one of the distributed processing nodes. The distributed processing nodes are illustratively associated with respective distinct data zones in which the respective datasets are locally accessible to the respective distributed processing nodes.

Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.

Abstract: The present invention relates to a system and method for providing real-time visual feedback to automatically control actions of multiple autonomous nano-robots with manipulators in order to perform specific nano-manipulation or nano-assembly tasks. In the system and method of the present invention, the visual feedback is obtained for the nano-manipulators and the nano-components via an electronic microscopy system. The system of the present invention comprises essentially at least one slave Scanning Electron Microscope (SEM) with imaging system deployed with autonomous manipulators inside, and a master controller system with Graphical User Interface (GUI). In the system of the present invention, said slave SEM provides real-time vision feedback for the sensed environment for said master controller, and said master controller provides real-time feedback control command for the required task to said slave SEM.

Abstract: The present invention relates to a system and method for providing real-time visual feedback to automatically control actions of multiple autonomous nano-robots with manipulators in order to perform specific nano-manipulation or nano-assembly tasks. In the system and method of the present invention, the visual feedback is obtained for the nano-manipulators and the nano-components via an electronic microscopy system. The system of the present invention comprises essentially at least one slave Scanning Electron Microscope (SEM) with imaging system deployed with autonomous manipulators inside, and a master controller system with Graphical User Interface (GUI). In the system of the present invention, said slave SEM provides real-time vision feedback for the sensed environment for said master controller, and said master controller provides real-time feedback control command for the required task to said slave SEM.

Abstract: Data is transferred from a host system to a subsystem connected to the host by a system bus in an efficient manner using one or more virtual first in first out (FIFO) registers in host memory and a corresponding set of virtual FIFOs located in the subsystem memory. A transmission controller controls the transfer of data from the host FIFOs to the subsystem FIFOs while the subsystem processor reads and processes data from the subsystem FIFO. By accumulating data in the host FIFOs before transfer to the subsystem, overhead associated with starting and stopping data transfers over the system bus is substantially reduced.