Patents by Inventor Omar Mahmoud Adfal ALNAGGER

Omar Mahmoud Adfal ALNAGGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR DYNAMIC ROUTING USING HETEROGENEOUS AND DISJOINT NETWORKS
    Publication number: 20220329245
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • Method and apparatus for dynamic routing using heterogeneous and disjoint networks
    Patent number: 11418196
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 16, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • METHOD AND APPARATUS FOR DYNAMIC ROUTING USING HETEROGENEOUS AND DISJOINT NETWORKS
    Publication number: 20210126641
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Application
    Filed: June 28, 2018
    Publication date: April 29, 2021
    Applicant: North Sea Investment Co. Ltd.
    Inventors: Meng YAN, Omar Mahmoud Adfal ALNAGGER, Myron O. SHAK, Soheil GHARAHI