Patents by Inventor Omar Mahmoud Afdal ALNAGGAR

Omar Mahmoud Afdal ALNAGGAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coordinating power transitions between a smart interconnect and heterogeneous components
    Patent number: 11947972
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 2, 2024
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
  • Assembly of flexible and integrated module packages with leadframes
    Patent number: 11476182
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 18, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • ASSEMBLY OF FLEXIBLE AND INTEGRATED MODULE PACKAGES WITH LEADFRAMES
    Publication number: 20220319967
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • COORDINATING POWER TRANSITIONS BETWEEN A SMART INTERCONNECT AND HETEROGENEOUS COMPONENTS
    Publication number: 20210365273
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Application
    Filed: August 5, 2021
    Publication date: November 25, 2021
    Applicant: North Sea Investment Co. Ltd.
    Inventors: Meng YAN, Omar Mahmoud Afdal ALNAGGAR, Myron O. SHAK, Soheil GHARAHI, William KELSEY
  • Coordinating power transitions between a smart interconnect and heterogeneous components
    Patent number: 11113076
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 7, 2021
    Assignee: North Sea Investment Co. Ltd.
    Inventors: Meng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
  • ASSEMBLY OF FLEXIBLE AND INTEGRATED MODULE PACKAGES WITH LEADFRAMES
    Publication number: 20200279798
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Application
    Filed: October 8, 2018
    Publication date: September 3, 2020
    Applicant: zGlue Inc.
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • COORDINATING POWER TRANSITIONS BETWEEN A SMART INTERCONNECT AND HETEROGENEOUS COMPONENTS
    Publication number: 20190108043
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 11, 2019
    Applicant: zGlue, Inc.
    Inventors: Meng YAN, Omar Mahmoud Afdal ALNAGGAR, Myron O. SHAK, Soheil GHARAHI, William KELSEY