Patents by Inventor Omar S. Leung

Omar S. Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6775047
    Abstract: One embodiment disclosed relates to a method for adaptive bipolar operation of a micro electromechanical (MEM) device. The method includes driving the MEM device in a first polarity, determining when an offset passes a first threshold, and switching from the first polarity to a second polarity when the offset passes the first threshold. Another embodiment disclosed relates to an apparatus for adaptive bipolar operation of a MEM device. The apparatus includes a first look-up table (LUT) for use in driving the MEM device in a first polarity, a circuit for determining when an offset passes a first threshold, and a polarity switch for switching from the first polarity to a second polarity when the offset passes the first threshold.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: August 10, 2004
    Assignee: Silicon Light Machines, Inc.
    Inventors: Omar S. Leung, Akira Tomita, David T. Amm
  • Publication number: 20040150864
    Abstract: In one embodiment, a video display system employs an array of ribbon light modulators having a reflective surface configured to reflect or diffract a beam. The beam may have a wavelength suitable for displaying a video image. The reflective surface may comprise an aluminum alloy suitable for receiving the beam, which may have a relatively high power density. In one embodiment, a method of displaying a video image comprises impinging a beam on a portion of a reflective surface of a light modulator. The beam may have a wavelength suitable for displaying a video image, and the reflective surface may comprise an aluminum alloy.
    Type: Application
    Filed: January 15, 2004
    Publication date: August 5, 2004
    Inventors: Ilan Blech, Chris Gudeman, Omar S. Leung
  • Patent number: 6661090
    Abstract: In one embodiment, an integrated circuit packaging structure includes a first metal adhesion layer formed under a lid and a second metal adhesion layer formed over a substrate. The lid includes a free surface that may move a small amount without cracking. The second metal adhesion layer is configured such that its outer end does not extend past the free surface of the lid to minimize crack formation.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: December 9, 2003
    Assignee: Silicon Light Machines, Inc.
    Inventors: Omar S. Leung, Josef Berger