Abstract: The present disclosure concerns a system for determining vital signs of a subject, such as heart activity profile (e.g. heart rate and heart rate variability), respiration rate or blood pressure. The above vital signs can be extracted from analyzing the movement profile of the chest due to heartbeat, e.g. ballistocardiography (BCG), and respiration process. The monitoring system processes and analyzes measured data of acoustic signals that are obtained by transmitting acoustic signals, in particular, ultrasonic signals, towards a subject and detecting the reflected signals therefrom. The transducer/transmitter of the acoustic signals is positioned remotely from the subject such that the signal communication between the measured subject and the transducer is contact-free. The analysis includes determining a variation profile of phase and frequency between the transmitted signals and the reflections thereof from the subject, and said variation profile is indicative of vital signs of the subject.

Abstract: The present disclosure concerns a system for determining vital signs of a subject, such as heart activity profile (e.g. heart rate and heart rate variability), respiration rate or blood pressure. The above vital signs can be extracted from analyzing the movement profile of the chest due to heartbeat, e.g. ballistocardiography (BCG), and respiration process. The monitoring system processes and analyzes measured data of acoustic signals that are obtained by transmitting acoustic signals, in particular, ultrasonic signals, towards a subject and detecting the reflected signals therefrom. The transducer/transmitter of the acoustic signals is positioned remotely from the subject such that the signal communication between the measured subject and the transducer is contact-free. The analysis includes determining a variation profile of phase and frequency between the transmitted signals and the reflections thereof from the subject, and said variation profile is indicative of vital signs of the subject.

Abstract: An imaging sensor for accepting terahertz signals, including a die made of a dielectric material, one or more antennas for receiving terahertz signals, positioned on top of the die or in an upper layer of the die, each antenna having a CMOS detector electrically coupled to the antenna and positioned in the die below the antenna, a metal shield layer in the die below the antennas and above the CMOS detectors, shielding the CMOS detector from interference signals, a shielding layer under the die comprising a back metal coating and/or a layer of silver epoxy glue for attaching the bottom of the die to a lead frame.

Abstract: An imaging sensor for accepting terahertz signals, including a die made of a dielectric material, one or more antennas for receiving terahertz signals, positioned on top of the die or in an upper layer of the die, each antenna having a CMOS detector electrically coupled to the antenna and positioned in the die below the antenna, a metal shield layer in the die below the antennas and above the CMOS detectors, shielding the CMOS detector from interference signals, a shielding layer under the die comprising a back metal coating and/or a layer of silver epoxy glue for attaching the bottom of the die to a lead frame.