Abstract: An apparatus and method for efficiently creating layout of standard cells to improve floor planning of a chip. In various implementations, an integrated circuit uses multiple standard cells with an absence of diffusion breaks at cell boundaries. The standard cells use vertically stacked non-planer transistors. Multiple transistors are formed with an active region having a length between a source region and a drain region of a single transistor. Therefore, the active regions of these transistors are not formed across multiple gate terminals. By having active regions of these transistors formed across a single gate terminal of a single transistor, there is sufficient spacing to provide electrical isolation between two active regions of the two adjoining standard cells. This is true even when the two adjoining standard cells share a source/drain region at the cell boundaries. Accordingly, forming diffusion breaks at the edges of these standard cells can be skipped.

Abstract: An apparatus and method for efficiently routing power signals across a semiconductor die. In various implementations, an integrated circuit includes, at a first node that receives a power supply reference, a first micro through silicon via (TSV) that traverses through a silicon substrate layer to a backside metal layer. The integrated circuit includes, at a second node that receives the power supply reference, a second micro TSV that physically contacts at least one source region. The integrated circuit includes a first power rail that connects the first micro TSV to the second micro TSV. This power rail replaces contacts between the micro TSVs and a second power rail such as the frontside metal zero (M0) layer. Each of the first power rail, the second power rail, and the backside metal layer provides power connection redundancy that increases charge sharing, improves wafer yield, and reduces voltage droop.

Abstract: Methods, a computer readable medium, and an apparatus are provided. A method includes and the computer readable medium is configured for decomposing an overall pattern into a first mask pattern that includes a power rail base pattern and into a second mask pattern, and generating on the second mask pattern a power rail insert pattern that is at least partially aligned with the power rail base pattern of the first mask pattern. The apparatus is produced by photolithography using photolithographic masks generated by the method.

Abstract: A computer-implemented method of fabricating an integrated circuit structure includes selecting a first cell from a standard cell library, the first cell having a cell boundary and comprising a metal segment at a first metal track at a metal layer, the metal segment extending along a direction and terminating a specified distance beyond a first edge of the cell boundary. The method further includes placing the first cell at a first location of a physical layout for the integrated circuit structure. The method also includes selecting a second cell from the standard cell library and placing the second cell at a second location of the physical layout such that a second edge of a cell boundary of the second cell abuts the first edge of the cell boundary of the first cell, and wherein the metal segment extends into a metal track at the metal layer of the second cell.

Abstract: A computer-implemented method of fabricating an integrated circuit structure includes selecting a first cell from a standard cell library, the first cell having a cell boundary and comprising a metal segment at a first metal track at a metal layer, the metal segment extending along a direction and terminating a specified distance beyond a first edge of the cell boundary. The method further includes placing the first cell at a first location of a physical layout for the integrated circuit structure. The method also includes selecting a second cell from the standard cell library and placing the second cell at a second location of the physical layout such that a second edge of a cell boundary of the second cell abuts the first edge of the cell boundary of the first cell, and wherein the metal segment extends into a metal track at the metal layer of the second cell.

Abstract: Integrated circuit layouts are disclosed that include metal layers with metal tracks having separate metal sections along the metal tracks. The separate metal sections along a single track may be electrically isolated from each other. The separate metal sections may then be electrically connected to different voltage tracks in metal layers above and/or below the metal layer with the separate metal sections. One or more of the metal layers in the integrated circuit layouts may also include metal tracks at different voltages (e.g., power and ground) that are adjacent to each other within a power grid layout. The metal tracks may be separated by electrically insulating material. The metal tracks and the electrically insulating material between the tracks may create capacitance in the power grid layout.

Abstract: Methods, a computer readable medium, and an apparatus are provided. A method includes and the computer readable medium is configured for decomposing an overall pattern into a first mask pattern that includes a power rail base pattern and into a second mask pattern, and generating on the second mask pattern a power rail insert pattern that is at least partially aligned with the power rail base pattern of the first mask pattern. The apparatus is produced by photolithography using photolithographic masks generated by the method.

Abstract: Embodiments of present invention provide methods and apparatuses for connecting and/or disconnecting nodes in a semiconductor device. Embodiments of the apparatus may include a plurality of metal layers formed above a substrate and an interconnect structure formed between first and second nodes in the plurality of metal layers. The interconnect structure includes one or more metal lines formed in each of the metal layers. The metal lines are connected by a plurality of vias. Modifying one of the metal lines in any one of the metal layers changes an electrical connection between the first and second nodes.

Abstract: Embodiments of present invention provide methods and apparatuses for connecting and/or disconnecting nodes in a semiconductor device. Embodiments of the apparatus may include a plurality of metal layers formed above a substrate and an interconnect structure formed between first and second nodes in the plurality of metal layers. The interconnect structure includes one or more metal lines formed in each of the metal layers. The metal lines are connected by a plurality of vias. Modifying one of the metal lines in any one of the metal layers changes an electrical connection between the first and second nodes.

Abstract: A disclosed integrated circuit logic cell includes a clock input operative to receive a clock input from a clock tree of the integrated circuit, and clocking circuitry, internal to the logic cell, operative to place a plurality of clock nodes, within the logic cell, in a logical off state in response to a predetermined logic state of the logic cell, thereby preventing the clock nodes from toggling during the predetermined logic state of the logic cell. The integrated circuit logic cell includes primary logic circuitry, internal to the logic cell, operatively coupled to the clocking circuitry which is operatively coupled to an input of the primary logic circuitry. The clocking circuitry provides clock outputs operatively coupled to the clock nodes which are within the primary logic circuitry, and is operative to control the clock outputs in response to the predetermined logic state.

Abstract: A method and apparatus for selectively charging a secondary voltage rail includes selectively and partially charging a secondary voltage rail using at least one soft start power gate switch and using an initial power control indicator. The partially charged secondary voltage rail is selectively charged, using at least one main power gate switch, based on the initial power control indicator and a detected voltage on the secondary voltage rail. When the initial power control indicator is in a state representative of an initial power up command and when the detected voltage is greater than or equal to a predetermined voltage level, at least one main power gate switch is closed thereby charging the secondary voltage rail.

Abstract: A disclosed integrated circuit logic cell includes a clock input operative to receive a clock input from a clock tree of the integrated circuit, and clocking circuitry, internal to the logic cell, operative to place a plurality of clock nodes, within the logic cell, in a logical off state in response to a predetermined logic state of the logic cell, thereby preventing the clock nodes from toggling during the predetermined logic state of the logic cell. The integrated circuit logic cell includes primary logic circuitry, internal to the logic cell, operatively coupled to the clocking circuitry which is operatively coupled to an input of the primary logic circuitry. The clocking circuitry provides clock outputs operatively coupled to the clock nodes which are within the primary logic circuitry, and is operative to control the clock outputs in response to the predetermined logic state.

Abstract: A method and apparatus for selectively charging a secondary voltage rail includes selectively and partially charging a secondary voltage rail using at least one soft start power gate switch and using an initial power control indicator. The partially charged secondary voltage rail is selectively charged, using at least one main power gate switch, based on the initial power control indicator and a detected voltage on the secondary voltage rail. When the initial power control indicator is in a state representative of an initial power up command and when the detected voltage is greater than or equal to a predetermined voltage level, at least one main power gate switch is closed thereby charging the secondary voltage rail.