Abstract: Memory stacks including replacement blocks and related methods are disclosed. An example integrated circuit disclosed herein includes a first layer including a memory die, and a second layer including a replacement block communicatively coupled to the memory die, the second layer including and a dielectric shell surrounding the replacement block.

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages are disclosed. An example semiconductor chip includes: a front surface; a back surface opposite the front surface; a first lateral surface extending between the front surface and the back surface; a second lateral surface extending between the front surface and the back surface; and a curved fillet at an intersection between the first lateral surface and the second lateral surface.