Patents by Inventor Omkar Gopalkrishna Karhade

Omkar Gopalkrishna Karhade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240357839
    Abstract: Memory stacks including replacement blocks and related methods are disclosed. An example integrated circuit disclosed herein includes a first layer including a memory die, and a second layer including a replacement block communicatively coupled to the memory die, the second layer including and a dielectric shell surrounding the replacement block.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Inventors: Nitin Ashok Deshpande, Omkar Gopalkrishna Karhade, Debendra Mallik
  • Publication number: 20240347590
    Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages are disclosed. An example semiconductor chip includes: a front surface; a back surface opposite the front surface; a first lateral surface extending between the front surface and the back surface; a second lateral surface extending between the front surface and the back surface; and a curved fillet at an intersection between the first lateral surface and the second lateral surface.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Bhaskar Jyoti Krishnatreya, Guruprasad Arakere, Nitin Ashok Deshpande, Mohammad Enamul Kabir, Omkar Gopalkrishna Karhade, Keith Edward Zawadzki, Trianggono S. Widodo