Abstract: The present invention relates to a delivery method for enabling the advertisement of a delivery orderer, the delivery method including: registering one or more call terminals and one or more delivery carrier terminals of one or more delivery persons, allocating IDs to the call terminals and the delivery carrier terminals, and storing the IDs; when a delivery order is transmitted from a customer terminal, allocating an ID to the customer terminal, and storing the customer terminal ID with information and advertising content associated with the customer terminal ID; transmitting a call for a delivery order request to the call terminals of the delivery persons; transmitting the advertising content corresponding to the ID of the customer terminal to the delivery carrier terminal of one of the delivery persons who has transmitted a call awareness request first; and displaying the transmitted advertising content on the display of the delivery carrier terminal.

Abstract: Described are methods for detecting and quantifying biomolecules such as polynucleotides or polypeptides in an electrophoresis matrix using ion concentration polarization and nanoparticle aggregation.

Abstract: An energy storage device has an anode, a cathode and an electrolyte membrane, installed in between the anode and the cathode, wherein at least one of the anode, the cathode and the electrolyte membrane is incorporated with a copolymer and the copolymer is grafted to a functional group with ionic conductive function. Therefore, the energy storage device, which utilizes copolymers and electrolyte membranes, has better efficiency of charge/discharge performance; thus the efficiency thereof increases; the lifetime thereof is prolonged effectively.

Abstract: A thin and lightweight display device is disclosed. An organic light-emitting display device having a touch sensor is configured such that an outer planarization layer fills a space between a plurality of dams, thereby preventing a short circuit between routing lines in the space between the dams, and such that touch electrodes are disposed on an encapsulation structure for encapsulating a light-emitting element, with the result that an additional bonding process is not required, whereby the process is simplified and cost is reduced.

Abstract: Embodiments disclose a device for testing biological specimen. The device includes a sample carrier and a detachable cover. The sample carrier includes a specimen holding area. The detachable cover is placed on top of the specimen holding area. The detachable cover includes a magnifying component configured to align with the specimen holding area. The focal length of the magnifying component is from 0.1 mm to 8.5 mm. The magnifying component has a linear magnification ratio of at least 1. Some embodiments further include a multi-camera configuration. These embodiments include a first camera module and a second camera module arranged to capture one or more images of the first holding area and the second holding area, respectively. The processor may perform different analytic processes on the captured images of different holding areas to determine an outcome with regard to the biological specimen.

Abstract: According to a storage system, method, and apparatus for processing an operation request provided by embodiments of the present invention, a controller directly encapsulates a SCSI protocol operation request into an Ethernet operation request packet at the MAC layer instead of using the TCP/IP protocol layer and a disk enclosure decapsulates the Ethernet operation request to obtain the SCSI protocol operation request and sends the SCSI protocol operation request to a target disk, thereby reducing layers of encapsulation, reducing a processing delay of the storage system, and improving performance of the storage system.

Abstract: Systems and methods for performing a parallel parking maneuver of a host vehicle between a first object and a second object. In one embodiment, the method includes detecting a parking mode and determining a parking space size upon detecting the parking mode. The method also includes selecting a left rear wheel of the host vehicle or a right rear wheel of the host vehicle. The method further includes applying a first braking force, sufficient to lock-up the selected rear wheel of the host vehicle, to the selected rear wheel of the host vehicle when the parking space size is less than a size threshold. The method also includes applying a second braking force to the selected rear wheel of the host vehicle when the parking space size is greater than or equal to the size threshold. The second braking force is less than the first braking force.

Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes an interconnect structure formed over a substrate and a passivation layer formed over the interconnect structure. The semiconductor device structure also includes an anti-acid layer formed in the passivation layer and a bonding layer formed on the anti-acid layer and the passivation layer. The anti-acid layer has a thickness that is greater than about 140 nm.

Abstract: Disclosed is a cooking apparatus for providing a cooking vessel suitable for a simmer cooking function. A cooking apparatus of the present invention includes a cooking room; a cooking vessel accommodated in the cooking room, and including a main body, and a heating element attached on a bottom of the main body and configured to be heated by microwaves to heat the main body; a microwave heater configured to radiate microwaves to the cooking vessel; an input device configured to receive a simmer cooking command; and a controller configured to repeatedly perform a process of turning on the microwave heater for a first time period, when the simmer cooking command is received through the input device, and turning off the microwave heater for a second time period when the first time period elapses, for a cooking time period, and configured to perform a keeping-warm process when a door does not open in a third time period after the cooking time period elapses.

Abstract: Systems and processes for packing complementary articles of footwear into a container are disclosed. The processes can include utilizing a reusable packing sheet positioned underneath complementary articles of footwear to transfer the complementary articles of footwear into a container. The processes can also include removing the reusable packing sheet from underneath the complementary articles of footwear while the complementary articles of footwear remain positioned in the container. Additional processes can include aligning and sizing complementary articles of footwear for packing in a container.

Abstract: A parallel processing system for processing samples is described. In one embodiment, the parallel processing system includes an instrument interface parallel controller to control a tray motor driving system, a close-loop heater control and direction system, a magnetic particle transfer system, a reagent release system, a reagent pre-mix pumping system and a wash buffer pumping system.

Abstract: A fluid transportation device includes a valve cover, a valve body, a valve membrane and a valve chamber seat. The valve cover has two openings. The valve body includes an inlet passage and an outlet passage. The valve membrane is arranged between the valve body and the valve chamber seat, having two valve plates respectively close an inlet valve channel and an outlet valve channel of the valve chamber seat. The valve chamber seat forms a pressure chamber which is sealed and covered by an actuator. The valve cover is sleeved on the valve body and tightly fitted to the inner wall of an outer sleeve to assemble the device, in which a first gasket is disposed between the valve body and the valve membrane, and a second gasket is disposed between the valve membrane and the valve chamber, by which sealing effect is improved and backflow is prevented.

Abstract: Mobile devices with integrated slot antennas are provided are provided. A representative mobile device includes: an exterior housing having a front and a back and defining an interior; a display, mounted to the housing, configured to display images at the front of the housing; and an antenna structure positioned within the interior; the housing having a first portion and a second portion, each of which is formed of metal, the first portion being located at the back of the housing and defining a first slot such that the antenna structure and the first slot form a first slot antenna, the second portion being located at the front of the housing and defining a second slot such that the antenna structure and the second slot form a second slot antenna.

Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.

Abstract: A semiconductor device includes an inter-metal dielectric layer, a memory cell, a transistor and a dielectric layer. The memory cell includes a metal-insulator-metal (MIM) structure over a top surface of the inter-metal dielectric layer. The transistor underlies the inter-metal dielectric layer. The dielectric layer extends over the transistor and along the top surface of the inter-metal dielectric layer. The dielectric layer is separated from the MIM structure.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.

Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first gate electrode over the semiconductor substrate. The semiconductor device also includes a first gate dielectric layer between the first gate electrode and the semiconductor substrate. The semiconductor device further includes a second gate electrode over the semiconductor substrate. The second gate electrode has an upper portion and a lower portion between the upper portion and the semiconductor substrate, and the upper portion is wider than the lower portion. In addition, the semiconductor device includes a second gate dielectric layer between the second gate electrode and the semiconductor substrate.

Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a first metal layer formed over a substrate and a dielectric layer formed over the first metal layer. The semiconductor device structure further includes an adhesion layer formed in the dielectric layer and over the first metal layer and a second metal layer formed in the dielectric layer. The second metal layer is electrically connected to the first metal layer, and a portion of the adhesion layer is formed between the second metal layer and the dielectric layer. The adhesion layer includes a first portion lining with a top portion of the second metal layer, and the first portion has an extending portion along a vertical direction.

Abstract: A semiconductor device includes a semiconductor die, an insulative layer, a plurality of conductive features, a dummy redistribution layer (RDL), and an Electromagnetic Interference (EMI) shield. The insulative layer covers the semiconductor die. The conductive features substantially surround the insulative layer. The dummy RDL is over the insulative layer and electrically disconnected from the semiconductor die. The EMI shield is in contact with the plurality of conductive features and the dummy RDL.

Abstract: Methods are disclosed herein that improve contours of trenches formed when fabricating vias and conductive lines of a multi-layer interconnect (MLI) structure. An exemplary device that can result from such methods includes a via of an MLI structure and a conductive line of the MLI structure disposed over the via. A first dielectric liner layer is disposed along sidewalls of the via and sidewalls of the conductive line. A thickness of the first dielectric liner layer is substantially the same along the sidewalls of the via. A thickness of the first dielectric liner layer increases along the sidewalls of the conductive line, such that the first dielectric liner layer has a tiger-tooth shape at each bottom corner of the conductive line. A second dielectric liner layer is disposed along the first dielectric liner layer that is disposed along the sidewalls of the via.