Patents by Inventor On Chau
On Chau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250143877Abstract: A prosthetic device includes a main body, a first anchor, and a second anchor. The main body has an atrial end and a ventricular end. The main body tapers from the atrial end to the ventricular end. The first and second anchors are coupled to the main body and are movable toward and away from the main body.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Inventors: Stephen C. Geist, Robert C. Taft, Travis Zenyo Oba, Sam Sok, Matthew A. Peterson, Kevin M. Golemo, Mark Chau, Seung-Beom Yi
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Publication number: 20250145848Abstract: Disclosed herein are systems and methods of using a coating solution such as an aromatic copolyester thermoset (ACT) to improve the wear, galling, and corrosion resistances of downhole tools and their sub-components. Aromatic copolyester thermoset may be reinforced with filler material. Further, the aromatic copolyester thermoset reinforced with filler material may be used in a borehole as a composite hollow profile, for example. In some examples, the systems may comprise a substrate for downhole applications coated with an aromatic thermosetting copolyester mixed with polytetrafluoroethylene (PTFE).Type: ApplicationFiled: May 24, 2024Publication date: May 8, 2025Applicant: Halliburton Energy Services, Inc.Inventors: Somen Kumar Bhudolia, Shashwat Shukla, Cheng Chau Lum, Vishal Vilas Raut, Arpana Singh
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Patent number: 12290383Abstract: In neonates or infants, the system identifies Neonatal Abstinence Syndrome (NAS) and in adult patients the system monitors for and identifies withdrawal and/or relapse symptoms. The system can be used for NAS babies in hospitals as well as in the home for adults. The system obtains biosensor or behavioral information about a patient from a wearable device on the patient and makes a determinative recommendation based on algorithm driven calculations and takes appropriate action based on its evaluation. The biosensor and behavioral information are collected by way of a wearable device, high precision cameras, multi pitch microphones over progressive periods of time. When the data is indicative of a need for treatment because the patient is exhibiting symptoms or indicating relapse traits, this information is sent to the system where an AI module further predicts and recommends a delivery of treatment for the patient.Type: GrantFiled: April 27, 2023Date of Patent: May 6, 2025Assignee: Rekovar Inc.Inventors: Shiva Sharareh, Abel Jimenez, Ariel Garcia, Daryl Chau, Neema Onbirbak
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Patent number: 12293261Abstract: A system receives transaction data over time, and creates structured data based on the received transaction data. Purchase transactions that are associated with a purchase category are identified in the structured data and labeled. A recurrent neural network such as a long short-term memory (LSTM) network, in particular, a k-LSTM architecture using weighted averages to update hidden states and cell states, is trained to build a model. The model is used to predict the likelihood of a purchase transaction.Type: GrantFiled: June 13, 2019Date of Patent: May 6, 2025Assignee: ROYAL BANK OF CANADAInventors: Yuanqiao Wu, Janahan Ramanan, Jaspreet Sahota, Cathal Smyth, Yik Chau Lui
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Publication number: 20250141678Abstract: The concepts and technologies disclosed herein are directed to time-aware blockchain staged regulatory control of Internet of Things (“IoT”) data. A federation platform can receive a registration request from an enterprise edge platform to register a blockchain identifier for publication of public data on a public blockchain. The federation platform can determine if the registration request contains any restricted data parameters. In response to determining that the registration request does not contain any restricted data parameters, the federation platform can query a security module to obtain an encryption key. The federation platform can receive the encryption key from the security module and store the encryption key in association with the blockchain identifier and an enterprise edge platform ID that uniquely identifies the enterprise edge platform.Type: ApplicationFiled: December 29, 2024Publication date: May 1, 2025Applicants: AT&T Global Network Services Hong Kong LTD, AT&T Mobility II LLCInventors: Winnie Chau, John Philip Mulligan, Shashi Gowda
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Publication number: 20250137649Abstract: A microwave oven appliance may include a cabinet, a magnetron, a control panel, a chamber door, a primary door input, a secondary unlock input, and a controller. The primary door input may be attached to the cabinet in operable communication with the chamber door to release the chamber door from the closed position. The secondary unlock input may be attached to the cabinet to selectively direct the chamber door to an unlocked state. The controller may be in operable communication with the control panel. The controller may be configured to direct a monitoring operation. The monitoring operation may include initiating a lock condition in which the chamber door is held in a locked state, detecting user engagement at the primary door input during the lock condition, determining maintenance of the lock condition, and initiating a warning command at the control panel based on determining maintenance of the lock condition.Type: ApplicationFiled: October 30, 2023Publication date: May 1, 2025Inventors: John Michael Todd, Zachary Cull, Chau Tran
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Publication number: 20250141736Abstract: A network management system (NMS) that can provision and manage a network is provided. During operation, the NMS can determine, for a respective network device in the network, connectivity information indicating how the network device is connected within the network and a device profile of the network device. The NMS can then determine a connectivity tier of the network device in the network based on the connectivity information. The connectivity tier can correspond to a placement of the network device in a hierarchy of network devices in the network. The NMS can select a device persona associated with the connectivity tier. Here, the device persona indicates specification and configurations for the network device. The NMS can send, to the network device, configuration information that configurates the device persona on the network device.Type: ApplicationFiled: October 31, 2023Publication date: May 1, 2025Inventors: Chinlin Chen, Uyen T. Chau, Faraz Ahmed, Lianjie Cao
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Patent number: 12290003Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a conductive structure over a semiconductor substrate. A first dielectric layer is over the conductive structure. A second dielectric layer is over the first dielectric layer. An interconnect structure is over the conductive structure and disposed in the first and second dielectric layers. The interconnect structure has a protrusion in direct contact with a sidewall of the conductive structure. The interconnect structure comprises an interconnect liner surrounding a conductive interconnect body. A sidewall spacer is disposed on the sidewall of the conductive structure.Type: GrantFiled: December 12, 2022Date of Patent: April 29, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang
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Patent number: 12283622Abstract: A method for forming a semiconductor device and a semiconductor device formed by the method are disclosed. In an embodiment, the method includes depositing a dummy dielectric layer on a fin extending from a substrate; depositing a dummy gate seed layer on the dummy dielectric layer; reflowing the dummy gate seed layer; etching the dummy gate seed layer; and selectively depositing a dummy gate material over the dummy gate seed layer, the dummy gate material and the dummy gate seed layer constituting a dummy gate.Type: GrantFiled: June 27, 2023Date of Patent: April 22, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: De-Wei Yu, Cheng-Po Chau, Yun Chen Teng
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Publication number: 20250125183Abstract: Apparatus and methods for cooling down a susceptor assembly are described. A heat exchange passage in a susceptor assembly thermal break transfers heat from processing gases that flow through the susceptor assembly to a cooling jacket and cools down the susceptor assembly and associated hardware.Type: ApplicationFiled: October 13, 2023Publication date: April 17, 2025Applicant: Applied Materials, Inc.Inventors: Vijayabhaskara Venkatagiriyappa, Laxman Vitthalrao Deshmukh, Chau T. Nguyen
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Publication number: 20250124815Abstract: A medical system may comprise a display system, an operator input device and a control system in communication with the display system and the operator input device. The control system may comprise a processor and a memory comprising machine readable instructions that, when executed by the processor, cause the control system to access an experience factor for a user and reference a set of parameterized prior procedures. The instructions may also cause the control system to identify a parameterized prior procedure associated with the experience factor from the set of parameterized prior procedures and generate a simulation exercise that includes a plurality of parameters from the parameterized prior procedure. Model inputs to the operator input device that are associated with the plurality of parameters may be determined.Type: ApplicationFiled: March 14, 2023Publication date: April 17, 2025Inventors: Anthony M. Jarc, Joey Chau, May Quo-Mei Liu
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Publication number: 20250120952Abstract: The present invention provides methods for treating a fibrotic disease using a compound of Formula (I), or a pharmaceutically acceptable salt thereof, where the variables are as defined herein. The invention further provides pharmaceutical compositions comprising a compound of Formula (I) which are useful in the methods of the invention.Type: ApplicationFiled: October 3, 2024Publication date: April 17, 2025Inventors: Yaohui NIE, Manuel ROQUETA-RIVERA, Jordan BUTTS, Mary CHAU, Kelsey GARLICK
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Patent number: 12278151Abstract: The present disclosure relates to a semiconductor wafer structure including a semiconductor substrate and a plurality of semiconductor devices disposed along the semiconductor substrate. A dielectric stack including a plurality of dielectric layers is arranged over the semiconductor substrate. A conductive interconnect structure is within the dielectric stack. A seal ring layer is over the dielectric stack and laterally surrounds the dielectric stack along a first sidewall of the dielectric stack. The seal ring layer includes a first protrusion that extends into a first trench in the semiconductor substrate.Type: GrantFiled: March 21, 2022Date of Patent: April 15, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Che Lee, Kuo-Ming Wu, Sheng-Chau Chen, Hau-Yi Hsiao, Guanyu Luo, Ping-Tzu Chen, Cheng-Yuan Tsai
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Patent number: 12276513Abstract: A navigation solution for a vehicle is provided by obtaining motion sensor data from a sensor assembly of the vehicle, detecting a static condition for the vehicle based at least in part on the motion sensor data, selectively enabling reduced power operation and providing the navigation solution for the vehicle while reduced power operation is enabled. While reduced power operation is enabled, motion may be detected so that reduced power operation is disabled and a subsequent navigation solution is provided for the vehicle while reduced power operation is disabled.Type: GrantFiled: May 3, 2022Date of Patent: April 15, 2025Inventors: Curtis James Pidgeon, Juan Carlos Terrazas Borbon, Zainab Fatima Syed, Kyle Ken Loung Chau
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Patent number: 12279375Abstract: An information handling system can comprise first and second housings having pivotally coupled rear edge portions such that the housings are pivotable between open and closed states. A hinge cover can extend along at least a portion of each housing's rear edge portion. A flexible printed circuit having opposing upper and lower surfaces can extend between the housings. The circuit can include a cover segment in which the circuit's upper surface is fixed to the hinge cover's inner surface, two housing segments that are each fixed to a respective one of the housings, and two free segment that each connect a respective one of the housings segments to the cover segment, are movable relative to the hinge cover and to the housings when the housings pivot between the open and closed states, and underlie the inner surface of the hinge cover when the housings are in the open state.Type: GrantFiled: February 27, 2023Date of Patent: April 15, 2025Assignee: Dell Products L.P.Inventors: Chris A. Torres, Tzu-Chau Chen, Li-Min Wu
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Publication number: 20250114298Abstract: The subject invention pertains to a long-term antigen depot that can bypass FBR and engage DCs to mature and migrate to lymph nodes to activate antigen-specific T-cell activations. Leveraging on the immunomodulatory properties of exogenous polysaccharides and the anti-fouling characteristics of zwitterionic phosphorylcholine (PC) polymer, the invention features a PC functionalized dextran (PCDX) hydrogel for long-term antigen delivery. PCDX in both injectable scaffold and microparticles (MPs) forms effectively evades FBR and provides slow release of antigens resulting in local enrichment of CD11c+ DCs at the MPs injection sites. DC cultured on PCDX exhibits strong immunogenic activation with high CD86, CD40, MHC-I/peptide complex. PCDX also generates DC with propensity in migration to lymph nodes, as well as antigen presentation to trigger both CD4+ and CD8+ arms of T-cell responses.Type: ApplicationFiled: October 7, 2024Publication date: April 10, 2025Inventors: Jin Teng CHUNG, Ying CHAU, Chi Ming Laurence LAU
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Publication number: 20250118710Abstract: A semiconductor device is formed by bonding a first semiconductor die and a second semiconductor die at bonding pads in the first semiconductor die with bonding vias in the second semiconductor die, and by bonding dielectric layers in the first semiconductor die and in the second semiconductor die. Omitting bonding pads from the second semiconductor device, and instead using the bonding vias to bond the first and second semiconductor dies, provides a greater amount of spacing between the bonding vias of the second semiconductor die in that the bonding vias have lesser widths than bonding pads. This enables a greater amount of dielectric material of the dielectric layers of the second semiconductor device to be placed between the bonding vias without (or with minimally) increasing the lateral size of the second semiconductor die.Type: ApplicationFiled: March 26, 2024Publication date: April 10, 2025Inventors: Kuo-Ming WU, Ru-Liang LEE, Sheng-Chau CHEN
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Publication number: 20250117056Abstract: Thermal management in a display system can be implemented using at least one temperature regulating element (TRE). The display system can include an array of light emitting diodes or some other type of light emitter. Each light emitter of the array includes an active region configured to emit light and can be formed from a shared semiconductor structure in which the at least one TRE is located. Each TRE includes a phase change material configured to undergo a phase transition from a first state of matter to a second state of matter in response to heat, such that at least some of the heat is expended in causing the phase transition instead of heating an area around the TRE. In this manner, the at least one TRE can operate as a passive cooling solution for regulating the temperatures of the light emitters.Type: ApplicationFiled: October 3, 2024Publication date: April 10, 2025Inventors: Shenghui LEI, Chau Van HO, Dusan COSO
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Publication number: 20250118705Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.Type: ApplicationFiled: December 17, 2024Publication date: April 10, 2025Inventors: Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang
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Publication number: 20250117386Abstract: Techniques are provided for personal data and AI system integration. It is determined to respond to a user prompt. An AI system is provided a user prompt description, a database description describing a user database comprising user data associated with the user, and instructions to provide a query for relevant data in the user database that the AI system can use to answer to the user prompt. A query is received from the AI system and executed against the user database to generate a result set. The result set is submitted to the AI system. The answer is received from the AI system based on the user prompt description and the result set. A response is generated for the user based on the answer from the AI system.Type: ApplicationFiled: October 3, 2024Publication date: April 10, 2025Applicant: Ariagato, Inc.Inventors: Sumit Agarwal, Mengmeng Chen, Yiing Chau Mak, Peng Li