Patents by Inventor On Lee

On Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10955640
    Abstract: A camera for an electronic device, which is compact and exerts high performance is disclosed. The camera for an electronic device includes a housing, a lens assembly mounted movably inside the housing, an actuator configured to move the lens assembly relative to the housing, and a guide provided in the lens assembly and the housing, and configured to guide the relative movement of the lens assembly. The guide includes a first guide configured to support a first surface of the lens assembly with respect to the housing, for the relative movement of the lens assembly, and a second guide configured to support a second surface of the lens assembly, different from the first surface, with respect to the housing, for the relative movement of the lens assembly.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: March 23, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyungjoo Kang, Dongryeol Lee, Jongwoo Jeong, Samnyol Hong
  • Patent number: 10957679
    Abstract: A chip package includes an interposer comprising a silicon substrate, multiple metal vias passing through the silicon substrate, a first interconnection metal layer over the silicon substrate, a second interconnection metal layer over the silicon substrate, and an insulating dielectric layer over the silicon substrate and between the first and second interconnection metal layers; a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip over the interposer; multiple first metal bumps between the interposer and the FPGA IC chip; a first underfill between the interposer and the FPGA IC chip, wherein the first underfill encloses the first metal bumps; a non-volatile memory (NVM) IC chip over the interposer; multiple second metal bumps between the interposer and the NVM IC chip; and a second underfill between the interposer and the NVM IC chip, wherein the second underfill encloses the second metal bumps.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: March 23, 2021
    Assignee: iCometrue Company Ltd.
    Inventors: Jin-Yuan Lee, Mou-Shiung Lin
  • Patent number: 10958453
    Abstract: Disclosed is a physical unclonable function generator circuit and method.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Lien Linus Lu, Chen-En Lee
  • Patent number: 10959228
    Abstract: An electronic device including a communication circuitry, a processor, and a memory is provided. The processor of the electronic device receives a user equipment (UE) capability enquiry that includes information indicating the number of carrier aggregation (CA) combinations associated with a network from the network using the communication circuitry and determines UE capability information based on at least one of the number of default CA combinations of the electronic device, the number of CA combinations of a region associated with the network, the number of CA combinations of a country associated with the network, the number of CA combinations corresponding to a supported frequency band of a mobile network operator (MNO) associated with the network, and the number of CA combinations associated with the network.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghee Kim, Jiyeon Lee, Sunggi Baek, Jongphil Lee, Gwangho Lee, Changhun Lee, Janghoon Lee
  • Patent number: 10959080
    Abstract: Various embodiments of the present invention relate to an electronic device and method for providing an emergency call, and a server for providing the same. To this end, the electronic device according to the various embodiments of the present invention comprises: a short-range wireless communication circuit; a memory for storing at least one piece of content; and at least one processor electrically connected with the short-range wireless communication circuit and the memory, wherein the processor transmits, to a server, a request for registering to a first communication network, receives, from the server, a message for indicating whether an emergency call for a first communication network of another provider can be supported, and can display the received message. Other embodiments are also possible.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shin-Duck Lee, Hyun-Chul Lee
  • Patent number: 10958407
    Abstract: Methods, systems, and devices for wireless communication are described. A transmitting device may identify a duration of a slot used for communications with a receiving device. The transmitting device may determine that the communications with the receiving device comprises frequency division duplexing (FDD) communications. The transmitting device may transmit communications to the receiving device during a first portion of the slot, a duration of the first portion being less than the duration of the slot and the duration of the first portion is based at least in part on the determination that the communications comprise FDD communications. The transmitting device may select, based at least in part on the determination that the communications comprise FDD communications and that the communications are transmitted during the first portion of the slot, a hybrid automatic repeat request (HARQ) scheme to use during the communications.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: March 23, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Heechoon Lee, Tingfang Ji, Joseph Binamira Soriaga, Alexei Yurievitch Gorokhov, Peter Gaal, John Edward Smee, Naga Bhushan
  • Patent number: 10952694
    Abstract: A method and apparatus correct a computed tomography (CT) image with motion artifacts. The method of correcting a CT image may include: obtaining a reconstruction image of an object by reconstructing an X-ray projection image; measuring a parameter value related to motion artifacts that occur due to movement of the object in at least one of the X-ray projection image or the reconstruction image; calculating a correction possibility for the reconstruction image based on the measured parameter value; and determining whether to perform correction on the reconstruction image based on the calculated correction possibility.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: March 23, 2021
    Assignee: HITACHI, LTD.
    Inventors: Kihong Son, Kyoung-Yong Lee, Duhgoon Lee, Wooyoung Jang, Jaemoon Jo
  • Patent number: 10952915
    Abstract: A driving module including a driving source configured to generate power, a gear train including a decelerating gear set configured to receive driving power from the driving source and a ring gear attached to one side thereof, and a rotary joint including at least one planetary gear configured to rotate using power received from an output end of the decelerating gear set and to revolve along the ring gear is disclosed.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Gon Roh, Jeonghun Kim, Minhyung Lee, Youn Baek Lee, Jongwon Lee, Byungjune Choi, Hyun Do Choi
  • Patent number: 10957366
    Abstract: Circuits and methods for compensating mismatches in sense amplifiers are disclosed. In one example, a circuit is disclosed. The circuit includes: a first branch, a second branch, a first plurality of trimming transistors and a second plurality of trimming transistors. The first branch comprises a first transistor, a second transistor, and a first node coupled between the first transistor and the second transistor. The second branch comprises a third transistor, a fourth transistor, and a second node coupled between the third transistor and the fourth transistor. The first node is coupled to respective gates of the third transistor and the fourth transistor. The second node is coupled to respective gates of the first transistor and the second transistor. The first plurality of trimming transistors is coupled to the second transistor in parallel. The second plurality of trimming transistors is coupled to the fourth transistor in parallel.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: March 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ku-Feng Lin, Yu-Der Chih, Yi-Chun Shih, Chia-Fu Lee
  • Patent number: 10955184
    Abstract: A refrigerator includes an evaporator installed inside an evaporator case, a water tray provided below the evaporator and configured to collect water, a grill cover provided at a rear side of the evaporator case and configured to accommodate a blower fan, and a tray support provided in the grill cover to support the water tray. The grill cover may include a first grill cover having a fan suction portion configured to guide cold air passing through an evaporator to a blower fan. At least one supply port may protrude from a front surface of the first grill cover through which the cold air is supplied to a storage chamber. A water tray may be supported on an upper side of the at least one supply port.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 23, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Dongseok Kim, Younseok Lee, Junsoo Han
  • Patent number: 10957697
    Abstract: A manufacture includes a substrate comprising a first portion and a second portion. The manufacture further includes a first polysilicon structure over the first portion of the substrate. The manufacture further includes a second polysilicon structure over the second portion of the substrate. The manufacture further includes two spacers on opposite sidewalls of the second polysilicon structure, wherein each spacer of the two spacers has a concave corner region between an upper portion and a lower portion. The manufacture further includes a protective layer covering the first portion of the substrate and the first polysilicon structure, the protective layer exposing the second portion of the substrate, the second polysilicon structure, and partially exposing the two spacers.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: March 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Shao Cheng, Shin-Yeu Tsai, Chui-Ya Peng, Kung-Wei Lee
  • Patent number: 10958495
    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present invention relates to transmission of a reference signal in a wireless communication system, and an operation method of a terminal comprises the steps of: receiving control information for reference signals from a base station, and receiving the reference signals according to the control information. Further, the present invention also comprises embodiments different from the embodiment described above.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keonkook Lee, Suryong Jeong, Taeyoung Kim, Jiyun Seol
  • Patent number: 10957654
    Abstract: Provided are a semiconductor package and a method of manufacturing the same, the semiconductor package including an interconnection part including an insulation layer and an interconnection layer, a semiconductor chip disposed on the interconnection part and electrically connected to the interconnection layer through a bonding pad, and an EMI shielding part connected to the interconnection layer while covering the semiconductor chip and the interconnection part.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 23, 2021
    Assignee: NEPES CO., LTD.
    Inventors: Jun-Kyu Lee, Jaecheon Lee
  • Patent number: 10955025
    Abstract: A vehicle powertrain variable vibration absorber assembly can be equipped in a hybrid electric vehicle (HEV). The vehicle powertrain variable vibration absorber assembly includes a rotary device, a drive-ratio assembly, and a spring. The rotary device, in an example, is a motor-generator unit (MGU). The drive-ratio assembly, in an example, is a planetary gear assembly. The drive-ratio assembly receives rotational drive input from the rotary device, and transmits rotational drive output to a powertrain component. The spring, in an example, is a variable stiffness spring. The spring is connected to the drive-ratio assembly and is connected to a grounded component. During use, the vehicle powertrain variable vibration absorber assembly absorbs different frequencies of vibration brought about by a vehicle engine amid different operating modes. The operating modes can involve cylinder deactivation technologies.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 23, 2021
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Derek F. Lahr, Neeraj S. Shidore, James B. Borgerson, Chunhao J. Lee, Norman K. Bucknor
  • Patent number: 10954193
    Abstract: The present application, among other things, provides compounds that are capable of inhibiting the activity of anti-apoptotic Bcl-2 family proteins, for example, myeloid cell leukemia-1 (Mcl-1) protein. The present invention also provides pharmaceutical compositions as well as methods for using provided compounds for treatment of diseases and conditions (e.g., cancer) characterized by the over-expression or dysregulation of Mcl-1 protein. In some embodiments, a provided compound has the structure of formula I. In some embodiments, a provided compound has the structure of formula II.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: March 23, 2021
    Assignee: Vanderbilt University
    Inventors: Taekyu Lee, Kwangho Kim, Plamen P. Christov, Johannes Belmar, Jason P. Burke, Edward T. Olejniczak, Stephen W. Fesik
  • Patent number: 10954588
    Abstract: Disclosed herein are embodiments of alloys which can be particularly advantageous in twin wire arc spray methods for coating of a substrate. In some embodiments, a plurality of alloys can be used to form both hard and soft particles on a surface. In some embodiments, chromium can be minimized or eliminated.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: March 23, 2021
    Assignee: Oerlikon Metco (US) Inc.
    Inventors: Justin Lee Cheney, David Jiang
  • Patent number: D913819
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: March 23, 2021
    Assignee: TOMTOM NAVIGATION B.V.
    Inventors: Mark Lee Dempsey, Daniel Browning, Nicholas Alexander Evans, Andreas Schuh
  • Patent number: D913913
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 23, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinsung Kim, Donghae Oh, Hyunho Lee
  • Patent number: D914034
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeewon Lee, Sukjae Lee, Jinkyo Chung, Yong Kwon, Heekyung Jeon
  • Patent number: D914219
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: March 23, 2021
    Assignee: BIONIME CORPORATION
    Inventors: Chun-Mu Huang, Chen-Hao Lee, Hsueh-Chuan Chang, Chieh-Hsing Chen