Patents by Inventor Ondrej Novak
Ondrej Novak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275392Abstract: The invention relates to a LASER amplification module for a solid-state laser system and method for manufacturing thereof. The present invention relates to a laser amplification module for a solid-state laser. More particularly, the present invention relates to the module amplifying laser beam capable to provide effective cooling of a heat sink bonded to a solid-state disk.Type: ApplicationFiled: December 15, 2022Publication date: August 31, 2023Applicants: Innotonix GmbH, FYZIKALNI USTAV AV CR, V.V.IInventors: Ugur Sezer, Martin Smrz, Jan Cvrcek, Ondrej Novak
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Patent number: 11674924Abstract: Sensor devices and systems can include a silicon substrate comprising a sensor-side and a backside. The backside can include a backside electrode. The sensor-side can include a chemical sensor. The chemical sensor can include a chemical sensor electrode, the chemical sensor electrode can be electrically coupled to the backside electrode by a through-silicon via (TSV), the TSV being physically and electrically connected to the chemical sensor electrode and extending from the chemical sensor electrode through the silicon substrate towards the backside. The TSV can electrically connect the chemical sensor to the backside electrode. A printed circuit board can surround the sensor device and can include a metal contact pad. The metal contact pad can be electrically coupled to the backside electrode by a wire bond. The sensor-side can include a polymeric membrane covering the chemical sensor.Type: GrantFiled: July 22, 2019Date of Patent: June 13, 2023Assignee: E-SENS, INC.Inventors: Richard B. Brown, Ondrej Novak
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Patent number: 11331664Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.Type: GrantFiled: November 1, 2019Date of Patent: May 17, 2022Assignee: E-SENS, INC.Inventors: Richard B. Brown, Ondrej Novak
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Patent number: 10710068Abstract: Aspects of the embodiments are directed to a microfluidic chip and methods of making the same. The microfluidic chip can include a sensor device residing on the microfluidic chip, the sensor-side comprising a chemical sensor and the backside including a backside electrode, the chemical sensor electrically coupled to the backside electrode by a via; a microfluidics channel in the microfluidic chip, the sensor-side of the sensor device facing the microfluidics channel; and a metal contact electrically connected to the backside electrode.Type: GrantFiled: September 20, 2017Date of Patent: July 14, 2020Assignee: e-SENSE, Inc.Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20200139365Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.Type: ApplicationFiled: November 1, 2019Publication date: May 7, 2020Applicant: e-SENS, Inc.Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20200018718Abstract: Sensor devices and systems can include a silicon substrate comprising a sensor-side and a backside. The backside can include a backside electrode. The sensor-side can include a chemical sensor. The chemical sensor can include a chemical sensor electrode, the chemical sensor electrode can be electrically coupled to the backside electrode by a through-silicon via (TSV), the TSV being physically and electrically connected to the chemical sensor electrode and extending from the chemical sensor electrode through the silicon substrate towards the backside. The TSV can electrically connect the chemical sensor to the backside electrode. A printed circuit board can surround the sensor device and can include a metal contact pad. The metal contact pad can be electrically coupled to the backside electrode by a wire bond. The sensor-side can include a polymeric membrane covering the chemical sensor.Type: ApplicationFiled: July 22, 2019Publication date: January 16, 2020Applicant: e-SENS, Inc.Inventors: Richard B. Brown, Ondrej Novak
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Patent number: 10464063Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.Type: GrantFiled: April 7, 2017Date of Patent: November 5, 2019Assignee: e-SENS, Inc.Inventors: Richard B. Brown, Ondrej Novak
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Patent number: 10359391Abstract: Embodiments are directed to a chemical sensor and a method of fabricating a chemical sensor that includes a membrane having full circumferential adhesion. The chemical sensor device includes a silicon substrate comprising a sensor-side and a backside. The sensor-side includes a sensor-side electrode; a first passivation layer disposed on the substrate; and a second passivation layer on the first passivation layer and adjacent to the sensor-side electrode, the passivation layer comprising an adhesion trench exposing a portion of the first passivation layer, and a polyimide ring disposed on the second passivation layer. The backside includes a backside electrode on the backside of the substrate. The substrate includes an electrically isolated doped region, such as a through silicon via, electrically connecting the sensor-side electrode and the backside electrode.Type: GrantFiled: July 7, 2016Date of Patent: July 23, 2019Assignee: e-SENS, Inc.Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20190083980Abstract: Aspects of the embodiments are directed to a microfluidic chip and methods of making the same. The microfluidic chip can include a sensor device residing on the microfluidic chip, the sensor-side comprising a chemical sensor and the backside including a backside electrode, the chemical sensor electrically coupled to the backside electrode by a via; a microfluidics channel in the microfluidic chip, the sensor-side of the sensor device facing the microfluidics channel; and a metal contact electrically connected to the backside electrode.Type: ApplicationFiled: September 20, 2017Publication date: March 21, 2019Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20180290137Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.Type: ApplicationFiled: April 7, 2017Publication date: October 11, 2018Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20180011046Abstract: Embodiments are directed to a chemical sensor and a method of fabricating a chemical sensor that includes a membrane having full circumferential adhesion. The chemical sensor device includes a silicon substrate comprising a sensor-side and a backside. The sensor-side includes a sensor-side electrode; a first passivation layer disposed on the substrate; and a second passivation layer on the first passivation layer and adjacent to the sensor-side electrode, the passivation layer comprising an adhesion trench exposing a portion of the first passivation layer, and a polyimide ring disposed on the second passivation layer. The backside includes a backside electrode on the backside of the substrate. The substrate includes an electrically isolated doped region, such as a through silicon via, electrically connecting the sensor-side electrode and the backside electrode.Type: ApplicationFiled: July 7, 2016Publication date: January 11, 2018Inventors: Richard B. Brown, Ondrej Novak
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Publication number: 20080283071Abstract: The invention relates to the cigarette filter containing the microfibres, which contains from 0.5 to 10% by weight of polymeric nanofibres, that are arranged among the microfibres. At manufacturing of cigarette filter containing the microfibres, the nanofibres or shreds of surface nanofibrous textile are brought to the surface of a configuration designated for production of the cigarette filter formed at least of 90% by weight of microfibres, and they are deposited onto the surface and/or into the volume of the configuration in a quantity from 0.5 to 10% b weight.Type: ApplicationFiled: October 24, 2006Publication date: November 20, 2008Inventors: Oldrich Jirsak, Filip Sanetrnik, Ondrej Novak, Pavel Pokorny, Ladislav Mares