Abstract: A method of manufacturing an acoustic surface wave device comprising: forming two pairs of transducers, a multistrip coupler and lead patterns for electrically shorting at least one pair of the transducers on a piezoelectric material; mounting the piezoelectric material on a package base having pins; bonding the electrodes of the opened transducers to the pins by wires, and; testing the device by applying and obtaining signals of the opened transducers through the pins. In this manufacturing method, testing is carried out without using probing technology.