Patents by Inventor Onofre A. Rulloda, Jr.

Onofre A. Rulloda, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip scale integrated circuit package
    Patent number: 6667191
    Abstract: An integrated circuit package including a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer and a plurality of solder ball contacts. The solder ball contacts are in electrical connection with die circuitry on the front surface of the silicon wafer.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: December 23, 2003
    Assignee: Asat Ltd.
    Inventors: Neil McLellan, Wing Him Lau, Tak Sang Yeung, Onofre A. Rulloda, Jr.