Abstract: An improved bonding tool for bonding a ribbon characterized by a thickness to a bonding pad and the method for using the same is disclosed. The bonding tool includes a transducer and a bond foot having a plurality of protrusions extending therefrom for pressing the ribbon against the bonding pad, the protrusions having a height greater than 40 percent of the ribbon thickness. The bond foot to moves with respect to the bond pad while the bond foot is pressed against the ribbon. In one embodiment, the height of the protrusions is between 40 and 80 percent of the thickness of the ribbon. In one embodiment, the protrusions include truncated pyramids having rectangular cross-sections In one embodiment, the transducer causes said bond foot to move back and forth in a predetermined direction and said protrusions are aligned such that two sides of said protrusions are perpendicular to said predetermined direction.