Abstract: Disclosed herein are compounds that can prevent and treat C. difficile by inhibiting sporulation. Also disclosed herein are compositions and formulations comprising the compound disclosed herein. Methods of preventing and treating C. difficile comprising administering the compounds described herein are also disclosed.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: Method and/or apparatus embodiments for 3-D cephalometric analysis of a patient, acquires reconstructed volume image data from a computed tomographic scan of a patient's head including one or more dentition elements within the mouth of the patient, and computes one or more cephalometric parameters for the patient according to the reconstructed volume image data and the one or more dentition elements. One or more results generated from cephalometric analysis of the one or more computed cephalometric parameters can be stored, transmitted or displayed. The reconstructed volume image data is updated with 3D surface model from a subsequent optical scan of the patient's dentition and the one or more cephalometric parameters for the patient are re-computed based on the updated reconstructed volume image data.

Abstract: The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.

Abstract: An optical component driving mechanism is provided. The optical component driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The movable portion and the fixed portion are arranged along a main axis. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The fixed portion includes a first guide component for guiding the movable portion to move relative to the fixed portion.

Abstract: An optical component driving mechanism is provided. The optical component driving mechanism includes a first movable portion, a fixed portion, a first driving assembly, and a first support assembly. The first movable portion is configured to connect the first optical component. The first movable portion is movable relative to the fixed portion. The first driving assembly is configured to drive the first movable portion to move relative to the fixed portion. The first movable portion is movable relative to the fixed portion via the first support assembly. The first movable portion is movable relative to the fixed portion in a first dimension within a first-limit range.

Abstract: A navigation satellite time system and its autonomous recovery method are provided, including a load time system, the load time system is configured to generate and maintain the load time, and the load time system comprises an space borne atomic clock, a time-frequency processing unit and a plurality of load time backups module, the time information of the load time is obtained from the ground station time; the pulse-per-second signals of the load time are generated and maintained by the space borne atomic clock and the time-frequency processing unit; when the time-frequency processing unit fails, the first-level recovery state is triggered: the time-frequency processing unit compares the time information and the pulse-per-second signals reversely output by the multiple load time backup modules to perform load time recovery.

Abstract: A system and method for controlling a merge vehicle travelling along a highway having a merge lane and a main lane. The method includes receiving merge data about the merge vehicle and a surrounding environment of the merge vehicle. The method includes detecting an intent to perform a merge maneuver by the merge vehicle from the merge lane to the main lane based on the merge data. Further, the method includes generating a graph having a plurality of nodes connected by edges. The plurality of nodes includes a start node set to a current position of the merge vehicle and a goal node located in the main lane after the merge lane has ended. The method includes calculating a three-dimensional (3D) trajectory based on the graph by optimizing edge costs from the start node to the goal node, and controlling the merge vehicle based on the 3D trajectory.

Abstract: A corrosion-resistant nickel alloy is provided. The alloy includes the following components in percentage by mass: 4.68-5.35% of B, 5.69-6.41% of W, 27.68-28.39% of Cr, 12.65-13.42% of Al, and the balance of Ni and inevitable impurities. The corrosion-resistant nickel alloy is a Ni—W—B ternary alloy with main components of Ni, W and B, wherein the three elements have strong high-temperature corrosion resistance at a temperature of about 600° C., and have the potential of solid solution hardening and precipitate formation because all belong to solid solution forming elements, so that a creep strength of a nickel alloy matrix is improved. Meanwhile, Al and Cr are further added in the alloy formula, so that Al2O3 and Cr2O3 oxide layers can be formed, which play a role as a physical diffusion barrier against chlorine gas and other corrosive gases.

Abstract: The present invention is related to a self-assembled nanoparticle containing a gB protein of an EB virus and a preparation method and use thereof. The self-assembled nanoparticle comprises a first polypeptide and a second polypeptide; the first polypeptide comprises the gB protein and a first vector subunit, the second polypeptide comprises a second vector subunit; the first vector subunit is I53-50A1, and the second vector subunit is I53-50B.4PT1. In the self-assembled nanoparticle, the gB protein of the EB virus is displayed on the surface of the nanoparticle for the first time. The particle size of the self-assembled nanoparticle is larger than that of the antigen gB, and the chemical stability of the self-assembled nanoparticle is higher than that of the antigen gB, and the binding capacity with the neutralizing antibody of the self-assembled nanoparticle are higher than that of the antigen gB.

Abstract: Methods, systems, and devices for power saving schemes in wireless communication are described. A wireless communication method is provided to comprise monitoring, by a user device, power saving indications transmitted from a network device during corresponding monitoring occasions predefined or configured by a higher layer parameter, the power saving indications including a first typed power saving indication or a second typed power saving indication; and performing a next action based on a predefined condition.

Abstract: Semiconductor device includes light-emitting die and semiconductor package. Light emitting die includes substrate and first conductive pad. Substrate has emission region located at side surface. First conductive pad is located at bottom surface of substrate. Semiconductor package includes semiconductor-on-insulator substrate, interconnection structure, second conductive pad, and through semiconductor via. Semiconductor-on-insulator substrate has linear waveguide formed therein. Interconnection structure is disposed on semiconductor-on-insulator substrate. Edge coupler is embedded within interconnection structure and is connected to linear waveguide. Semiconductor-on-insulator substrate and interconnection structure include recess in which light-emitting die is disposed. Edge coupler is located close to sidewall of recess. Second conductive pad is located at bottom of recess. Through semiconductor via extends across semiconductor-on-insulator substrate to contact second conductive pad.

Abstract: This application discloses a communication method and an apparatus. A principle of the method is as follows: A spreading factor of a spreading block is adjusted based on available resource elements REs in a time-frequency resource block, then, the spreading block is generated by using the adjusted spreading factor, and finally, the generated spreading block is mapped to the available resource elements in the time-frequency resource block for sending. In this way, a requirement that “locations of spreading blocks of a plurality of users need to be aligned” can be satisfied, and no complex symbol is discarded, so that detection performance of the spreading blocks is ensured.

Abstract: The present invention relates to an exchangeable additive manufacturing machine system. The system includes a manufacturing spindle; a thermal conducting module configured to include a working well in a center portion, wherein the manufacturing spindle is configured to rotate in the working well and the manufacturing spindle and the working well defines a manufacturing area; and an air curtain isolation mechanism module, configured to attach on a peripheral region in proximity to the thermal conducting module to actively generate an airflow across the working well and the manufacturing area to isolate the manufacturing area from an external environment.

Abstract: An electrochemical energy storage device comprises: a cover plate (4), comprising a lead-out bar (41) and a fixing plate (42), wherein the lead-out bar (41) is a conductor, the fixing plate (42) is an insulator, and the lead-out bar (41) vertically passes through the fixing plate (42) and is fixed thereon; a housing (9), which is cylindrical and is provided with an opening at at least one end thereof, wherein the insulating fixing plate (42) and the opening of the housing (9) are connected in a sealed manner by means of a sealing ring (2); and a rolled core (7), provided in an inner cavity of the housing (9), wherein the rolled core (7) is conductively connected to the lead-out bar (41) by means of an upper connecting piece (6), and is conductively connected to another lead-out end of the housing (9) by means of a lower connecting piece (8); and the device further comprises: a welding ring (1), conductively connected to the housing (9) by means of welding, and a welding bar (3), conductively connected to the