Abstract: A method includes: epitaxially growing a first multi-layer stack over a first substrate; epitaxially growing a second multi-layer stack over a second substrate; and bonding the first multi-layer stack to the second multi-layer stack. The first substrate and the second substrate have different crystalline orientations. The method further includes patterning the first multi-layer stack and the second multi-layer stack to form a fin, the fin comprising a plurality of lower nanostructures alternatingly stacked with first dummy nanostructures and a plurality of upper nanostructures alternatingly stacked with second dummy nanostructure; replacing the first dummy nanostructures with a first gate stack, the first gate stack surrounding each of the plurality of lower nanostructures; and replacing the second dummy nanostructures with a second gate stack, the second gate stack surrounding each of the plurality of upper nanostructures.

Abstract: A gate oxide layer for a high voltage transistor is formed using methods that avoid thinning in the corners of the gate oxide layer. A recess is formed in a silicon substrate. The exposed surfaces of the recess are thermally oxidized to form a thermal oxide layer of the gate oxide layer. A high temperature oxide layer of the gate oxide layer is then formed within the exposed surfaces of the recess by chemical vapor deposition. The combination of the thermal oxide layer and the high temperature oxide layer results in a gate oxide layer that does not exhibit the double hump phenomenon in the drain current vs. gate voltage curve. The high temperature oxide layer may include a rim that extends out of the recess.

Abstract: A semiconductor includes a substrate. A gate structure is disposed on the substrate. A liner oxide contacts a side of the gate structure. A silicon oxide spacer contacts the liner oxide. An end of the silicon oxide spacer forms a kink profile. A silicon nitride spacer contacts the silicon oxide spacer and a tail of the silicon nitride spacer covers part of the kink profile. A stressor covers the silicon nitride spacer and the substrate.

Abstract: A integrated circuit includes a first, a second, a third, and a fourth gate, a first input pin and a first conductor. The first and third gate are on a first level. The second and fourth gate are on a second level. The second gate is coupled to the first gate. The fourth gate is coupled to the third gate. The first input pin extends in a second direction, is on a first metal layer above a front-side of a substrate, is coupled to the first gate, and configured to receive a first input signal. The first input pin is electrically coupled to the third gate by the first, second or fourth gate. The first conductor extends in the first direction, is on a second metal layer below a back-side of the substrate, and is coupled to the second and fourth gate.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A first opening is formed at a surface of a semiconductor substrate to expose a portion of an isolation region embedded in the semiconductor substrate. A buffer layer is formed over the surface of the semiconductor substrate and lining the first opening. A second opening is formed at a bottom of the first opening. A barrier layer is formed over the surface of the semiconductor substrate. A conductive pad is formed in the first and the second openings. The barrier layer includes an upper portion in contact with the buffer layer in the first opening and a lower portion lining the second opening. The lower portion of the barrier layer is free from surrounded by the buffer layer. A method for manufacturing a BSI image sensor is also provided.

Abstract: The invention discloses a display module comprising a black optical layer and a transparent protective layer. The black optical layer covers the light-emitting units and ensures proper alignment and sealing. Light-emitting units penetrate the optical layers to maintain uninterrupted light output. The packaging structure reduces moisture intrusion and protects against environmental damage. A transparent protective layer overlays the black optical layer, enhancing durability and structural integrity. Additionally, the module incorporates an anti-glare film press-fitted onto the packaging layer, minimizing external light interference and optimizing light distribution across viewing angles. These design features enable a thinner display with consistent optical performance.

Abstract: Precursor compositions and related methods are provided. A precursor composition comprises a precursor compound of the formula: [(L1)nM(L2)m-n]z, where: L1 is a first ligand; M is a metal; L2 is a second ligand; n is 1 to 6; m is an oxidation state of M; and z is 1 or 2. A purity of the precursor compound in the composition is at least 99.5%. Methods for forming films and methods for making precursor compositions are provided.

Abstract: A T-cell epitope polypeptide of Senecavirus A (SVA) having an amino acid sequence represented by one of SEQ ID NOs: 1-7: SEQ ID NO: 1: DEALGRVLTPAAVDEALVDL; SEQ?ID?NO:?2: AILAKLGLALAAVTPGLIIL; SEQ?ID?NO:?3: KASPVLQYQL; SEQ?ID?NO:?4: EMKKLGPVAL; SEQ?ID?NO:?5: AHDAFMAGSG; SEQ?ID?NO:?6: PPLGDDQIEYLQVLKSLALT; and SEQ?ID?NO:?7: LASTLIAQAVSKRLYGSQSV.

Abstract: In a first aspect of the disclosure there is provided a multi-spectral optical sensor comprising: a monolithic semiconductor chip defining a plurality of subarrays of optical detector regions, each array comprising the same number and relative spatial arrangement of optical detector regions; a plurality of optical filters; and a plurality of lens elements, wherein each optical filter is positioned between a corresponding lens element and a corresponding subarray of optical detector regions such that light from a scene incident on any one of the lens elements along a direction of incidence propagates through the corresponding optical filter towards a corresponding one of the optical detector regions of the corresponding subarray of optical detector regions, which corresponding one of the optical detector regions depending on the direction of incidence, and wherein the incident light forms an out-of-focus image of the scene at a plane of the optical detector regions.

Abstract: Provided herein are anti-CD39 antibodies that inhibit the enzymatic activity of human CD39 and methods of using the same.

Abstract: The present disclosure relates to silane coupling agents, silane functional polymers, a method of making silane coupling agents, and the use of silane coupling agents in a method of making silane functional polymers. The present disclosure further relates to a composition comprising one or more silane functional polymers, as well as a number of usage compositions.

Abstract: A temperature-sensitive and humidity-regulating fiber includes a polymer. The polymer includes a polyester main chain and at least one side chain, and the side chain is connected to the polyester main chain. The side chain is a structure shown in Formula (1): in which R is an alkylene group.

Abstract: The present invention discloses a maleic anhydride modified voltage stabilizer, a preparation method, and use thereof, which belongs to the technical field of high voltage and insulation. The present invention discloses a maleic anhydride modified voltage stabilizer represented by Formula 1 and a preparation method thereof. (1) Maleic anhydride and 2,4-dihydroxybenzophenone are dissolved in tetrahydrofuran to obtain a mixture. (2) In a protective gas atmosphere, the mixture obtained in step (1) is added with a catalyst and stirred, centrifuged with added water, and an obtained precipitate is dried, thereby achieving the maleic anhydride modified voltage stabilizer. The present invention also provides the use of the maleic anhydride modified voltage stabilizer in a cross-linked polyethylene high voltage AC cable insulating material.

Abstract: The present disclosure discloses a child safety seat, which is for being installed on a vehicle seat. The child safety seat includes a base having an anchor part connected to the vehicle seat; a seat coupled to the base; a top rod fixed to the rear of the base; a tether assembly including a top tether and a tether fixing portion that are connected with each other, the top tether being connected with the top rod and the tether fixing portion being connected with the vehicle seat; and an alarm device including a switch which can be triggered when the top tether is tightened. The present disclosure also discloses a tether assembly and a support structure. The child safety seat can conveniently prompt that it is not correctly fixed, and can be conveniently fixed and adjusted, thereby improving the safety and riding comfort of the child safety seat.

Abstract: A vehicle dolly comprises two parallel lifting axle assemblies and two wheel assemblies, two ends of each of the lifting axle assemblies being detachably connected to the two wheel assemblies, each of the wheel assemblies comprising: a main beam; a first support wheel and a second support wheel; a first mount assembly and a second mount assembly, the first mount assembly connecting the first support wheel to a first end of the main beam, the second mount assembly connecting the second support wheel to a second end of the main beam; and a plurality of lifting means, each lifting means being provided between each mount assembly and the main beam, each lifting means comprising a screw rod and a corresponding nut that cooperate with each other to lift and lower the main beam relative to the support wheels. It enables long-distance and high-speed vehicle moving and makes operation more convenient.

Abstract: A system for providing information about a vehicle involved in a collision includes a sensing device affixed to the vehicle. The sensing device includes a sensor module configured to perform measurements of one or more conditions of the vehicle, an antenna module configured to transmit and receive radio-frequency (RF) signals, a power module configured to provide power to the sensing device, and a sensing device controller. The sensing device controller is in electrical communication with the sensor module, the antenna module, and the power module. The sensing device controller is programmed to receive an excitation signal from an external transceiving device. The sensing device controller is further programmed to perform a measurement using the sensor module in response to receiving the excitation signal. The sensing device controller is further programmed to transmit the measurement to the external transceiving device using the antenna module.

Abstract: The present application provides a processing method of a metal composite structure including a first metal layer and a second metal layer stacked on the first metal layer. The processing method includes the steps of defining a first through hole in the first metal layer, and drilling in the first through hole toward the second metal layer to form a traction hole in the second metal layer. Then, hot melt drilling is performed on a surface of the second metal layer away from the first metal layer toward the first through hole, thereby causing the second metal layer to crack under a traction force of the traction hole to form a second through hole, and a portion of the second metal layer to be melted and squeezed to form a bushing which adheres to at least a portion of a sidewall of the first through hole.

Abstract: A greeting card that selectively opens and closes. The greeting card assembly simulates a firework display in the background of a foreground message when opened. The greeting card assembly has a card section that contains an internal compartment covered by a top panel. A plurality of cutouts are formed through the top panel that are shaped as firework starbursts. LEDs are positioned within the internal compartment for selectively backlighting the cutouts. A light diffusing element is interposed between the cutouts and the LEDs. A speaker is positioned within the internal compartment for playing a digital soundtrack of exploding fireworks. At least one foreground panel is provided that is positioned a distance from the top panel when the greeting card assembly is opened. When viewed, the foreground panels stand in front of a card section that is playing a soundtrack and flashing lights behind starburst cutouts to simulate background fireworks.

Abstract: The present disclosure generally provides poly-alkali metal salts of flavanones, dihydrochalcones, and related polyphenolic compounds. In some aspects, the disclosure provides certain compositions that include such poly-alkali metal salts of flavanones, dihydrochalcones, and related polyphenolic compounds, such as compositions that include such poly-alkali metal salts of flavanones, dihydrochalcones, and related polyphenolic compounds and one or more sweeteners. In some other aspects, the disclosure provides methods of reducing the caloric content of a sweetened article, such as a sweetened food or beverage product.

Abstract: A curable composition includes an epoxy monomer component and an aniline-based hardener. The epoxy monomer component is a first component formed from a first epoxy monomer represented by Formula (I), or a second component including the first epoxy monomer represented by Formula (I) and a second epoxy monomer different from the first epoxy monomer represented by Formula (I), wherein each of the substituents in Formula (I) is given the definitions as set forth in the Specification and Claims. Based on 100 wt % of the epoxy monomer component, an amount of the first epoxy monomer represented by Formula (I) is not smaller than 25 wt % and less than 100 wt % and an amount of the second epoxy monomer is greater than 0% and not greater than 75 wt %. A cured product formed from the curable composition, and a method for encapsulating a semiconductor device using the curable composition are also provided.