Abstract: A system for preventing rolling-over of vehicles is disclosed: The system may include: at least one camera attached to a portion of the vehicle such that images capture by the camera include a portion of the vehicle and a portion of a surrounding area; a communication module; and a controller configured to: receive from the camera, via the communication module, at least one image; receive data related to the parameters of the vehicle; calculate a relative position between the vehicle and a ground based on the received at least one image; calculate a location of the vehicle's center of gravity based on the received at least one image and the data related to the parameters of the vehicle; and determine a probability of rolling-over the vehicle based on the calculated center of gravity and the relative position.

Abstract: A system for preventing rolling-over of vehicles is disclosed: The system may include: at least one camera attached to a portion of the vehicle such that images capture by the camera include a portion of the vehicle and a portion of a surrounding area; a communication module; and a controller configured to: receive from the camera, via the communication module, at least one image; receive data related to the parameters of the vehicle; calculate a relative position between the vehicle and a ground based on the received at least one image; calculate a location of the vehicle's center of gravity based on the received at least one image and the data related to the parameters of the vehicle; and determine a probability of rolling-over the vehicle based on the calculated center of gravity and the relative position.

Abstract: A system, a non-transitory computer program product and a method for selecting an inspection recipe, the method includes: (i) obtaining an image of a structural element of the semiconductor device; (ii) calculating multiple types of distances between the image of the structural element and each of a plurality of reference images obtained by applying a plurality of inspection recipes; and (iii) automatically selecting at least one selected inspection recipe out of the plurality of inspection recipes based on values of the multiple types of distances.

Abstract: A system, a non-transitory computer program product and a method for selecting an inspection recipe, the method includes: (i) obtaining an image of a structural element of the semiconductor device; (ii) calculating multiple types of distances between the image of the structural element and each of a plurality of reference images obtained by applying a plurality of inspection recipes; and (iii) automatically selecting at least one selected inspection recipe out of the plurality of inspection recipes based on values of the multiple types of distances.

Abstract: A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.

Abstract: A device for measuring a height of a microscopic structure, the device may include: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude information to provide a mask that comprises masked amplitude pixels; a phase information circuit arranged to apply the mask on the phase information to provide masked phase pixels; select, out of the masked phase pixels, selected phase pixels that correspond to a phase criterion, the selected phase pixels have selected phase pixels attribute values; find, out of the phase information, elected phase pixels that have the selected phase pixel attribute values; and a height calculation circuit arranged to generate a height measurement result based the elected phase pixels.