Patents by Inventor Or Weis

Or Weis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11909563
    Abstract: The embodiments of the present application provide a method and apparatus for modulation recognition of signals based on cyclic residual network, the method comprises: obtaining a signal matrix of a to-be-recognized signal, and extracting real part information and imaginary part information of the signal matrix; generating, according to extracted real part information and imaginary part information, a real-and-imaginary-part feature matrix of the to-be-recognized signal; converting, according to a preset matrix conversion method, the real-and-imaginary-part feature matrix into an amplitude-and-phase feature matrix; and inputting the amplitude-and-phase feature matrix into a pre-trained cyclic residual network to obtain a modulation mode corresponding to the to-be-recognized signal.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: February 20, 2024
    Assignee: BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Zhiyong Feng, Sai Huang, Rui Dai, Ping Zhang, Fan Ning, Qixun Zhang, Yifan Zhang, Zhiqing Wei
  • Patent number: 11908538
    Abstract: Various memory cell structures and power routings for one or more cells in an integrated circuit are disclosed. In one embodiment, different metal layers are used for power stripes that are operable to connect to voltage sources to supply different voltage signals, which allows some or all of the power stripes to have a larger width. Additionally or alternatively, fewer metal stripes are used for signals in a metal layer to allow the power stripe in that metal layer to have a larger width. The larger width(s) in turn increases the total area of the power stripe(s) to reduce the IR drop across the power stripe. The various power routings include connecting metal pillars in one metal layer to a power stripe in another metal layer, and extending a metal stripe in one metal layer to provide additional connections to a power stripe in another metal layer.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng, Kam-Tou Sio
  • Patent number: 11908233
    Abstract: A system, method, and apparatus for generating a normalization of a single two-dimensional image of an unconstrained human face. The system receives the single two-dimensional image of the unconstrained human face, generates an undistorted face based on the unconstrained human face by removing perspective distortion from the unconstrained human face via a perspective undistortion network, generates an evenly lit face based on the undistorted face by normalizing lighting of the undistorted face via a lighting translation network, and generates a frontalized and neutralized expression face based on the evenly lit face via an expression neutralization network.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: February 20, 2024
    Assignee: Pinscreen, Inc.
    Inventors: Koki Nagano, Huiwen Luo, Zejian Wang, Jaewoo Seo, Liwen Hu, Lingyu Wei, Hao Li
  • Patent number: 11906432
    Abstract: The present invention provides, among other things, devices, kits, apparatus, and methods for rapid homogenous cell staining and imaging. Particularly, in some embodiments, the present invention can immunochemically stain a cell or a tissue in less than 60 seconds without washing. In some embodiments, the present invention stains and observers analyte (protein or nucleic acid) inside a cell in 60 seconds without wash.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: February 20, 2024
    Assignee: Essenlix Corporation
    Inventors: Stephen Y. Chou, Wei Ding, Ji Li, Shengjian Cai, Yufan Zhang, Jia Peng
  • Patent number: 11908836
    Abstract: A semiconductor package includes a first die, a second die, an encapsulating material, and a redistribution structure. The second die is disposed over the first die and includes a plurality of bonding pads bonded to the first die, a plurality of through vias extending through a substrate of the second die and a plurality of alignment marks, wherein a pitch between adjacent two of the plurality of alignment marks is different from a pitch between adjacent two of the plurality of through vias. The encapsulating material is disposed over the first die and at least laterally encapsulating the second die. The redistribution structure is disposed over the second die and the encapsulating material and electrically connected to the plurality of through vias.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsien-Wei Chen, Ming-Fa Chen
  • Patent number: 11910506
    Abstract: The present disclosure discloses A lamp controller, comprising a DC power supply and a switch unit, wherein an output end of the DC power supply is electrically connected to the switch unit, the switch unit comprises a first switch set, a second switch set and a control module for controlling the first switch set and the second switch set to be turned on alternately, an output end of the control module is electrically connected to the first switch set, and the output end of the control module forms a second set of switch circuit after being electrically connected to the second switch set; and the lamp controller further comprises a control unit, which is electrically connected to the switch unit; the switch unit further comprises: a first toggle switch.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: February 20, 2024
    Assignee: Changzhou Jutai Electronic Co., Ltd.
    Inventors: Jun Lin, Chengqian Pan, Wei Huang, Jin Chen
  • Patent number: 11908884
    Abstract: An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chou, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu
  • Patent number: 11905378
    Abstract: A high-grafting density cyclic comb shaped polymer and its preparation method therefor. The method comprises the following steps: 1) synthesizing linear poly(pentafluorophenyl 4-vinylbenzoate) (l-PPF4VB4.0k); 2) performing photo-induced cyclization on the linear polymer to prepare the cyclic polymer (c-PPF4VB4.0k); 3) performing post modification on the cyclic polymer c-PPF4VB4.0k by using small molecules to prepare a functionalized cyclic polymer (c-P1); 4) then performing polymer post modification on the cyclic polymer (c-P1) by using an efficient click reaction to construct the high-grafting density cyclic comb shaped polymer (c-P1-g-PS); and 5) directly performing polymer post modification on the cyclic polymer c-PPF4VB4.0k by using macromolecules to construct a high-grafting density cyclic comb shaped polymer (c-PPF4VB4.0k-g-PEG), the obtained cyclic comb shaped polymer still remaining the characteristic of a narrow molecular weight distribution.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: February 20, 2024
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Wei Zhang, Shuangshuang Zhang, Jieai Li, Xiulin Zhu, Zhengbiao Zhang, Nianchen Zhou
  • Patent number: 11910449
    Abstract: A method of operating a first infrastructure equipment forming part of a wireless communications network is provided. The method comprises transmitting radio signals to and/or receiving radio signals from a second of infrastructure equipment using frequency resources of a first of bandwidth parts, a first infrastructure equipment being connected to the second infrastructure equipment on a downlink of the first infrastructure equipment and configured to allocate uplink communications resources to the second infrastructure equipment, and transmitting radio signals to and/or receiving radio signals from a third of the infrastructure equipment using frequency resources of a second of bandwidth parts, the first infrastructure equipment being connected to the third infrastructure equipment on an uplink of the first infrastructure equipment and configured to receive allocated uplink communications resources from the third infrastructure equipment.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: February 20, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Yuxin Wei, Vivek Sharma, Hideji Wakabayashi, Yassin Aden Awad
  • Patent number: 11906895
    Abstract: An image capture method for flash photography includes: capturing at least one first image while a strobe device is operating under a first strobe intensity setting for emitting main flash, capturing at least one second image while the strobe device is operating under a second strobe intensity setting different from the first strobe intensity setting, and generating an output image by blending the at least one first image and the at least one second image.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: February 20, 2024
    Assignee: MEDIATEK INC.
    Inventors: Po-Yu Yeh, Shao-Hsiang Chang, Chia-Ping Chen, Keh-Tsong Li, Gang-Wei Fan
  • Patent number: 11907636
    Abstract: A method of generating an IC layout diagram includes receiving a first gate resistance value of a gate region in an IC layout diagram, the first gate resistance value corresponding to a location of a gate via positioned within an active region and along a width of the gate region extending across the active region, determining a second gate resistance value based on the location and the width, using the first and second resistance values to determine that the IC layout diagram does not comply with a design specification, and based on the non-compliance with the design specification, modifying the IC layout diagram.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ke-Ying Su, Jon-Hsu Ho, Ke-Wei Su, Liang-Yi Chen, Wen-Hsing Hsieh, Wen-Koi Lai, Keng-Hua Kuo, Kuopei Lu, Lester Chang, Ze-Ming Wu
  • Patent number: 11904519
    Abstract: Present invention is related to an extrusion equipment for processing a fibre composite. The extrusion equipment comprises a decompression and a melt tank arranged and operated vertically along with the direction of gravity. The melt tank comprises a melt tank impregnation section and a melt tank control section with a melt tank cavity as a channel condition defined within. The channel has its inner diameter or passage gradually decreased from top to bottom. The extrusion equipment provided by the present invention is configured in the direction of gravity for processing the melted thermoplastic resin and the fibre vertically for avoiding fibre fracture or breakage and improving the quality of the final products. As the melted plastic is processed vertically along with the gravity, the melted plastic could transfer or pass through the channel quickly without resulting decomposition due to the high heat and the long retention time in the cavity.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: February 20, 2024
    Assignee: Plastics Industry Development Center
    Inventors: Chia-Yu Yu, Li-Kai Lin, Chia-Hsin Tung, Wei-Cheng Chen
  • Patent number: 11905235
    Abstract: The present invention provides a method for preparing 2,2-bis(4-hydroxycyclohexyl)propane, comprising: hydrogenating a reactive solution containing 2,2-bis(4-hydroxyphenyl)propane under a hydrogen atmosphere in a reactor with catalyst within a temperature range of 80-165° C. and a pressure range of 85-110 kg/cm2 to prepare the 2,2-bis(4-hydroxycyclohexyl)propane. The method of present invention has an advantage of high yield properties and achieves mass production easily, thereby enhancing the value of the industrial application.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: February 20, 2024
    Assignee: CHINA PETROCHEMICAL DEVELOPMENT CORPORATION, TAIPEI (TAIWAN)
    Inventors: Yi-Chi Wang, Hsin-Wei Chang, Weng-Keong Tang, Chia-Hui Shen
  • Patent number: 11905998
    Abstract: A transmission shaft automatic connection and disengagement device and test equipment. An input shaft drives a transmission shaft to rotate through a second connection shaft, a ratchet assembly, a first connection shaft and an output shaft so as to apply an acceleration torque, gears of the input shaft and the first connection shaft can be completely engaged and completely separated through extension and retraction of piston rods of a first group of air cylinders and a second group of air cylinders so as to achieve an effect that when a driving shaft needs to perform driving, a power system gets involved, and after driving is completed, the power system is cut off, and through the ratchet assembly, the transmission shaft can be prevented from driving a motor to work in reverse.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: February 20, 2024
    Assignee: CITIC Dicastal Co., Ltd.
    Inventors: Qiang Liu, Chenguang Wei, Zhihua Zhu, . Alateng, Zhigao Yin, Zuo Xu
  • Patent number: 11904865
    Abstract: Provided is an intelligent safe vehicle speed measurement method and an system capable of considering a state of a road surface, including: a laser scanning unit configured to obtain road surface textures and simulate contact under different vehicle loads and tire patterns; a wireless communication unit configured to obtain the model, load and tire information of incoming vehicles, offer a best-matching braking distance by search through database; a skid resistance prediction unit configured to obtain environmental parameters to correct the obtained best-matching braking distance, and offer a safe speed for incoming vehicles; and a warning reminder unit configured to broadcast the safe running speed to incoming vehicles. This system communicates between the vehicle and road, obtains the information from incoming vehicles in real time, and broadcasts the safe speed to incoming vehicles, ensuring the safety of the incoming vehicle during running.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: February 20, 2024
    Assignee: CHANG'AN UNIVERSITY
    Inventors: Wei Jiang, Wanli Ye, Aimin Sha, Hao Lu, Dongdong Yuan, Jinhuan Shan, Pengfei Li, Jingjing Xiao
  • Patent number: 11905964
    Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 20, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Chu-Hsien Chou, Yi-Chih Lin, Pei-Chuan Lee, Wen-Hao Liu
  • Patent number: 11910413
    Abstract: Wireless communication devices, systems, and methods relate to selecting transmission parameters that optimize a dimension (e.g., time, frequency, and/or spatial) under a set of constraints. A UE may receive a resource allocation mode indication and a traffic parameter indication from a BS. The resource allocation mode indication informs the UE to optimize along a time dimension, a frequency dimension, and/or a spatial domain. The traffic parameter indication informs the UE what constraints to consider for the transmission parameters. The UE may use this information upon receipt of a reference signal in selecting transmission parameters based on the received reference signal, resource allocation mode indication, and traffic parameter indication. The resource allocation mode may correspond to optimization within a single slot or across multiple slots. Once selected, the UE may transmit the transmission parameters to the BS for use in sending the message to the UE.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: February 20, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Jay Kumar Sundararajan, Prashanth Haridas Hande, Wanshi Chen, Yeliz Tokgoz, Naga Bhushan, Wei Yang
  • Patent number: 11910440
    Abstract: Disclosed are a method for communication, an electronic device, and a computer-readable storage medium. The method includes: determining a first target frequency based on historical sensed information of a destination node; transmitting an RTS frame to the destination node at the first target frequency, where the destination node obtains first sensed information of the source node from the RTS frame, and determines a first optimal receiving frequency of the source node based on the first sensed information; receiving a CTS frame transmitted by the destination node at the first optimal receiving frequency; obtaining second sensed information of the destination node from the CTS frame; determining a second optimal receiving frequency of the destination node based on the second sensed information; transmitting a data frame to the destination node at the second optimal receiving frequency; and receiving an ACK frame transmitted by the destination node at the first optimal receiving frequency.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: February 20, 2024
    Assignee: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY
    Inventors: Jibo Wei, Fanglin Gu, Haitao Zhao, Jie Liu, Xiaoran Liu, Jun Xiong
  • Patent number: 11905379
    Abstract: Described herein are associative polymers capable of controlling a physical and/or chemical property of non-polar compositions and related compositions, methods and systems. Associative polymers herein described have a non-polar backbone and functional groups presented at ends of the non-polar backbone, with a number of the functional groups presented at the ends of the non-polar backbone formed by associative functional groups capable of undergoing an associative interaction with another associative functional group with an association constant (k) such that the strength of each associative interaction is less than the strength of a covalent bond between atoms and in particular less than the strength of a covalent bond between backbone atoms.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: February 20, 2024
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Julia A. Kornfield, Ming-Hsin Wei
  • Patent number: D1015540
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: February 20, 2024
    Assignee: General Electric Company
    Inventors: Wei Zhang, Ryan Walter Rindy, Hui Fang, Jun Hou, Eero Tapio Hyytiainen, Jiancheng Zhang, Donald L. Beduhn, Duncan Lovel Trevor-Wilson, Wenyoung Wu