Abstract: A backlight module and a liquid crystal display device are provided. The backlight module includes a light source and a dye-doped liquid crystal panel. The light source is configured to provide light to the dye-doped liquid crystal panel; and the dye-doped liquid crystal panel includes a plurality of dye-doped liquid crystal units, which allow the light incident on themselves to pass through when in a first state and regulate the light incident on themselves when in a second state, thereby realizing regulation of backlight partitions in a pixel level and improving a contrast ratio of the liquid crystal display device.

Abstract: An immersion cooling system includes a cooling tank, an immersion unit, a first disturbing element, and a first maintaining element. The cooling tank has a receiving portion. The immersion unit is in the receiving portion, and the immersion unit includes a boiler plate. The first disturbing element has a first convex surface. The first maintaining element maintains the first disturbing element to allow a convex direction of the first convex surface towards the boiler plate, and a first predetermined distance is between the first convex surface and the boiler plate.

Abstract: A multiband antenna array is provided. The multiband antenna array includes a first multi-band antenna unit, a first high band antenna member, and a first low band antenna member. The first multi-band antenna unit includes a first high band antenna element and a first low band antenna element. A first distance is formed between the center of the first multi-band antenna unit and the center of the first high band antenna member. The first distance is 0.3˜0.8 times the wavelength of a high band signal. A second distance is formed between the center of the first multi-band antenna unit and the center of the first low band antenna member. The second distance is 0.3˜0.8 times the wavelength of a low band signal.

Abstract: An electronic equipment with an immersion cooling system includes a sealed tank filled with an electrically non-conductive liquid which is a single-phase electrically non-conductive liquid; a plurality of slots disposed in the sealed tank; at least one electric unit removably inserted in the plurality of slots and including at least one heat source; and an air supply unit disposed in the sealed tank. The air supply unit includes a ventilation tube unit and a plurality of air diffuser. The plurality of air diffusers is coupled with the ventilation tube unit, is immersed in the electrically non-conductive liquid, and is configured to generate bubbles for stirring the electrically non-conductive liquid.

Abstract: A method includes obtaining a corpus of unlabeled training data including a plurality of spoken utterances, each corresponding spoken utterance of the plurality of spoken utterances includes audio data characterizing the corresponding spoken utterance. The method also includes receiving a target domain. The method also includes selecting, using a contrastive data selection model, a subset of the utterances from the corpus of unlabeled training data that correspond to the target domain. The method includes training an automatic speech recognition (ASR) model on the subset of utterances.

Abstract: The present disclosure provides a table content processing method and apparatus, and a device and a storage medium. The table content processing method comprises: selecting data row information in a first table; in response to a trigger operation for the data row information, generating a first document or a second table, wherein the first document comprises the second table, and the second table comprises the data row information; and sending the first document or the second table to a target accessing user. By means of the present disclosure, part of content in a table can be directly shared, and two-way data synchronization is supported, such that the usage experience of a user is improved.

Abstract: A screwdriver tip structure includes a main body provided with an operation end. The operation end is provided with multiple first working sections and multiple second working sections. Each of the first working sections has a convex shape. Each of the second working sections has a concave shape. Each of the first working sections is provided with multiple grooves. Each of the first working sections has a first end and a second end. The second end has a diameter more than that of the first end. Each of the first working sections has a periphery provided with a phantom side face. The side face extends from the second end to the first end. Each of the grooves is provided with a first concave face. The first concave face of each of the grooves includes a first single arc.

Abstract: Provided are a semiconductor device and a method of forming the same. The semiconductor device includes: at least one gate structure having a first side and a second side opposite to each other; a first source/drain (S/D) feature disposed at the first side of the at least one gate structure; a second S/D feature disposed at the second side of the at least one gate structure; a first metal-to-drain/source (MD) contact disposed on the first S/D feature; and a second MD contact disposed on the second S/D feature, wherein a contact area between the first MD contact and the first S/D feature is greater than a contact area between the second MD contact and the second S/D feature.

Abstract: Example camera and hub arrangements are presented herein. An example device includes an Ethernet connector configured to provide power and data, a camera port configured to provide power and data to a camera module, and an audio port configured to provide power and data to at least one audio input/output module. The device also includes a processor configured to determine one or more camera parameters for the camera module attached to the camera port, such as a type of a camera module attached to the camera port. The device can change operation mode based on camera parameters and audio parameters associated with connected camera modules and audio modules. Different modules can be connected to the device and located remotely from the device.

Abstract: A generation method of an image defect detecting system is provided. Said method includes: obtaining a plurality of validation difference scores respectively associated with a plurality of validation images based on a semi-supervised learning model; calculating a threshold value based on the plurality of validation difference scores; creating a standby inference model based on the plurality of validation difference scores; obtaining a testing difference score associated with a testing image based on the semi-supervised learning model; adjusting the threshold value by the standby inference model in response to the testing difference score and the threshold value; and outputting data comprising the testing difference score.

Abstract: A detection apparatus includes a scanning system, the scanning system includes a micro reflector array, and the micro reflector array includes M micro reflectors. The detection apparatus further includes P transceiver modules. An optical signal sent by the P transceiver modules is reflected by the M micro reflectors, and/or the P transceiver modules receive an optical signal reflected by the M micro reflectors. The P transceiver modules do not need to receive and send signals using one micro reflector, but may receive and send signals by using the M micro reflectors.

Abstract: One example discloses an access point (AP) device for use within a wireless local area network (WLAN), including: a controller configured to send a client-to-client sounding subvariant sensing trigger frame (TF) over the WLAN to first client station (STA1) device and a second client station (STA2) device; wherein the STA1 is configured to send a sensing message in response to receiving the client-to-client sounding subvariant sensing TF; wherein the AP controller is configured to send a reporting subvariant sensing TF to the STA2 after the sensing message is sent by the STA1; wherein the STA2 is configured to send a measurement report frame to the AP in response to receiving the reporting subvariant sensing TF; and wherein the measurement report frame includes a set of channel state information (CSI) that characterizes a WLAN channel between the STA1 and the STA2.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.

Abstract: Indicating repetitions at a UE in an NTN includes decoding a communication indicating a timing relationship value associated with a distance between a serving satellite and a farthest UE in the NTN. A PRACH communication is encoded for transmission. The PRACH communication includes an indication of a number of PRACH repetitions determined based on the timing relationship value. A RAR including an uplink (UL) grant corresponding to the UE and an indication of a number of RAR repetitions is decoded. The number of RAR repetitions is determined based on the timing relationship value. A PUSCH communication including an indication of a number of PUSCH repetitions is encoded. The number of PUSCH repetitions is determined based on the timing relationship value. A content resolution communication including an indication of a number of content resolution repetitions is decoded. The number of content resolution repetitions is determined based on the timing relationship value.

Abstract: The present invention provides isolated antibodies that bind to the human EGFR protein, and ADCs of the antibodies. Pharmaceutical compositions including the antibodies and ADCs, and methods of treating cancer are also provided.

Abstract: The present disclosure describes a semiconductor device having an isolation structure. The semiconductor structure includes a set of nanostructures on a substrate, a gate dielectric layer wrapped around the set of nanostructures, a work function metal layer on the gate dielectric layer and around the set of nanostructures, and the isolation structure adjacent to the set of nanostructures and in contact with the work function metal layer. A portion of the work function metal layer is on a top surface of the isolation structure.

Abstract: A computer-implemented method for failure classification of a surface treatment process includes receiving one or more process parameters that influence one or more failure modes of the surface treatment process and receiving sensor data pertaining to measurement of one or more process states pertaining to the surface treatment process. The method includes processing the received one or more process parameters and the sensor data by a machine learning model deployed on an edge computing device controlling the surface treatment process to generate an output indicating, in real-time, a probability of process failure via the one or more failure modes. The machine learning model is trained on a supervised learning regime based on process data and failure classification labels obtained from physics simulations of the surface treatment process in combination with historical data pertaining to the surface treatment process.

Abstract: A package structure includes a semiconductor die, a first insulating encapsulant, a plurality of first conductive features, an interconnect structure and bump structures. The semiconductor die includes a plurality of conductive pillars made of a first material. The first insulating encapsulant is encapsulating the semiconductor die. The first conductive features are disposed on the semiconductor die and electrically connected to the conductive pillars. The first conductive features include at least a second material different from the first material. The interconnect structure is disposed on the first conductive features, wherein the interconnect structure includes a plurality of connection structures made of the second material. The bump structures are electrically connecting the first conductive features to the connection structures, wherein the bump structures include a third material different from the first material and the second material.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A horizontal assembly method for permanent magnet motor is mainly to firstly dispose the first bracket and the second bracket on the motor assembly platform, then fix the stator assembly on the sliding carrier so as to move with the sliding carrier to sleeve over the fixed thimble to engage the first bracket, then position the rotor assembly between the fixed thimble and the movable thimble so as to fix the rotor assembly by the protruding movable thimble, then control the sliding carrier to assemble the stator assembly and the first bracket to the rotor assembly so that the one end of the rotational shaft can be supported by the first bracket, and finally assemble the second bracket to the stator assembly so as to support another end of the rotational shaft. Thereupon, the permanent magnet motor can be produced.