Abstract: A method includes forming isolations extending into a semiconductor substrate, recessing the isolation regions, wherein a semiconductor region between the isolation regions forms a semiconductor fin, forming a first dielectric layer on the isolation regions and the semiconductor fin, forming a second dielectric layer over the first dielectric layer, planarizing the second dielectric layer and the first dielectric layer, and recessing the first dielectric layer. A portion of the second dielectric layer protrudes higher than remaining portions of the first dielectric layer to form a protruding dielectric fin. A portion of the semiconductor fin protrudes higher than the remaining portions of the first dielectric layer to form a protruding semiconductor fin. A portion of the protruding semiconductor fin is recessed to form a recess, from which an epitaxy semiconductor region is grown. The epitaxy semiconductor region expands laterally to contact a sidewall of the protruding dielectric fin.

Abstract: Methods for determining a prediction value, an encoder, and a decoder are provided. Reconstructed values of neighboring samples of a current block are acquired, and then filtered to obtain a reference value set of the current block. When a size of the current block is smaller than a preset threshold value, a first constant value is calculated according to a bit depth value of a luma component of a sample in the current block. A difference between the first constant value and a first reference value in the reference value set is determined as a first prediction input value in a prediction input value set. Other prediction input values in the prediction input value set other than the first prediction input value are determined according to the reference value set. Prediction values of samples at specific positions in the current block is calculated and then filtered.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a spacer around the gate structure; and forming a buffer layer adjacent to the gate structure. Preferably, the buffer layer includes a crescent moon shape and the buffer layer includes an inner curve, an outer curve, and a planar surface connecting the inner curve and an outer curve along a top surface of the substrate, in which the planar surface directly contacts the outer curve on an outer sidewall of the spacer.

Abstract: A vaporizer device includes various modular components. The vaporizer device includes a first subassembly. The first subassembly includes a cartridge connector that secures a vaporizer cartridge to the vaporizer device and includes at least two receptacle contacts that electrically communicate with the vaporizer cartridge. The vaporizer device includes a second subassembly. The second subassembly includes a skeleton defining a rigid tray that retains at least a power source. The vaporizer device also includes a third subassembly. The third subassembly includes a plurality of charging contacts that supply power to the power source, and an end cap that encloses an end of the vaporizer device.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: The present disclosure provides a carrier aggregation capability reporting apparatus and method, so as to prevent a user equipment (UE) from repeatedly reporting capability information corresponding to a carrier combination supported by the UE, and reduce waste of signaling resources used for reporting. The method includes: determining, by the UE, information about a carrier combination supported by the UE and information about a sub-combination that is of the carrier combination and that is supported by the UE; and reporting, by the UE to a base station, the determined information about the carrier combination supported by the UE and the determined information about the sub-combination that is of the carrier combination and that is supported by the UE.

Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.

Abstract: To extend a physical broadcast channel (PBCH) in wireless communications, an extended physical broadcast channel (EPBCH) transmission is generated with one or more legacy PBCH blocks and one or more EPBCH blocks within an extension window. A size of the extension window is determined based at least in part on a PBCH repetition number and a number of the legacy PBCH blocks relative to a number of the EPBCH blocks. The EPBCH transmission is transmitted by a base station (BS) to one or more user equipment (UE).

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may identify that an uplink control information (UCI) payload satisfies a threshold size condition. The UE may map the UCI payload to an uplink control sequence. The UE may transmit a physical uplink control channel (PUCCH) that include the uplink control sequence to a base station. The uplink control sequence may be representative of the UCI payload. The base station may receive the PUCCH that includes the uplink control sequence from the UE. The base station may also determine the UCI payload by associating the uplink control sequence with a corresponding sequence index of the one or more sets of uplink control sequences.

Abstract: Disclosed is a method of wireless communication. The method is performed at a first wireless node. The method comprises: obtaining a sequence of bits to be encoded, selecting a puncturing pattern from a plurality of puncturing patterns, generating, based on the sequence of bits to be encoded, a sequence of parity bits in accordance with a binary linear block coding scheme, puncturing, based on the selected puncturing pattern, at least one of the sequence of bits to be encoded or the sequence of parity bits, generating a plurality of modulation symbols based on remaining bits in the sequence of bits to be encoded and based on remaining bits in the sequence of parity bits, and transmitting, to a second wireless node, the plurality of modulation symbols.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.

Abstract: The present invention relates to an electrode active material, a preparation method thereof, an electrode, a battery, and an apparatus. The electrode active material includes: a core and a coating layer, where the core includes a ternary material, the coating layer coats the core, the coating layer includes a reaction product of a sulfur-containing compound and a lithium-containing compound, and the reaction product includes element Li, element S, and element O.

Abstract: Azaindole compounds and their use as inhibitors of HPK1 are described. The compounds are useful in treating HPK1-dependent disorders and enhancing an immune response. Also described are methods of inhibiting HPK1, methods of treating HPK1-dependent disorders, methods for enhancing an immune response, and methods for preparing the azaindole compounds.

Abstract: A package structure and method of forming the same are provided. The package structure includes a polymer layer, a redistribution layer, a die, and an adhesion promoter layer. The redistribution layer is disposed over the polymer layer. The die is sandwiched between the polymer layer and the redistribution layer. The adhesion promoter layer, an oxide layer, a through via, and an encapsulant are sandwiched between the polymer layer and the redistribution layer. The encapsulant is laterally encapsulates the die. The through via extends through the encapsulant. The adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant. A bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for detecting utterances of a key phrase in an audio signal. One of the methods includes receiving, by a key phrase spotting system, an audio signal encoding one or more utterances; while continuing to receive the audio signal, generating, by the key phrase spotting system, an attention output using an attention mechanism that is configured to compute the attention output based on a series of encodings generated by an encoder comprising one or more neural network layers; generating, by the key phrase spotting system and using attention output, output that indicates whether the audio signal likely encodes the key phrase; and providing, by the key phrase spotting system, the output that indicates whether the audio signal likely encodes the key phrase.

Abstract: A seat system for a vehicle including a flexible seatback structure and an adjustment device coupled thereto. The adjustment device is configured to alter a contour of a seating surface of the seatback structure by causing at least a portion of the seatback structure to move toward or away from the occupant of the seat system. The adjustment device includes at least one actuating element connected to a side portion of the seatback structure and an actuator.

Abstract: A data processing method, a data processing apparatus and a storage medium. The data processing method includes: receiving first data comprising at least one piece of second data (S101); transmitting the at least one piece of second data to at least one first data transmission channel (S102); sending, according to link cross information of a Printed Circuit Board (PCB), data of the at least one first data transmission channel to at least one corresponding data transmission link (S103); respectively receiving at least one piece of third data based on at least one port (S401); and sending, according to a channel identifier of request information, the at least one piece of third data to a corresponding data reconstitution link (S402).