Patents by Inventor Oren Etziony

Oren Etziony has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170021656
    Abstract: Negative-working, IR-sensitive printing plates utilize a radiation-sensitive composition having a component polymerizable by a free-radical mechanism, at least part of which comprises or consists essentially of a non-particulate, aliphatic urethane acrylic oligomer that is infinitely water-dilutable but not water-soluble.
    Type: Application
    Filed: July 24, 2015
    Publication date: January 26, 2017
    Inventors: Kevin Ray, Maria T. Sypek, Travis Softic, Thuan Nguyen, Michael Karp, Oren Etziony, Geula Zegnioyev
  • Patent number: 8545997
    Abstract: A coated cutting tool has a substrate and a coating. The coating includes at least one multi-nano-layer having a nano-composite nano-layer formed of crystalline (TixAlyCrz)N and amorphous Si3N4, wherein 0.25?x?0.75, 0.25?y?0.75, 0.05?z?0.2, 0.85?x+y+z?0.97. The atomic ratio of silicon is 1?x?y?z and 1?x?z<0.75 and the thickness of the nano-composite nano-layer is from 1 nm to 100 nm.
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Iscar, Ltd.
    Inventors: Marcel Elkouby, Ram Greenwald, Oren Etziony
  • Publication number: 20110171444
    Abstract: A coated cutting tool has a substrate and a coating. The coating includes at least one multi-nano-layer having a nano-composite nano-layer formed of crystalline (TixAlyCrz)N and amorphous Si3N4, wherein 0.25?x?0.75, 0.25?y?0.75, 0.05?z?0.2, 0.85?x+y+z?0.97. The atomic ratio of silicon is 1?x?y?z and 1?x?z<0.75 and the thickness of the nano-composite nano-layer is from 1 nm to 100 nm.
    Type: Application
    Filed: January 3, 2011
    Publication date: July 14, 2011
    Applicant: Iscar, Ltd.
    Inventors: Marcel Elkouby, Ram Greenwald, Oren Etziony